GB1315548A - Stabilized nickel plating compositions - Google Patents

Stabilized nickel plating compositions

Info

Publication number
GB1315548A
GB1315548A GB2464570A GB2464570A GB1315548A GB 1315548 A GB1315548 A GB 1315548A GB 2464570 A GB2464570 A GB 2464570A GB 2464570 A GB2464570 A GB 2464570A GB 1315548 A GB1315548 A GB 1315548A
Authority
GB
United Kingdom
Prior art keywords
concentration
nickel plating
selenium
minus
reducing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2464570A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19691926100 external-priority patent/DE1926100C3/en
Application filed by Schering AG filed Critical Schering AG
Publication of GB1315548A publication Critical patent/GB1315548A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

1315548 Electroless nickel plating baths SCHERING AG 21 May 1970 [22 May 1969] 24645/70 Heading C7F An electroless, aqueous, nickel plating bath comprises a nickel salt, e.g. chloride, sulphate or acetate, a reducing agent, a complex former and a selenium compound in which the selenium has an oxidation degree of "minus 1" or "minus 2". The specification discibes many selenium compounds and they maybe used in a concentration of 0À0001 to 0À3g/l. The reducing agent may be sodium hypophosphite, hydrazine, aborozane or sodium borohydride in a concentration from 0À01 to 0À5 mole/l. The concentration of the nickel salt may be 0À01 to 0À5 moles /1. Salts of other metals, e.g. Co, may be included in the bath. The substrate may be a metal or synthetic resin, first contacted with chromic-sulphuric acid mixture and then tin and palladium chlorides. The complex former may be lactic acid, glycine, sodium acetate, trisodium citrate, or triethanolamine.
GB2464570A 1969-05-22 1970-05-21 Stabilized nickel plating compositions Expired GB1315548A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691926100 DE1926100C3 (en) 1969-05-22 Stabilized reductive nickel bath

Publications (1)

Publication Number Publication Date
GB1315548A true GB1315548A (en) 1973-05-02

Family

ID=5734868

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2464570A Expired GB1315548A (en) 1969-05-22 1970-05-21 Stabilized nickel plating compositions

Country Status (10)

Country Link
US (1) US3661596A (en)
JP (1) JPS4943172B1 (en)
AT (1) AT293132B (en)
CH (1) CH533172A (en)
ES (1) ES379897A1 (en)
FR (1) FR2048610A5 (en)
GB (1) GB1315548A (en)
IE (1) IE34219B1 (en)
NL (1) NL165508C (en)
SE (1) SE356764B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3889017A (en) * 1971-02-02 1975-06-10 Ppg Industries Inc Chemical filming solution and process for plating therewith
US3915717A (en) * 1973-11-12 1975-10-28 Rca Corp Stabilized autocatalytic metal deposition baths
US4189324A (en) * 1978-06-02 1980-02-19 Michael Gulla Stabilized electroless plating solutions
JPS5658321U (en) * 1979-10-09 1981-05-19
US5300330A (en) * 1981-04-01 1994-04-05 Surface Technology, Inc. Stabilized composite electroless plating compositions
US5145517A (en) * 1981-04-01 1992-09-08 Surface Technology, Inc. Composite electroless plating-solutions, processes, and articles thereof
EP0063946A1 (en) * 1981-04-21 1982-11-03 AMERSHAM INTERNATIONAL plc Diagnosis of kidney function
US20110192316A1 (en) * 2010-02-05 2011-08-11 E-Chem Enterprise Corp. Electroless plating solution for providing solar cell electrode
CN106176721B (en) * 2016-07-14 2021-04-30 深圳福山生物科技有限公司 Cancer prevention and treatment use of organic selenium compound
CN106146372B (en) * 2016-07-14 2019-05-14 深圳福山生物科技有限公司 For preventing and treating the organic selenium compounds of cancer
TW201816183A (en) * 2016-10-14 2018-05-01 日商上村工業股份有限公司 Electroless nickel plating bath which can inhibit the nickel leakage plating and the outside of pattern deposition

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762723A (en) * 1953-06-03 1956-09-11 Gen American Transporation Cor Processes of chemical nickel plating and baths therefor
US2929742A (en) * 1957-03-05 1960-03-22 Minjer Clara Hinderina De Electroless deposition of nickel
DE1243493B (en) * 1961-02-04 1967-06-29 Bayer Ag Aqueous bath for chemical deposition of boron-containing metal coatings
US3492135A (en) * 1967-02-01 1970-01-27 Schering Ag Stabilized bath for deposition of copper by chemical reduction

Also Published As

Publication number Publication date
NL7007482A (en) 1970-11-24
IE34219L (en) 1970-11-22
SE356764B (en) 1973-06-04
AT293132B (en) 1971-09-27
US3661596A (en) 1972-05-09
NL165508C (en) 1981-04-15
FR2048610A5 (en) 1971-03-19
IE34219B1 (en) 1975-03-05
JPS4943172B1 (en) 1974-11-19
ES379897A1 (en) 1972-09-01
NL165508B (en) 1980-11-17
DE1926100B2 (en) 1977-04-28
DE1926100A1 (en) 1970-12-03
CH533172A (en) 1973-01-31
SU381231A3 (en) 1973-05-15

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee