GB1318247A - Metallisation of shaped plastics articles - Google Patents
Metallisation of shaped plastics articlesInfo
- Publication number
- GB1318247A GB1318247A GB4186070A GB4186070A GB1318247A GB 1318247 A GB1318247 A GB 1318247A GB 4186070 A GB4186070 A GB 4186070A GB 4186070 A GB4186070 A GB 4186070A GB 1318247 A GB1318247 A GB 1318247A
- Authority
- GB
- United Kingdom
- Prior art keywords
- sensitizing
- bath
- hcl
- compound
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
1318247 Sensitizing and plating plastics; electro-plating DYNAMIT NOBEL AG 1 Sept 1970 [1 Sept 1969] 41860/70 Headings C7B and C7F Thermoplastic plastics material is sensitized by immersion in a sensitizing bath comprising an acid solution of trivalent As or Sb, activated, plated by chemical reduction and thereafter electroplated. The sensitizing bath may be a solution in HCl, H 2 SO 4 or HNO 3 , of a halide, sulphate, nitrate oxychloride, oxynitrate, carbonate or oxide of As or Sb, and is preferably As 2 O 3 and/or Sb 2 O 3 in HCl. The bath preferably contains a hydrolysable tetravalent Sn compound, e.g. Sn Cl 4 , as a wetting agent, and also a soluble halide or nitrate of NH 4 , an alkali metal and/or an alkaline earth metal as a stabilizer. Preferred amounts are 0À5-40g/l of As or Sb compound (calculated as oxide), 2-200g/l of Sn compound (as SnCl 4 ) and 10-300 g/l stabilizer; the bath is used at room temperature. The substrate may be a polymer or co-polymer of vinyl chloride, chlorinated polyethylene, a polyolefin, polyester, ABS, a filled polypropylene, polysulphone, polyacetal, polyamide or a mixture thereof, and may be pickled in chromosulphuric acid prior to sensitizing in the above bath. After sensitizing, activation is in a Pd salt solution, e.g. PdCl 2 or PdSO 4 in HCl or H 2 SO 4 at pH 1-3; this is followed by electroless plating with Cu or Ni, in turn followed by electroplating with one or more of Ag, Cu, Au, Ni or Cr. The plastics may be mounted in a holder which can serve as an electrode for electro-deposition, and carried through the whole process in that holder, which is not itself plated, and which may later be washed with oxidizing acid, e.g. chromosulphuric or HNO 3 , for re-use.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19691944314 DE1944314A1 (en) | 1969-09-01 | 1969-09-01 | Process for the metallization of plastics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1318247A true GB1318247A (en) | 1973-05-23 |
Family
ID=5744307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4186070A Expired GB1318247A (en) | 1969-09-01 | 1970-09-01 | Metallisation of shaped plastics articles |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US3764488A (en) |
| JP (1) | JPS4817385B1 (en) |
| AT (1) | AT305722B (en) |
| BE (1) | BE755520A (en) |
| CA (1) | CA973308A (en) |
| CH (1) | CH556392A (en) |
| DE (1) | DE1944314A1 (en) |
| FR (1) | FR2060341B1 (en) |
| GB (1) | GB1318247A (en) |
| NL (1) | NL7012928A (en) |
| NO (1) | NO129754B (en) |
| SE (1) | SE369203B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2164954A (en) * | 1983-09-28 | 1986-04-03 | Rohm & Haas | Conducting or catalysing a chemical reaction on a surface especially electroless metal deposition and catalyst systems used therein |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2122456B1 (en) * | 1971-01-20 | 1976-07-23 | Hoechst Ag | |
| US3904792A (en) * | 1972-02-09 | 1975-09-09 | Shipley Co | Catalyst solution for electroless metal deposition on a substrate |
| US3982054A (en) * | 1972-02-14 | 1976-09-21 | Rca Corporation | Method for electrolessly depositing metals using improved sensitizer composition |
| US3956528A (en) * | 1974-11-15 | 1976-05-11 | Minnesota Mining And Manufacturing Company | Selective plating by galvanic action |
| US4770751A (en) * | 1986-12-30 | 1988-09-13 | Okuno Chemical Industry Co., Ltd. | Method for forming on a nonconductor a shielding layer against electromagnetic radiation |
| CN105401149B (en) * | 2015-11-13 | 2018-08-07 | 北京卫星制造厂 | A kind of preparation method of copper diamond composite gold tin welding coating |
-
0
- BE BE755520D patent/BE755520A/en unknown
-
1969
- 1969-09-01 DE DE19691944314 patent/DE1944314A1/en active Pending
-
1970
- 1970-08-26 CH CH1278770A patent/CH556392A/en not_active IP Right Cessation
- 1970-08-28 US US3764488D patent/US3764488A/en not_active Expired - Lifetime
- 1970-08-31 NO NO03306/70A patent/NO129754B/no unknown
- 1970-08-31 CA CA092,039A patent/CA973308A/en not_active Expired
- 1970-08-31 FR FR7031676A patent/FR2060341B1/fr not_active Expired
- 1970-08-31 SE SE1181170A patent/SE369203B/xx unknown
- 1970-09-01 NL NL7012928A patent/NL7012928A/xx unknown
- 1970-09-01 AT AT791570A patent/AT305722B/en not_active IP Right Cessation
- 1970-09-01 JP JP7663070A patent/JPS4817385B1/ja active Pending
- 1970-09-01 GB GB4186070A patent/GB1318247A/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2164954A (en) * | 1983-09-28 | 1986-04-03 | Rohm & Haas | Conducting or catalysing a chemical reaction on a surface especially electroless metal deposition and catalyst systems used therein |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2060341A1 (en) | 1971-06-18 |
| CH556392A (en) | 1974-11-29 |
| US3764488A (en) | 1973-10-09 |
| AT305722B (en) | 1973-03-12 |
| DE1944314A1 (en) | 1971-03-11 |
| NL7012928A (en) | 1971-03-03 |
| BE755520A (en) | 1971-02-01 |
| JPS4817385B1 (en) | 1973-05-29 |
| CA973308A (en) | 1975-08-26 |
| SE369203B (en) | 1974-08-12 |
| FR2060341B1 (en) | 1974-09-20 |
| NO129754B (en) | 1974-05-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |