GB2013722A - Plating process - Google Patents
Plating processInfo
- Publication number
- GB2013722A GB2013722A GB7900840A GB7900840A GB2013722A GB 2013722 A GB2013722 A GB 2013722A GB 7900840 A GB7900840 A GB 7900840A GB 7900840 A GB7900840 A GB 7900840A GB 2013722 A GB2013722 A GB 2013722A
- Authority
- GB
- United Kingdom
- Prior art keywords
- article
- metal
- immersing
- electrolessly
- aqueous oxidising
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
A process for plating metal on an electrically-insulating, non-metallic article e.g. of A-B-S plastics comprises the following steps in sequence with rinses as required: (i) preparing the surface of the article eg by immersion in an alkaline cleaner, then a chromic acid etch; (ii) immersing the article in a Pd/Sn activator; (iii) immersing the article in an accelerator which is an aqueous oxidising agent eg hydrogen peroxide, a peroxo complex of a transition metal ion, a perborate or a persulphate; (iv) plating metal (eg Ni/P alloy) electrolessly on the article; and (v) electroplating metal (eg Cu, Ni and Cr in succession) on the electrolessly plated metal. Aqueous oxidising agents have advantageously different characteristics to conventional accelerators.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB7900840A GB2013722A (en) | 1978-01-19 | 1979-01-10 | Plating process |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB229178 | 1978-01-19 | ||
GB7900840A GB2013722A (en) | 1978-01-19 | 1979-01-10 | Plating process |
Publications (1)
Publication Number | Publication Date |
---|---|
GB2013722A true GB2013722A (en) | 1979-08-15 |
Family
ID=26237425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB7900840A Withdrawn GB2013722A (en) | 1978-01-19 | 1979-01-10 | Plating process |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2013722A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3248000A1 (en) * | 1981-12-30 | 1983-07-07 | Occidental Chemical Corp., 48089 Warren, Mich. | Method for the pretreatment of plastic substrates for electroless metallisation |
GB2232168A (en) * | 1989-05-01 | 1990-12-05 | Enthone | Pretreating circuit boards for electroless coating |
US5108786A (en) * | 1989-05-01 | 1992-04-28 | Enthone-Omi, Inc. | Method of making printed circuit boards |
WO1999013696A1 (en) * | 1997-09-11 | 1999-03-18 | Atotech Deutschland Gmbh | Method for metallization of a substrate containing electric non-conductive surface areas |
EP1897974A1 (en) * | 2006-09-07 | 2008-03-12 | Enthone Inc. | Deposition of conductive polymer and metallization of non-conductive substrates |
WO2011070167A1 (en) * | 2009-12-10 | 2011-06-16 | Commissariat à l'énergie atomique et aux énergies alternatives | Method for preparing a metallized polymer substrate |
US8366901B2 (en) | 2006-09-07 | 2013-02-05 | Enthone Inc. | Deposition of conductive polymer and metallization of non-conductive substrates |
-
1979
- 1979-01-10 GB GB7900840A patent/GB2013722A/en not_active Withdrawn
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3248000A1 (en) * | 1981-12-30 | 1983-07-07 | Occidental Chemical Corp., 48089 Warren, Mich. | Method for the pretreatment of plastic substrates for electroless metallisation |
GB2232168A (en) * | 1989-05-01 | 1990-12-05 | Enthone | Pretreating circuit boards for electroless coating |
US5108786A (en) * | 1989-05-01 | 1992-04-28 | Enthone-Omi, Inc. | Method of making printed circuit boards |
GB2232168B (en) * | 1989-05-01 | 1993-06-16 | Enthone | Circuit boards |
WO1999013696A1 (en) * | 1997-09-11 | 1999-03-18 | Atotech Deutschland Gmbh | Method for metallization of a substrate containing electric non-conductive surface areas |
EP1897974A1 (en) * | 2006-09-07 | 2008-03-12 | Enthone Inc. | Deposition of conductive polymer and metallization of non-conductive substrates |
US8366901B2 (en) | 2006-09-07 | 2013-02-05 | Enthone Inc. | Deposition of conductive polymer and metallization of non-conductive substrates |
WO2011070167A1 (en) * | 2009-12-10 | 2011-06-16 | Commissariat à l'énergie atomique et aux énergies alternatives | Method for preparing a metallized polymer substrate |
FR2953861A1 (en) * | 2009-12-10 | 2011-06-17 | Commissariat Energie Atomique | PROCESS FOR PREPARING A METALLIC POLYMER SUBSTRATE |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB870060A (en) | Improvements in or relating to the plating of metallic surfaces | |
GB1386375A (en) | Nickel-plating of metals | |
US3553085A (en) | Method of preparing surfaces of plastic for electro-deposition | |
GB1183763A (en) | Metal Plated Plastics and Process Therefor. | |
GB2013722A (en) | Plating process | |
US2588734A (en) | Pretreatment of beryllium prior to coating | |
EP0190465A3 (en) | Process for electroplating amorphous alloys | |
US4082908A (en) | Gold plating process and product produced thereby | |
GB1206741A (en) | Process for electroplating polyoxymethylene resins | |
GB783807A (en) | Improvements relating to the electroplating of molybdenum, tungsten and alloys thereof | |
ES8206671A1 (en) | Hardened gold plating process | |
GB1292006A (en) | Improvements in or relating to the electroplating of wire | |
EP0030305A1 (en) | Chemical pretreatment for method for the electrolytical metal coating of magnesium articles | |
US2801960A (en) | Gold plating process | |
GB1473763A (en) | Electroless plating process | |
JPS5741389A (en) | Cathode for electrolyzing aqueous alkali metal halide and its manufacture | |
US3653947A (en) | Surface-pretreatment of non-metallic articles for chemical nickel-plating | |
GB1007252A (en) | Electroplating on aluminium and its alloys | |
ES8402368A1 (en) | Zinc-nickel electroplated article and method for producing the same. | |
ES2056748A1 (en) | Bath for the pre-treatment of light metals | |
JPS5719129A (en) | Preparation of mold for continuous casting | |
JPS6436788A (en) | Pretreatment for plating titanium material with noble metal | |
GB718573A (en) | Process for the deposition of gold or gold alloys by electroplating and bath for carrying out said process | |
GB626693A (en) | Improvements in and relating to the surface treatment of aluminium and aluminium base alloys | |
GB1087054A (en) | Tinning of alumnium |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |