US3178311A - Electroless plating process - Google Patents

Electroless plating process Download PDF

Info

Publication number
US3178311A
US3178311A US140231A US14023161A US3178311A US 3178311 A US3178311 A US 3178311A US 140231 A US140231 A US 140231A US 14023161 A US14023161 A US 14023161A US 3178311 A US3178311 A US 3178311A
Authority
US
United States
Prior art keywords
solution
grams
base member
electroless plating
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US140231A
Inventor
Cann Leopold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bunker Ramo Corp
Original Assignee
Bunker Ramo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bunker Ramo Corp filed Critical Bunker Ramo Corp
Priority to US140231A priority Critical patent/US3178311A/en
Priority to GB35895/62A priority patent/GB955781A/en
Application granted granted Critical
Publication of US3178311A publication Critical patent/US3178311A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Definitions

  • the present invention relates to plating processes, and and more particularly to a process for electroless plating of a metallic coating on a base member.
  • Electroless plating processes are well-known in the prior art and provide for the deposition by an autocatalytic chemical reaction of a metal alloy on a suitable surface.
  • salts of one or more metals to be plated are dissolved in an aqueous solution adapted to provide a reducing action, and a base member (usually of metal) is then immersed in the solution.
  • a chemical reaction consequently takes place, in which the metal salts are reduced and plated on the base member, the surface of the latter serving to catalyze the reaction.
  • Metallic phosphides are usually deposited, inasmuch as a hypophosphite is usually employed as a reducing agent.
  • Electroless plating processes thus take place in the absence of electric current, and the base members to be plated may be of nonconductive as well as of conductive material, as long as the surfaces thereof provide the necessary catalytic action. If the surface of the base member is non-active, it may be rendered active by electrodedcposition, chemical treatment or other means.
  • Electroless plating procedures usually insure a uniformity of metallic coating on all of the surfaces being plated. Such uniformity of coating can be obtained along irregular surfaces, edges of base members, and on both interior and exterior surfaces.
  • electroless plating processes have potential use in the product-ion of components for electrical and electronic devices.
  • the coatings produced should have good characteristics in respect of their hardness and adherence. Also, they must have particular electrical properties, depending upon their desired use (e.g., high conductivity).
  • Another object of the present invention is to provide an improved process for the plating of a metallic phosphide coating on a base member.
  • Another object of the invention is to provide an improved electroless plating process which can be carried out at room temperature.
  • Another object of the invention is to provide a room temperature electroless plating process which results in coatings having high conductivity coupled with good characteristics of adherence and hardness.
  • a base member such as, for example, an aluminum electrical component is immersed in a plating solution adapted to deposit on the surface thereof a metallic phosphide coating.
  • the base member should be cleaned and polished for the removal of any grease or oil on the surf-ace thereof.
  • a conventional cleansing agent may here be employed, such as, for example, trichloroethylene vapor. It may in some cases, such as when the base member is of aluminum, be desirable to etch the latter after the cleaning operation. It may also in some cases be desirable to employ convenice tional electrocleaning means and/ or electropolishing means in the cleaning of the base member.
  • a conventional activating solution such as, for example, an H or HCl solution.
  • the plating solution in which the base member is immersed contains ingredients which may provide a coating of iron phosphide; or of nickel phosphide; or of a phosphide containing nickel in combination with either iron or chromium.
  • the solution contains metallic salt material that is, plating salt adapted to provide the metal ions which will form the desired metallic coating.
  • a nickel salt or an iron salt may be employed alone; or a nickel salt may be employed in combination with an iron or a chromium salt.
  • the suitable salts which may be employed are the chloride, sulphate, acetate, citrate, iodide, bromide, formate, and hydroxide.
  • the plating solution contains sodium hypophosphite and formaldehyde.
  • Three complexing agents are also present: i.e., ammonia; a carboxylic acid or salt such as, for example, sodium citrate; and ethylenediaminetetraacetat'e (E.D.T.A.).
  • the hypophosphite in its reaction in the solution forms a by-product which provides a further reducing action.
  • the base member After the base member has been immersed in the solution, the latter is maintained by means of ammonium hydroxide at a pH substantially in the range of 9l3. The auto-catalytic reaction then proceeds at room temperature.
  • the base member acts in the nature of a cathode while immersed in the plating solution, and a metallic phos phide coating is deposited thereon.
  • the sodium hypophosphite and formaldehyde serve to reduce the metal salts.
  • the carboxylic complexing agent, the ammonia, and the E.D.T.A. provide a synergistic complexing action; i.e., serve to reinforce the complexing properties of one another. As is well-known, the complexing action prevents the precipitation of undesirable metal compounds.
  • the carboxylic compound acts in addition as a buffering agent, controlling the pH of the solution.
  • a buffering agent controlling the pH of the solution.
  • carboxylic compounds which may be employed include citric acid, tartaric acid, oxalic acid and salts thereof.
  • Agitation of the base member cathode is preferred for the obtaining of a uniform coating, especially for base members which are of unusual shape and/or have irregular surfaces, recesses, etc. Ultrasonic or other known types of agitation may be employed for this purpose.
  • the plating solution is also preferably circulated and filtrated by known means during the plating process. The process may be continued for any desired length of time, depending upon the depth of coating desired.
  • a base member of a non-active material In the case of a base member of a non-active material, conventional special processing prior to the electroless plating procedure may be required.
  • the latter should be preliminarily electroflashed; i.e., provided with a thin active metallic coating by elecitroplating, preferably in the electroless solution.
  • Deposits may also be made on glass, resin or other surfaces, which have been rendered active by conventional preliminary chemical treatment.
  • Example 1 A piece of 1100 series aluminum wire was treated with trichloroethylene vapor in order to remove any grease or oil on the surface thereof.
  • the 'wire was immersed in the trichloroethylene vapor for fifteen minutes; then heated to C., for one hour; and then again immersed in the .trichloroethylene vapor for fifteen minutes.
  • the wire was thereafter etched for about thirty seconds in a commercially available etching solution. After the electropolishing operation, the wire was washed in distilled'water, and'thereafter immersed in 20% sulphuric acid at 150 F., for three minutes.
  • the aluminum wire was immersed in an aqueous plating solution having the following concentrations of salts per 100 ml.
  • Example 2 The procedure of Example 1 was repeated, the wire, however, being immersed in a-solution containing 11.9'gr. of ferrous sulphate and no nickelous sulphate (the other ingredients being the same). As a result, a coating of iron phosphide wasobtained, which coating exhibited good characteristics in respect of hardness, adherence and conductivity.
  • Example 3 The procedure of Examples 1 and 2 was again repeated, the platingsolution here, however, having been modified so as to contain 11.9 gr. of nickelous sulphate and no ferrous sulphate. As a result, a coating of nickel phosphide was obtained, said coating having the desired abovementioned qualities in respect of hardness, adherenc and conductivity.
  • Example 4- The general procedure of Examples 1, 2 and 3 was here again followed. However, an aqueous plating solution having the following concentrations of salts per 240 ml. total volume was employed:
  • a low temperature process for the electroless plating of a metallic phosphide coating on a base member comprising the steps of immersing the base member in an aqueous solution containing, per 100 milliliters of said solution,
  • sodium hypophosphite in a concentration of about 10 grams
  • plating salt selected from the group consisting of ferrous sulfate (about 11.9 grams), a mixture of ferrous sulfate (about 8.4 grams) and nickelous sulfate about 3.5 grams), nickelous sulfate (about 11.9
  • ammonia in an amount suflicient to establish and maintain the pH of said solutionat between about 9 and about 13, maintaining said solution at said pH and at a temperature between about 20 C. and about 23 C. while maintaining said base member in said solution until said base member is coated with said phosphide.
  • ferrous sulfate is utilized as said plating salt, wherein said formaldehyde is in a concentration of about 20 milliliters per 100 milliliters of solution and wherein said solution is maintained at about pH 10 and at about 20 C.
  • nickelous sulfate is utilized as said plating salt, wherein said formaldehyde is in a concentration of about 20 milliliters per said 100 milliliters of said solution, and wherein said solution is maintained at about pH 10 and at about 20 C.

Description

United States Patent 3,178,311 ELECTROLESS PLATING PROCESS Leopold Cann, Woodland Hills, Calili, assignor, by mesne assignments, to The Bunker-Ramo Corporation, Stamford, Conn., a corporation of Delaware N0 Drawing. Filed Sept. 25 .1961, Ser. No. 140,231 5 Claims. (Cl. 117-160) The present invention relates to plating processes, and and more particularly to a process for electroless plating of a metallic coating on a base member.
Electroless plating processes are well-known in the prior art and provide for the deposition by an autocatalytic chemical reaction of a metal alloy on a suitable surface. In accordance with known electroless plating processes, salts of one or more metals to be plated are dissolved in an aqueous solution adapted to provide a reducing action, and a base member (usually of metal) is then immersed in the solution. A chemical reaction consequently takes place, in which the metal salts are reduced and plated on the base member, the surface of the latter serving to catalyze the reaction. Metallic phosphides are usually deposited, inasmuch as a hypophosphite is usually employed as a reducing agent.
The known electroless plating processes have ordinarily required the use of elevated temperatures for their operation.
Electroless plating processes thus take place in the absence of electric current, and the base members to be plated may be of nonconductive as well as of conductive material, as long as the surfaces thereof provide the necessary catalytic action. If the surface of the base member is non-active, it may be rendered active by electrodedcposition, chemical treatment or other means.
*Electroless plating procedures usually insure a uniformity of metallic coating on all of the surfaces being plated. Such uniformity of coating can be obtained along irregular surfaces, edges of base members, and on both interior and exterior surfaces.
As will be realized, electroless plating processes have potential use in the product-ion of components for electrical and electronic devices. The coatings produced should have good characteristics in respect of their hardness and adherence. Also, they must have particular electrical properties, depending upon their desired use (e.g., high conductivity).
It is therefore an object of the invention to provide an improved electroless plating process.
Another object of the present invention is to provide an improved process for the plating of a metallic phosphide coating on a base member.
Another object of the invention is to provide an improved electroless plating process which can be carried out at room temperature.
Another object of the invention is to provide a room temperature electroless plating process which results in coatings having high conductivity coupled with good characteristics of adherence and hardness.
These and other objects of the invention will become more apparent from the following description thereof.
In carrying out the process of the present invention, a base member such as, for example, an aluminum electrical component is immersed in a plating solution adapted to deposit on the surface thereof a metallic phosphide coating. As a preliminary step, however, the base member should be cleaned and polished for the removal of any grease or oil on the surf-ace thereof. A conventional cleansing agent may here be employed, such as, for example, trichloroethylene vapor. It may in some cases, such as when the base member is of aluminum, be desirable to etch the latter after the cleaning operation. It may also in some cases be desirable to employ convenice tional electrocleaning means and/ or electropolishing means in the cleaning of the base member. As a further preparatory measure, it is usually desirable to immerse the base member in a conventional activating solution, such as, for example, an H or HCl solution.
The plating solution in which the base member is immersed contains ingredients which may provide a coating of iron phosphide; or of nickel phosphide; or of a phosphide containing nickel in combination with either iron or chromium. The solution contains metallic salt material that is, plating salt adapted to provide the metal ions which will form the desired metallic coating. Thus, a nickel salt or an iron salt may be employed alone; or a nickel salt may be employed in combination with an iron or a chromium salt. Arnong the suitable salts which may be employed are the chloride, sulphate, acetate, citrate, iodide, bromide, formate, and hydroxide.
As reducing agents, the plating solution contains sodium hypophosphite and formaldehyde. Three complexing agents are also present: i.e., ammonia; a carboxylic acid or salt such as, for example, sodium citrate; and ethylenediaminetetraacetat'e (E.D.T.A.). The hypophosphite in its reaction in the solution forms a by-product which provides a further reducing action.
After the base member has been immersed in the solution, the latter is maintained by means of ammonium hydroxide at a pH substantially in the range of 9l3. The auto-catalytic reaction then proceeds at room temperature.
The base member acts in the nature of a cathode while immersed in the plating solution, and a metallic phos phide coating is deposited thereon. As indicated above, the sodium hypophosphite and formaldehyde serve to reduce the metal salts. The carboxylic complexing agent, the ammonia, and the E.D.T.A. provide a synergistic complexing action; i.e., serve to reinforce the complexing properties of one another. As is well-known, the complexing action prevents the precipitation of undesirable metal compounds.
The carboxylic compound acts in addition as a buffering agent, controlling the pH of the solution. Besides sodium citrate, other examples of carboxylic compounds which may be employed include citric acid, tartaric acid, oxalic acid and salts thereof.
Agitation of the base member cathode is preferred for the obtaining of a uniform coating, especially for base members which are of unusual shape and/or have irregular surfaces, recesses, etc. Ultrasonic or other known types of agitation may be employed for this purpose. The plating solution is also preferably circulated and filtrated by known means during the plating process. The process may be continued for any desired length of time, depending upon the depth of coating desired.
In the case of a base member of a non-active material, conventional special processing prior to the electroless plating procedure may be required. Thus, in the case of copper, the latter should be preliminarily electroflashed; i.e., provided with a thin active metallic coating by elecitroplating, preferably in the electroless solution. Deposits may also be made on glass, resin or other surfaces, which have been rendered active by conventional preliminary chemical treatment.
Example 1 A piece of 1100 series aluminum wire was treated with trichloroethylene vapor in order to remove any grease or oil on the surface thereof. The 'wire was immersed in the trichloroethylene vapor for fifteen minutes; then heated to C., for one hour; and then again immersed in the .trichloroethylene vapor for fifteen minutes. The wire was thereafter etched for about thirty seconds in a commercially available etching solution. After the electropolishing operation, the wire was washed in distilled'water, and'thereafter immersed in 20% sulphuric acid at 150 F., for three minutes.
Following the above preliminary treatment, the aluminum wire was immersed in an aqueous plating solution having the following concentrations of salts per 100 ml.
solution:
Sodium citrate (Na C H O 2H O) -gr..- 17.0 Ferrous sulphate (FeSO .7H O) gr 8.4 Nickelous sulphate ('NiSO .6H O-) gr 3.5 E.D.T.'A. gr 5.0 Sodium hypophosphite (NaH PO .H O) gr 10.0 Formaldehyde (HCHO) n1l 20.0
The procedure of Example 1 was repeated, the wire, however, being immersed in a-solution containing 11.9'gr. of ferrous sulphate and no nickelous sulphate (the other ingredients being the same). As a result, a coating of iron phosphide wasobtained, which coating exhibited good characteristics in respect of hardness, adherence and conductivity.
Example 3 The procedure of Examples 1 and 2 was again repeated, the platingsolution here, however, having been modified so as to contain 11.9 gr. of nickelous sulphate and no ferrous sulphate. As a result, a coating of nickel phosphide was obtained, said coating having the desired abovementioned qualities in respect of hardness, adherenc and conductivity.
Example 4- The general procedure of Examples 1, 2 and 3 was here again followed. However, an aqueous plating solution having the following concentrations of salts per 240 ml. total volume was employed:
Sodium citrate (Na C H O2I-I O) gr 34.0 Chromium chloride (CrCl gr .2 Nickelous chloride (NiCl gr 1.0 E.D.T.A. .'gr. 10.0 Sodium hypophosphite (NaH PO' l-l O) gr 20.0 Formaldehyde (HCHO) ml 20.0
A dark, smooth coating of relatively high resistance was obtained, rendering the wire suitable for decorative purposes or for use as an electrical heating element.
Although the invention has been described with reference to particular embodiments thereof, it will be realized that various changes and modifications may be made therein without departing from the spirit of the invention or the scope of the appended claims.
Having thus described the invention, what is claimed and desired to be secured by Letters Patent is:
l. A low temperature process for the electroless plating of a metallic phosphide coating on a base member, said process comprising the steps of immersing the base member in an aqueous solution containing, per 100 milliliters of said solution,
sodium citrate in a concentration of about 17 grams,
sodium hypophosphite in a concentration of about 10 grams,
ethylene diamine tetraacetate in a concentration of about 5 grams,
formaldehyde in a concentration of about 9-20 milliliters, plating salt selected from the group consisting of ferrous sulfate (about 11.9 grams), a mixture of ferrous sulfate (about 8.4 grams) and nickelous sulfate about 3.5 grams), nickelous sulfate (about 11.9
- grams), a mixture of nickelous chloride (about 0.5 gramland chromium chloride (about 0.1 gram), and
ammonia in an amount suflicient to establish and maintain the pH of said solutionat between about 9 and about 13, maintaining said solution at said pH and at a temperature between about 20 C. and about 23 C. while maintaining said base member in said solution until said base member is coated with said phosphide.
2. The process of claim 1 wherein said mixture of ferrous sulfate and nickelous sulfate is utilized as said plating salt, wherein said formaldehyde is in a concentration of about 20 milliliters per 100 milliliters of said solution and wherein said solution is maintained at about pH 10 and at about 20 C.
3. The process of claim 1 wherein ferrous sulfate is utilized as said plating salt, wherein said formaldehyde is in a concentration of about 20 milliliters per 100 milliliters of solution and wherein said solution is maintained at about pH 10 and at about 20 C.
4. The process of claim 1 wherein nickelous sulfate is utilized as said plating salt, wherein said formaldehyde is in a concentration of about 20 milliliters per said 100 milliliters of said solution, and wherein said solution is maintained at about pH 10 and at about 20 C.
5. The process of claim 1 wherein said mixture of chromium chloride and nickelous chloride is utilized as said plating sait, wherein said formaldehyde is in a concentration of about 9 milliliters per 100 milliliters of said 7 solution and wherein said solution is maintained at about pH 10 and at about 20 C.
References Cited by the Examiner UNITED STATES PATENTS RICHA RD D. NEVIUS, Primary Examiner.
3/62 Nixon 1171 30

Claims (1)

1. A LOW TEMPERATURE PROCESS FOR THE ELECTROLESS PLATING OF A METALLIC PHOSPHIDE COATING ON A BASE MEMBER, SAID PROCESS COMPRISING THE STEPS OF IMMERSING THE BASE MEMBER IN AN AQUEOUS SOLUTION CONTAINING, PER 100 MILLILITERS OF SAID SOLUTION, SODIUM CITRATE IN A CONCENTRATION OF ABOUT 17 GRAMS, SODIUM HYPOPHOSPHITE IN A CONCENTRATION OF ABOUT 10 GRAMS, ETHYLENE DIAMINE TETRAACETATE IN A CONECNETRATION OF ABOUT 5 GRAMS, FORMALDEHYDE IN A CONCENTRATION OF ABOUT 9-20 MILLILITERS, PLATING SALT SELECTED FROM THE GROUP CONSISTING OF FERROUS SULFATE (ABOUT 11.9 GRAMS), A MIXTURE OF FERROUS SULFATE (ABOUT 8.4 GRAMS) AND NICKELOUS SULFATE ABOUT 3.5 GRAMS), NICKELOUS SULFATE (ABOUT 11.9 GRAMS), A MIXTURE OF NICKELOUS CHLORIDE (ABOUT 0.5 GRAM) AND CHROMIUM CHLORIDE (ABOUT 0.1 GRAM), AND AMMONIA IN AN AMOUNT SUFFICIENT TO ESTABLISH AND MAINTAIN THE PH OF SAID SOLUTION AT BETWEEN ABOUT 9 AND ABOUT 13. MAINTAINING SAID SOLUTION AT SAID PH AND AT A TEMPERATURE BETWEEN ABOUT 20*C. AND BOUT 23*C. WHILE MAINTAINING SAID BASE MEMBER IN SAID SOLUTION UNTIL SAID BASE MEMBER IS COATED WITH SAID PHOSPHIDE.
US140231A 1961-09-25 1961-09-25 Electroless plating process Expired - Lifetime US3178311A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US140231A US3178311A (en) 1961-09-25 1961-09-25 Electroless plating process
GB35895/62A GB955781A (en) 1961-09-25 1962-09-20 Electroless plating process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US140231A US3178311A (en) 1961-09-25 1961-09-25 Electroless plating process

Publications (1)

Publication Number Publication Date
US3178311A true US3178311A (en) 1965-04-13

Family

ID=22490307

Family Applications (1)

Application Number Title Priority Date Filing Date
US140231A Expired - Lifetime US3178311A (en) 1961-09-25 1961-09-25 Electroless plating process

Country Status (2)

Country Link
US (1) US3178311A (en)
GB (1) GB955781A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3264199A (en) * 1962-06-25 1966-08-02 Ford Motor Co Electroless plating of metals
US3303111A (en) * 1963-08-12 1967-02-07 Arthur L Peach Electro-electroless plating method
US3305327A (en) * 1965-01-26 1967-02-21 Ibm Electroless plating of magnetic material and magnetic memory element
US3350210A (en) * 1966-01-14 1967-10-31 Ibm Electroless plating of magnetic material
US3372037A (en) * 1965-06-30 1968-03-05 Ibm Magnetic materials
US3385725A (en) * 1964-03-23 1968-05-28 Ibm Nickel-iron-phosphorus alloy coatings formed by electroless deposition
US3479229A (en) * 1966-02-18 1969-11-18 Huettenwerk Oberhausen Ag Structural steel members and method of making same
US3485725A (en) * 1965-10-08 1969-12-23 Ibm Method of increasing the deposition rate of electroless solutions
US3485597A (en) * 1964-10-30 1969-12-23 Us Army Electroless deposition of nickel-phosphorus based alloys
US3513020A (en) * 1964-10-12 1970-05-19 Leesona Corp Method of impregnating membranes
US4028116A (en) * 1972-12-01 1977-06-07 Cedarleaf Curtis E Solution for electroless chrome alloy plating
US4746412A (en) * 1986-07-03 1988-05-24 C. Uyemura & Co., Ltd. Iron-phosphorus electroplating bath and electroplating method using same
US5269838A (en) * 1992-04-20 1993-12-14 Dipsol Chemicals Co., Ltd. Electroless plating solution and plating method with it
CN112026272A (en) * 2020-08-17 2020-12-04 浙江工业大学 Novel wave-absorbing material with honeycomb structure and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2827399A (en) * 1956-03-28 1958-03-18 Sylvania Electric Prod Electroless deposition of iron alloys
US2827398A (en) * 1956-01-26 1958-03-18 Sylvania Electric Prod Electroless iron plating
US2965551A (en) * 1956-08-08 1960-12-20 Pechiney Prod Chimiques Sa Metal plating process
US3024134A (en) * 1953-07-24 1962-03-06 Gen Motors Corp Nickel chemical reduction plating bath and method of using same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3024134A (en) * 1953-07-24 1962-03-06 Gen Motors Corp Nickel chemical reduction plating bath and method of using same
US2827398A (en) * 1956-01-26 1958-03-18 Sylvania Electric Prod Electroless iron plating
US2827399A (en) * 1956-03-28 1958-03-18 Sylvania Electric Prod Electroless deposition of iron alloys
US2965551A (en) * 1956-08-08 1960-12-20 Pechiney Prod Chimiques Sa Metal plating process

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3264199A (en) * 1962-06-25 1966-08-02 Ford Motor Co Electroless plating of metals
US3303111A (en) * 1963-08-12 1967-02-07 Arthur L Peach Electro-electroless plating method
US3385725A (en) * 1964-03-23 1968-05-28 Ibm Nickel-iron-phosphorus alloy coatings formed by electroless deposition
US3513020A (en) * 1964-10-12 1970-05-19 Leesona Corp Method of impregnating membranes
US3485597A (en) * 1964-10-30 1969-12-23 Us Army Electroless deposition of nickel-phosphorus based alloys
US3305327A (en) * 1965-01-26 1967-02-21 Ibm Electroless plating of magnetic material and magnetic memory element
US3372037A (en) * 1965-06-30 1968-03-05 Ibm Magnetic materials
US3485725A (en) * 1965-10-08 1969-12-23 Ibm Method of increasing the deposition rate of electroless solutions
US3350210A (en) * 1966-01-14 1967-10-31 Ibm Electroless plating of magnetic material
US3479229A (en) * 1966-02-18 1969-11-18 Huettenwerk Oberhausen Ag Structural steel members and method of making same
US4028116A (en) * 1972-12-01 1977-06-07 Cedarleaf Curtis E Solution for electroless chrome alloy plating
US4746412A (en) * 1986-07-03 1988-05-24 C. Uyemura & Co., Ltd. Iron-phosphorus electroplating bath and electroplating method using same
US5269838A (en) * 1992-04-20 1993-12-14 Dipsol Chemicals Co., Ltd. Electroless plating solution and plating method with it
CN112026272A (en) * 2020-08-17 2020-12-04 浙江工业大学 Novel wave-absorbing material with honeycomb structure and preparation method thereof

Also Published As

Publication number Publication date
GB955781A (en) 1964-04-22

Similar Documents

Publication Publication Date Title
US3532518A (en) Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions
US4814205A (en) Process for rejuvenation electroless nickel solution
US2983634A (en) Chemical nickel plating of magnesium and its alloys
US3178311A (en) Electroless plating process
US3119709A (en) Material and method for electroless deposition of metal
US3437507A (en) Plating of substrates
US4374876A (en) Process for the immersion deposition of gold
US3589916A (en) Autocatalytic gold plating solutions
Barker Electroless deposition of metals
US3033703A (en) Electroless plating of copper
US3672938A (en) Novel precious metal sensitizing solutions
US3438798A (en) Electroless plating process
US4008343A (en) Process for electroless plating using colloid sensitization and acid rinse
US3597266A (en) Electroless nickel plating
US2935425A (en) Chemical nickel plating processes and baths therefor
JPH06128757A (en) Zincate solution improved to process aluminum and aluminum alloy and its processing method
US3726771A (en) Process for chemical nickel plating of aluminum and its alloys
US3698919A (en) Preparation of plastic substrates for electroless plating and solutions therefor
US3485725A (en) Method of increasing the deposition rate of electroless solutions
US3024134A (en) Nickel chemical reduction plating bath and method of using same
US3853590A (en) Electroless plating solution and process
US3790400A (en) Preparation of plastic substrates for electroless plating and solutions therefor
US3046159A (en) Method of copper plating by chemical reduction
US3148072A (en) Electroless deposition of nickel
US3423226A (en) Plating of non-metallic bodies