NO129754B - - Google Patents
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- Publication number
- NO129754B NO129754B NO03306/70A NO330670A NO129754B NO 129754 B NO129754 B NO 129754B NO 03306/70 A NO03306/70 A NO 03306/70A NO 330670 A NO330670 A NO 330670A NO 129754 B NO129754 B NO 129754B
- Authority
- NO
- Norway
- Prior art keywords
- liter
- weight
- compounds
- ammonium
- sensitization
- Prior art date
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- 238000000034 method Methods 0.000 claims description 24
- 229920003023 plastic Polymers 0.000 claims description 18
- 239000004033 plastic Substances 0.000 claims description 18
- 229910052785 arsenic Inorganic materials 0.000 claims description 15
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 15
- 239000000243 solution Substances 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 11
- 238000001465 metallisation Methods 0.000 claims description 11
- 206010070834 Sensitisation Diseases 0.000 claims description 10
- 230000008313 sensitization Effects 0.000 claims description 10
- 230000001235 sensitizing effect Effects 0.000 claims description 10
- 230000004913 activation Effects 0.000 claims description 9
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 8
- 150000002823 nitrates Chemical class 0.000 claims description 7
- 150000004820 halides Chemical class 0.000 claims description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 5
- 239000003929 acidic solution Substances 0.000 claims description 5
- 229910052783 alkali metal Inorganic materials 0.000 claims description 5
- 150000001340 alkali metals Chemical class 0.000 claims description 5
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 5
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 5
- 238000005554 pickling Methods 0.000 claims description 5
- 235000019270 ammonium chloride Nutrition 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000005728 strengthening Methods 0.000 claims description 3
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 claims description 2
- LULLIKNODDLMDQ-UHFFFAOYSA-N arsenic(3+) Chemical compound [As+3] LULLIKNODDLMDQ-UHFFFAOYSA-N 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- GOLCXWYRSKYTSP-UHFFFAOYSA-N Arsenious Acid Chemical compound O1[As]2O[As]1O2 GOLCXWYRSKYTSP-UHFFFAOYSA-N 0.000 claims 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 20
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 18
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 18
- -1 polypropylene Polymers 0.000 description 17
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 229910052759 nickel Inorganic materials 0.000 description 11
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000004743 Polypropylene Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 229920001155 polypropylene Polymers 0.000 description 9
- 239000000203 mixture Substances 0.000 description 8
- 238000012552 review Methods 0.000 description 8
- 239000012266 salt solution Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 229920000915 polyvinyl chloride Polymers 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000004800 polyvinyl chloride Substances 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 5
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 5
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 5
- 229910002666 PdCl2 Inorganic materials 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 150000002940 palladium Chemical class 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000004801 Chlorinated PVC Substances 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000004709 Chlorinated polyethylene Substances 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Natural products OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- JZULKTSSLJNBQJ-UHFFFAOYSA-N chromium;sulfuric acid Chemical compound [Cr].OS(O)(=O)=O JZULKTSSLJNBQJ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000029142 excretion Effects 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229920000578 graft copolymer Polymers 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- LAYAKLSFVAPMEL-UHFFFAOYSA-N 1-ethenoxydodecane Chemical compound CCCCCCCCCCCCOC=C LAYAKLSFVAPMEL-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 241001576000 Ero Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 229920000457 chlorinated polyvinyl chloride Polymers 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- NXQIBFMKDQPBGW-QNEJGDQOSA-N dihexadecyl (e)-but-2-enedioate Chemical compound CCCCCCCCCCCCCCCCOC(=O)\C=C\C(=O)OCCCCCCCCCCCCCCCC NXQIBFMKDQPBGW-QNEJGDQOSA-N 0.000 description 1
- NXQIBFMKDQPBGW-MVJHLKBCSA-N dihexadecyl (z)-but-2-enedioate Chemical compound CCCCCCCCCCCCCCCCOC(=O)\C=C/C(=O)OCCCCCCCCCCCCCCCC NXQIBFMKDQPBGW-MVJHLKBCSA-N 0.000 description 1
- XHSDDKAGJYJAQM-KXYMVQBMSA-N dioctadecyl (z)-but-2-enedioate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)\C=C/C(=O)OCCCCCCCCCCCCCCCCCC XHSDDKAGJYJAQM-KXYMVQBMSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N itaconic acid Chemical class OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000028327 secretion Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000001117 sulphuric acid Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Description
Fremgangsmåte til kjemo-galvanisk metallisering Method of chemo-galvanic metallization
av plast, samt sensibiliseringsoppløsning til of plastic, as well as sensitizing solution to
bruk ved gjennomføring av fremgangsmåten. use when carrying out the procedure.
Det er kjent å utstyre plast med fastklebende metallovertrekk, idet man på de forbehandlede plastoverflater på kjemisk måte påfører et tynt metallisk ledersjikt av kopper eller nikkel og deretter forsterker dette på galvanisk måte med nikkel, kopper, krom, sølv,'gull eller eventuelt med flere av disse metaller. It is known to equip plastic with an adhesive metal coating, whereby a thin metallic conductive layer of copper or nickel is chemically applied to the pre-treated plastic surfaces and then this is galvanically reinforced with nickel, copper, chrome, silver, gold or possibly with more of these metals.
(Sml. K. Wiebusch og medarbeidere, Kunststoffe _5_6 , ( 1966 ), 773). Det er videre kjent at AES-plaststoffer (podningscopolymerisater av akrylnitril, butadien og styrol) lar seg metallisere under anvendelse av den såkalte gjennomgangsprosess (sml. K. Heymann og medarbeidere, Galvanotechnik 5_9 , ( 196 8 ), 6 52-658 , W. Metzger u.a., Galvanotechnik 5_8 ( 196 7 ), 720-72 2 ) uten at det samtidig foregår (Comp. K. Wiebusch and co-workers, Kunststoffe _5_6 , ( 1966 ), 773). It is also known that AES plastics (grafting copolymers of acrylonitrile, butadiene and styrene) can be metallized using the so-called review process (cf. K. Heymann et al., Galvanotechnik 5_9 , ( 196 8 ), 6 52-658 , W. Metzger u.a., Galvanotechnik 5_8 ( 196 7 ), 720-72 2 ) without it simultaneously taking place
metalldekning av isoleringen av de elektroder som samtidig tjener som holdere for de ABS-deler som skal metalliseres. Derved over-flødiggjøres en omstikning av delene etter den kjemiske metallisering, for det annet oppnår man en metallbesparelse da metall-utskillelsen bare foregår på kunststoffet som skal metalliseres. metal covering of the insulation of the electrodes which also serve as holders for the ABS parts to be metallized. Thereby, a re-stitching of the parts after the chemical metallization is superfluidized, secondly, a metal saving is achieved as the metal separation only takes place on the plastic that is to be metallized.
Gjennomgangsprinsippet er følgelig en kjemogalvanisk metalliseringsfremgangsmåte, hvor delene som skal metalliseres ved de kjemiske metalliseringsprosesser og de galvaniske forsterknings-prosesser forblir oppstukket på alltid samme holderelektrode.r, således at alle fremgangsmåtetrinn utføres uten avbrudd i rekkefølge uten omstikning av delene som skal metalliseres, resp. uten ut-veksling av holderelektrodene. The review principle is consequently a chemogalvanic metallization method, where the parts to be metallized by the chemical metallization processes and the galvanic strengthening processes remain mounted on always the same holding electrode, so that all process steps are carried out without interruption in order without re-stitching the parts to be metallized, resp. without exchanging the holder electrodes.
Den hittil kjente gjennomgangsprosess omfatter følgende trinn: 1. Beising av ABS-delene i kromsvovelsyre med overveiende høyt kromsyreinnhold (inntil 300 g CrOg/1) ved 50-70°C. The previously known review process includes the following steps: 1. Pickling the ABS parts in chromic sulfuric acid with a predominantly high chromic acid content (up to 300 g CrOg/1) at 50-70°C.
2. Aktivering i sterkt sur palladiumsaltoppløsning ved 55-65°C. 2. Activation in strongly acidic palladium salt solution at 55-65°C.
3. Neddypning av de aktiverte deler i en reduksjonsoppløsning under overholdelse av bestemte pH-betingelser. 4. Kjemisk utskillelse av et metallisk ledersjikt, bestående av f.eks. nikkel og/eller kopper. 5. Galvanisk forsterkning ved hjelp av nikkel, kopper, krom, sølv, gull eller eventuelt ved flere av disse metaller. 3. Immersion of the activated parts in a reducing solution under certain pH conditions. 4. Chemical separation of a metallic conductor layer, consisting of e.g. nickel and/or copper. 5. Galvanic reinforcement using nickel, copper, chrome, silver, gold or possibly several of these metals.
De hittil kjente fremgangsmåter for gjennomgangs-prosesser har imidlertid noen ulemper. Deres anvendelse er f.eks. begrenset til bare ABS-plaststoffer. En metallisering av i og for seg metalliserbare polyvinylklorid-typer eller metalliserbare polypropylentyper er ikke mulig etter de kjente gjennomgangs-prosesser. However, the hitherto known methods for review processes have some disadvantages. Their application is e.g. limited to ABS plastics only. A metallization of in and of itself metallizable polyvinyl chloride types or metallizable polypropylene types is not possible according to the known review processes.
Dessuten krever sammensetningen av aktiveringsbadet (2) for en optimal aktivering av neddyppede deler at det arbeides ved forhøyet badtemperatur, nemlig et snevert temperaturområde på 55-65°C. Derved opptrer det ofte et palladiumtap ved uønsket utskillelse av metallisk palladium, hvilket i praksis nødvendiggjør en stadig overvåkning av aktiveringsbadet. In addition, the composition of the activation bath (2) for optimal activation of submerged parts requires that work is carried out at an elevated bath temperature, namely a narrow temperature range of 55-65°C. Thereby, palladium loss often occurs due to unwanted excretion of metallic palladium, which in practice necessitates constant monitoring of the activation bath.
Oppfinnelsen vedrører altså en fremgangsmåte til kjemo-galvanisk metallisering av plast ved beising, sensibilisering og aktivering av plastoverflaten og etterfølgende utskillelse av et metallisk ledesjikt og galvanisk forsterkning av dette, idet fremgangsmåten er karakterisert ved at sensibiliseringen gjennom-føres ved hjelp av vandige sure oppløsninger av forbindelser av treverdig arsen i mengder fra 0,5 til 40 g pr. liter, fortrinnsvis i ytterligere nærvær av hydrolyserbare tinn-IV-forbindelser samt eventuelt oppløselige halogenider eller nitrater av ammonium og/eller av alkalimetaller og/eller- av jordalkalimetaller. The invention therefore relates to a method for chemo-galvanic metallization of plastic by pickling, sensitization and activation of the plastic surface and subsequent deposition of a metallic conductive layer and galvanic strengthening of this, the method being characterized in that the sensitization is carried out using aqueous acidic solutions of compounds of trivalent arsenic in amounts from 0.5 to 40 g per litres, preferably in the additional presence of hydrolyzable tin-IV compounds as well as possibly soluble halides or nitrates of ammonium and/or of alkali metals and/or of alkaline earth metals.
Foretrukket er saltsure, svovelsure eller salpetersure oppløsninger av halogenidene, sulfatene, nitratene, oksykloridene, oksynitratene, karbonatene og oksydene av arsen eller antimon, spesielt arsen-III-oksyd resp. As Clg i saltsur oppløsning. Preferred are hydrochloric acid, sulfuric acid or nitric acid solutions of the halides, sulphates, nitrates, oxychlorides, oxynitrates, carbonates and oxides of arsenic or antimony, especially arsenic III-oxide resp. As Clg in hydrochloric acid solution.
Sensibiliseringen gjennomføres fortrinnsvis i nærvær Sensitization is preferably carried out in person
av som fuktemiddel virkende hydrolyserbare tinn-IV-forbindelser, spesielt SnClt+, og av som stabilisatorer virkende oppløselige halogenider eller nitrater av ammonium- og/eller av alkalimetallene (litium, natrium eller kalium) og/eller jordalkalimetallene (magnesium eller kalsium). of hydrolyzable tin-IV compounds acting as wetting agents, especially SnClt+, and of soluble halides or nitrates of ammonium and/or of the alkali metals (lithium, sodium or potassium) and/or the alkaline earth metals (magnesium or calcium) acting as stabilizers.
Virkningen av stabiliseringen ifølge oppfinnelsen muliggjør som beisebad å anvende fortynnet kromsvovelsyre (5-10 g CrOg/liter, 50-65 vektprosentig svovelsyre) og en reak-sjonstemperatur på 50-70°C. The effect of the stabilization according to the invention makes it possible to use diluted chromium sulfuric acid (5-10 g CrOg/litre, 50-65 weight percent sulfuric acid) and a reaction temperature of 50-70°C as a pickling bath.
Videre muliggjør fremgangsmåten igjen å utføre det reduktive sensibiliseringstrinn som ved vanlige fremgangsmåter, før aktiveringstrinnet. Furthermore, the method again makes it possible to carry out the reductive sensitization step as in conventional methods, before the activation step.
Som aktiveringsbad kan det anvendes en fortynnet, vandig, sterkt sur palladiumsaltoppløsning, spesielt fortynnet saltsur eller svovelsur PdClj-oppløsning eller PdSO^-oppløsning i pH-området mellom 1 og 3, eksempelvis med innhold på 0,2-5 g PdC^ As an activation bath, a diluted, aqueous, strongly acidic palladium salt solution can be used, especially dilute hydrochloric acid or sulfuric acid PdClj solution or PdSO^ solution in the pH range between 1 and 3, for example with a content of 0.2-5 g PdC^
i 5-20 ml konsentrert HCl/liter. in 5-20 ml concentrated HCl/litre.
Ifølge fremgangsmåten skal reaksjonstrinnet utføres According to the method, the reaction step is to be carried out
i den nedenfor oppførte rekkefølge: in the order listed below:
a) Beising i kromsvovelsyre. a) Pickling in chrome sulfuric acid.
b) Sensibilisering med sure, vandige oppløsninger av arsen-III-forbindelser, spesielt arsenikk, som dessuten kan inneholde hydrolyserbare tinn-IV-forbindelser samt alkali-, jordalkali-og/eller ammoniumhalogenider og/eller -nitrater, spesielt ammoniumklorid. c) Aktivering i fortynnet palladiumsaltoppløsnihg, spesielt i saltsur eller svovelsur palladiumklorid-oppløsning. d) Kjemisk utskillelse av et metallisk ledersjikt, av f.eks. nikkel og/eller kopper fra nikkel- eller kopperbad. e) Galvanisk forsterkning ved hjelp av nikkel, kopper, krom, sølv, gull eller ved flere av disse metaller. Overraskende finner b) Sensitization with acidic, aqueous solutions of arsenic III compounds, especially arsenic, which may also contain hydrolyzable tin IV compounds as well as alkali, alkaline earth and/or ammonium halides and/or nitrates, especially ammonium chloride. c) Activation in dilute palladium salt solution, especially in hydrochloric acid or sulfuric acid palladium chloride solution. d) Chemical separation of a metallic conductor layer, of e.g. nickel and/or copper from a nickel or copper bath. e) Galvanic reinforcement using nickel, copper, chrome, silver, gold or several of these metals. Surprising finds
det da ikke sted noen metallisering av bestikkelektrodene. Under den samlede prosess forblir gjenstandene som skal metalliseres på de som elektroder utformede holdere. Etter hver gjennomgangsprosess dyppes holderelektrodene kort tid i en oksyderende syre, f.eks. kromsvovelsyre, salpetersyre etc, then no metallization of the cutlery electrodes takes place. During the overall process, the objects to be metallized remain on the holders designed as electrodes. After each review process, the holder electrodes are dipped for a short time in an oxidizing acid, e.g. chromosulfuric acid, nitric acid etc,
og de er igjen anvendbare. and they are again applicable.
Denne fremgangsmåte er av spesiell verdi ved metallisering av metalliserbare polyvinylklorid-typer og ved metalli-seringsfremgangsmåter hvor det skal utskilles reduktivt et ledersjikt av nikkelsaltoppløsninger, idet holderelektrodene forblir metallfrie. This method is of particular value in the metallization of metallizable polyvinyl chloride types and in metallization processes where a conductive layer of nickel salt solutions is to be reductively deposited, the holder electrodes remaining metal-free.
Som metalliserbare polyvinylklorid-typer anvendes eksempelvis copolymerisater av vinylklorid med 4-20 vektprosent fumarsyrediestere og/eller maleinsyrediestere eller copolymerisater av vinylklorid med langkjedede alkylrestholdige innpolymeriserbare comonomere, som vinylestere fortrinnsvis av langkjedede karbon-syrer med den generelle formel Cti^ = CH - 00C - R, vinyletere av formel CHj = CH-O-R, itakonsyreestere, fumarsyreestere, akrylsyre-estere, metakrylsyreestere eller allylestere, fortrinnsvis av langkjedede karboksylsyrer. As metallizable polyvinyl chloride types, copolymers of vinyl chloride with 4-20 percent by weight fumaric acid diesters and/or maleic acid diesters or copolymers of vinyl chloride with long-chain alkyl residue-containing polymerizable comonomers are used, for example, as vinyl esters preferably of long-chain carboxylic acids with the general formula Cti^ = CH - 00C - R , vinyl ethers of the formula CHj = CH-O-R, itaconic acid esters, fumaric acid esters, acrylic acid esters, methacrylic acid esters or allyl esters, preferably of long-chain carboxylic acids.
Videre er egnet klorerte polyetylener, blandinger av klorert polyetylen og polyvinylklorid, blandinger av polyetylen og klorert polyvinylklorid,, copolymerisater av vinylklorid med etylen samt podningspolymerisater av vinylklorid på vinylklorid-copolymerisater, videre polyolefiner, som polypropylen eller poly-4-metylpenten-(1), polyestere og lignende. Also suitable are chlorinated polyethylenes, mixtures of chlorinated polyethylene and polyvinyl chloride, mixtures of polyethylene and chlorinated polyvinyl chloride, copolymers of vinyl chloride with ethylene as well as graft polymers of vinyl chloride on vinyl chloride copolymers, further polyolefins, such as polypropylene or poly-4-methylpentene-(1) , polyesters and the like.
Oppfinnelsen er imidlertid ikke begrenset til de nevnte plaststoffer, men gjennomførbar generelt med klebefaste metalliserbare plaststoffer som ABS-polymerisater, nemlig blandings- og podningspolymerisater av akrylnitril, butadien og styrol, vanligvis med innhold på 10-30 vektprosent akrylnitril, 50-70 vektprosent styrol og 8-25 vektprosent butadien, metalliserbare polypropylentyper, eksempelvis bestående av isotaktisk polypropylen med relativt høye innhold av et ionogent, ledningsdyktig fyllstoff som sinksulfid, titandioksyd, bariumsulfat osv., polysulfoner, polyacetaler, polyestere, polyamider og lignende, samt blandinger av disse plaststoffer med hverandre. However, the invention is not limited to the aforementioned plastics, but can generally be implemented with adhesive metallisable plastics such as ABS polymers, namely mixture and graft polymers of acrylonitrile, butadiene and styrene, usually with a content of 10-30% by weight acrylonitrile, 50-70% by weight styrene and 8-25% by weight of butadiene, metallisable polypropylene types, for example consisting of isotactic polypropylene with a relatively high content of an ionogenic, conductive filler such as zinc sulphide, titanium dioxide, barium sulphate etc., polysulfones, polyacetals, polyesters, polyamides and the like, as well as mixtures of these plastics with each other .
Også blandinger av de nevnte ABS-typer og polypropylentyper med PVC, etterklorert PVC, klorert polyetylen, klorert polypropylen og lignende, er således metalliserbare. Mixtures of the aforementioned ABS types and polypropylene types with PVC, post-chlorinated PVC, chlorinated polyethylene, chlorinated polypropylene and the like are thus metallisable.
Metalliserbare PVC-typer er omtalt i belgisk patent Metallizable PVC types are discussed in a Belgian patent
nr. 713.290 og 718.487. No. 713,290 and 718,487.
Videre er oppfinnelsens gjenstand en sensibiliserings-oppløsning til sensibilisering av plaststoffer som skal metalliseres , bestående av sure oppløsninger av forbindelser av treverdig arsen eller antimon. Furthermore, the object of the invention is a sensitizing solution for sensitizing plastics to be metallized, consisting of acidic solutions of compounds of trivalent arsenic or antimony.
Disse sensibiliseringsoppløsninger inneholder These sensitizing solutions contain
0,5-40 g/liter, fortrinnsvis 1-10 g/liter, av forbindelser av treverdig arsen, beregnet som AS2O2, og dessuten 2-200 g/liter, fortrinnsvis 4-30 g/liter av forbindelser av IV-verdig tinn, beregnet som SnCl^, og 10 til 300 g/liter, fortrinnsvis 50-150 g/liter av halogenider og/eller nitrater av ammonium og/eller av alkalimetailer og/eller av jordalkalimetaller, fortrinnsvis av ammoniumklorid og/eller ammoniumnitrat. 0.5-40 g/liter, preferably 1-10 g/liter, of compounds of trivalent arsenic, calculated as AS2O2, and also 2-200 g/liter, preferably 4-30 g/liter of compounds of IV-valent tin , calculated as SnCl^, and 10 to 300 g/litre, preferably 50-150 g/litre of halides and/or nitrates of ammonium and/or of alkali metals and/or of alkaline earth metals, preferably of ammonium chloride and/or ammonium nitrate.
Disse sensibiliseringsoppløsninger er bruksferdige These sensitizing solutions are ready to use
med en gang, arbeider ved værelsetemperatur, forblir stabile, klare, fargeløse og fri for utskillelser i uker. De krever derfor praktisk talt ingen overvåking. at once, works at room temperature, remains stable, clear, colorless and free of secretions for weeks. They therefore require virtually no monitoring.
De med hjelp av disse sensibiliseringsoppløsninger fremstilte metalliserte plaststoffer har en uklanderlig glatt overflate og en god klebning av metallsjiktet på kunststoffover-flaten. The metallized plastics produced with the help of these sensitizing solutions have an impeccably smooth surface and a good adhesion of the metal layer to the plastic surface.
Prosentangivelsene refererer seg til vektprosent. E ksempler. The percentages refer to percentage by weight. E xamples.
Fremstilling av for gjennomgangsprosessen egnede sensibiliseringsoppløsninger: Preparation of sensitizing solutions suitable for the review process:
E ksempel 1. Example 1.
a) 2,5 g arsen-III-oksyd oppløses i 20 cm 3 HC1 (kons.) a) 2.5 g of arsenic III-oxide is dissolved in 20 cm 3 HC1 (conc.)
3 3
b) 30 g SnCl^ hydrolyseres 1 200 cm vann. b) 30 g of SnCl^ are hydrolysed in 1,200 cm of water.
c) 60 g NH^Cl oppløses i 200 cm 3 vann. c) Dissolve 60 g of NH^Cl in 200 cm 3 of water.
a), b) og c) sammenblandes i rekkefølgen b) + c) + a) og oppfylles til 1 liter med vann. a), b) and c) are mixed in the order b) + c) + a) and filled to 1 liter with water.
Eksempel - 2. Example - 2.
a) 4 g arsen-III-oksyd oppløses i 30 cm 3 HC1 (kons.) a) 4 g of arsenic III-oxide is dissolved in 30 cm 3 HC1 (conc.)
bc) ) 1125 0 g g SnamCmlo4 nhiyumdnroitlyrast eroes ppi løs2e0s 0 i cm 2300 vancnm 3.vann. bc) ) 1125 0 g g SnamCmlo4 nhiyumdnroitlyrast eroes ppi lös2e0s 0 in cm 2300 vancnm 3.water.
a), b) og c) sammenblandes i rekkefølgen b) + c) + a) og oppfylles til et volum på 1 liter med vann. a), b) and c) are mixed in the order b) + c) + a) and filled to a volume of 1 liter with water.
Eksempel 3. Example 3.
a) 15 g arsen-III-oksyd oppløses i 50 cm 3 HC1 (kons.). a) Dissolve 15 g of arsenic III-oxide in 50 cm 3 HC1 (conc.).
b) 15 g SnCl^ hydrolyseres i 200 cm 3 vann. b) 15 g of SnCl^ are hydrolysed in 200 cm 3 of water.
c) 60 g ammoniumklorid og 60 g CaC^ oppløses i 200 cm 3 vann. c) Dissolve 60 g of ammonium chloride and 60 g of CaC^ in 200 cm 3 of water.
Etter sammenblanding i rekkefølgen b) + c) + a) oppfylles opp-løsningen med vann til 1 liter. After mixing in the order b) + c) + a), the solution is made up to 1 liter with water.
Man får klare, fargeløse oppløsninger som blir fri You get clear, colorless solutions that become free
for enhver utskillelse over flere uker. for any excretion over several weeks.
Metallisering av plaststoffer ifølge gjennomgangsprosessen ifølge ( oppfinnelsen. Metallization of plastics according to the review process according to (the invention.
E ksempel 4. Example 4.
Som metalliserbare polyvinylkloridtyper anvendes følgende copolymerisater av vinylklorid: The following copolymers of vinyl chloride are used as metallizable polyvinyl chloride types:
a) 92 vektprosent VC, 8 vektprosent fumarsyredicetylester eller a) 92 percent by weight VC, 8 percent by weight fumaric acid dicetyl ester or
8 vektprosent maleinsyredicetylester, 8 weight percent maleic acid dicetyl ester,
b) 89 vektprosent VC, 11 vektprosent maleinsyredistearylester b) 89% by weight VC, 11% by weight maleic distearyl ester
c) 92 vektprosent VC, 8 vektprosent akrylsyrestearylester c) 92% by weight VC, 8% by weight acrylic acid stearyl ester
d) 86 vektprosent VC, 14 vektprosent laurylvinyleter, d) 86% by weight VC, 14% by weight lauryl vinyl ether,
e) 96 vektprosent VC, 4 vektprosent etylen (Cl-innhold 50,8 vektprosent ) . En pressplate av de nevnte materialer med dimensjonene 4,0 x 9,0 x 0,4 blir 1. beiset i kromsvovelsyre (8 g CrOg oppløst i 1 liter 60%-ig svovelsyre) i 10 min. 2. Etter spyling med vann neddyppes platene i et arsenikkholdig sensibiliseringsbad, etter valg ifølge eksempel 1, 2 eller 3, e) 96% by weight VC, 4% by weight ethylene (Cl content 50.8% by weight). A press plate of the aforementioned materials with the dimensions 4.0 x 9.0 x 0.4 is 1. pickled in chrome sulfuric acid (8 g CrOg dissolved in 1 liter of 60% sulfuric acid) for 10 min. 2. After rinsing with water, the plates are immersed in an arsenic-containing sensitization bath, according to choice according to example 1, 2 or 3,
i 2-5 min. for 2-5 min.
3. Etter den fornyede spyling med vann dyppes platene i saltsur 3. After the renewed flushing with water, the plates are dipped in hydrochloric acid
eller svovelsur palladiumsaltoppløsning i 2-5 min. (f.eks. or sulfuric acid palladium salt solution for 2-5 min. (e.g.
0,1 til 0,25 g PdCl2 oppløst i 10 cm<3> HC1 (kons.) og oppfylt 0.1 to 0.25 g PdCl2 dissolved in 10 cm<3> HC1 (conc.) and filled
til 4 liter med vann). to 4 liters of water).
4. Etter ytterligere spyling dyppes platene i et kjemisk forniklingsbad. I løpet av 3 min. dekkes de fullstendig med 4. After further rinsing, the plates are dipped in a chemical nickel plating bath. Within 3 min. they are completely covered
metallisk nikkel. Holderelektrodene forblir metallfrie. metallic nickel. The holder electrodes remain metal-free.
5. Den galvaniske forsterkning av metallovertrekket kan deretter etter valg være en i og for seg kjent mattglansfornikling, glanskopperutskillelse, glansnikkelutskillelse eller for-kromning. 5. The galvanic reinforcement of the metal coating can then, by choice, be a matt gloss nickel plating known in and of itself, shiny copper plating, shiny nickel plating or pre-chroming.
Klebefastheten av det på denne måte på kunststoffet påførte metallovertrekk utgjør ifølge DIN 40 802 mellom 6 og 8 kp. According to DIN 40 802, the adhesive strength of the metal coating applied in this way to the plastic is between 6 and 8 kp.
HoldereleKtroden blir etter fjerning av den galvaniserte gjenstand kort dyppet i kromsvovelsyre eller salpetersyre og er igjen anvendbar. After removing the galvanized object, the holding electrode is briefly dipped in chrome-sulphuric acid or nitric acid and is usable again.
Eksempel 5. Example 5.
Som ABS-polymerisater anvendes følgende polymerisater av sammensetning The following polymers of composition are used as ABS polymers
a) 2 5 vektprosent akrylnitril, 10 vektprosent butadien og a) 25% by weight acrylonitrile, 10% by weight butadiene and
65 vektprosent styrol. 65% by weight styrene.
b) 24 vektprosent akrylnitril, 16 vektprosent butadien og b) 24% by weight acrylonitrile, 16% by weight butadiene and
60 vektprosent styrol. 60% by weight styrene.
c) 21 vektprosent akrylnitril, 15 vektprosent butadien og c) 21% by weight acrylonitrile, 15% by weight butadiene and
64 vektprosent styrol 64% by weight styrene
og behandles på følgende måte: and is processed in the following way:
En pressplate av dimensjoner 4,0 x 9,0 x 0,4 beises A press plate of dimensions 4.0 x 9.0 x 0.4 is stained
i kromsvovelsyre (8 g CrOg oppløst i 1 liter 60%-ig svovelsyre) in chromium sulfuric acid (8 g CrOg dissolved in 1 liter of 60% sulfuric acid)
i 12 minutter. Etter vannspyling neddyppes platene i et arsenikkholdig sensibiliseringsbad ifølge eksemplene 1, 2 eller 3 i 2-5 minutter. Etter gjentatt spyling med vann neddyppes platene i en saltsur eller tilsvarende svovelsur palladiumsaltoppløsning i 2-5 min. (f.eks. 0,1 - 0,25 g PdCl2 oppløst i 10 cm<3> HC1 (kons) og oppfylt til 4 liter med vann). for 12 minutes. After rinsing with water, the plates are immersed in an arsenic-containing sensitization bath according to examples 1, 2 or 3 for 2-5 minutes. After repeated rinsing with water, the plates are immersed in a hydrochloric acid or equivalent sulfuric acid palladium salt solution for 2-5 minutes. (e.g. 0.1 - 0.25 g PdCl2 dissolved in 10 cm<3> HC1 (conc) and made up to 4 liters with water).
Etter ytterligere spyling neddyppes platen i et kjemisk forniklingsbad. I løpet av 3 min. dekkes overflaten fullstendig med metallisk nikkel. Elektrodene forblir metallfrie. Viderebehandlingen foregår som angitt under eksempel 4. After further rinsing, the plate is immersed in a chemical nickel plating bath. Within 3 min. the surface is completely covered with metallic nickel. The electrodes remain metal-free. Further processing takes place as indicated under example 4.
Klebefastheten av det på denne måte påførte metallovertrekk utgjør ifølge DIN 40 802 7,0 kp. Elektrodenes behandling se eksempel 4. According to DIN 40 802, the adhesive strength of the metal coating applied in this way amounts to 7.0 kp. Treatment of the electrodes see example 4.
E ksempel 6. Example 6.
Av ABS-polymerisater med sammensetning Of ABS polymers with composition
a) 25 vektprosent akrylnitril, 21 vektprosent butadien og a) 25% by weight acrylonitrile, 21% by weight butadiene and
54 vektprosent styrol. 54% by weight styrene.
b) 25 vektprosent akrylnitril, 14 vektprosent butadien og b) 25% by weight acrylonitrile, 14% by weight butadiene and
61 vektprosent styrol. 61% by weight styrene.
c) 27 vektprosent akrylnitril, 22 vektprosent butadien og c) 27% by weight acrylonitrile, 22% by weight butadiene and
51 vektprosent styrol 51% by weight styrene
fremstilles en pressplate med dimensjon 4,0 x 9,0 x 0,4 og beises- a press plate with dimensions 4.0 x 9.0 x 0.4 is produced and stained
i kromsvovelsyre i 10 min. (300 g CrO^ oppløst i 1 liter 20%-ig svovelsyre). Etter vannspyling dyppes platen i det arsenikkholdige sensibiliseringsbad (eksempel 1-3) i 2-5 minutter. in chromic sulfuric acid for 10 min. (300 g of CrO^ dissolved in 1 liter of 20% sulfuric acid). After rinsing with water, the plate is immersed in the arsenic-containing sensitizing bath (Example 1-3) for 2-5 minutes.
Etter gjentatt vannspyling neddyppes platen i en fortynnet saltsur eller svovelsur palladiumsaltoppløsning i 2-5 minutter (f.eks. 0,25 g - 5 g PdCl2 oppløst i 10 cm<3> HC1 (kons.) After repeated water rinsing, the plate is immersed in a dilute hydrochloric acid or sulfuric acid palladium salt solution for 2-5 minutes (e.g. 0.25 g - 5 g PdCl2 dissolved in 10 cm<3> HC1 (conc.)
og oppfylt til 4 liter med vann). Etter ytterligere spyling neddyppes platen i et kjemisk forkopringsbad. I løpet av 3 min. and filled to 4 liters of water). After further rinsing, the plate is immersed in a chemical pre-coppering bath. Within 3 min.
er platen dekket med et metallisk koppersjikt. Elektrodene forblir metallfrie. Den galvaniske viderebehandling foregår som omtalt i eksempel 4. the plate is covered with a metallic copper layer. The electrodes remain metal-free. The galvanic further treatment takes place as described in example 4.
Klebefastheten av den på plastoverflaten utskilte metallfolie utgjør etter DIN 40 802 6,3 kp. Elektrodenes behandling se eksempel 4. According to DIN 40 802, the adhesive strength of the metal foil deposited on the plastic surface amounts to 6.3 kp. Treatment of the electrodes see example 4.
Eksempel 7. Example 7.
Som metalliserbart polypropylen anvendes et isotaktisk polypropylen med et fyllstoffinnhold på 2 8,1% ZnS, 0,4% BaS04 og 1,2% ZnO og behandles på følgende måte: As metallizable polypropylene, an isotactic polypropylene with a filler content of 28.1% ZnS, 0.4% BaSO4 and 1.2% ZnO is used and processed as follows:
En pressplate av dimensjoner 4,0 x 9,0 x 0,4 beises A press plate of dimensions 4.0 x 9.0 x 0.4 is stained
i kromsvovelsyre i 10 min. (54,5 g CrO^ oppløst i 1 liter 92%-ig svovelsyre). Etter spyling med vann dyppes platen i det arsenikkholdige sensibiliseringsbad (eksempel 1-3) i 3-5 minutter. Etter gjentatt spyling med vann neddyppes platen i en sur palladiumsalt-oppløsning i 2-5 min. (2,5 g PdCl2 oppløst i 10 cm 3 HC1 (kons) in chromic sulfuric acid for 10 min. (54.5 g CrO^ dissolved in 1 liter of 92% sulfuric acid). After rinsing with water, the plate is immersed in the arsenic-containing sensitizing bath (Example 1-3) for 3-5 minutes. After repeated rinsing with water, the plate is immersed in an acidic palladium salt solution for 2-5 min. (2.5 g PdCl2 dissolved in 10 cm 3 HC1 (conc.)
og oppfylt med vann til 4 liter). Etter ytterligere spyling and filled with water to 4 litres). After further flushing
dyppes platene i et kjemisk forniklingsbad. I løpet av 3 min. dekker den seg fullstendig med metallisk nikkel. Holderelektrodene forblir metallfrie. Den galvaniske viderebehandling foregår ifølge eksempel 4. Man får klebefastheter av den på denne måte påførte metallfolie (ifølge DIN 40 802) på inntil 7,5 kp. Elektrodenes behandling som under eksempel 4. the plates are dipped in a chemical nickel-plating bath. Within 3 min. covers it completely with metallic nickel. The holder electrodes remain metal-free. The galvanic further treatment takes place according to example 4. Adhesive strengths of the metal foil applied in this way (according to DIN 40 802) of up to 7.5 kp are obtained. Treatment of the electrodes as under example 4.
På analog måte er også en isotaktisk polypropylen In an analogous way is also an isotactic polypropylene
med et innhold på 1% titandioksyd metalliserbar. with a content of 1% metallisable titanium dioxide.
Claims (3)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19691944314 DE1944314A1 (en) | 1969-09-01 | 1969-09-01 | Process for the metallization of plastics |
Publications (1)
Publication Number | Publication Date |
---|---|
NO129754B true NO129754B (en) | 1974-05-20 |
Family
ID=5744307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO03306/70A NO129754B (en) | 1969-09-01 | 1970-08-31 |
Country Status (12)
Country | Link |
---|---|
US (1) | US3764488A (en) |
JP (1) | JPS4817385B1 (en) |
AT (1) | AT305722B (en) |
BE (1) | BE755520A (en) |
CA (1) | CA973308A (en) |
CH (1) | CH556392A (en) |
DE (1) | DE1944314A1 (en) |
FR (1) | FR2060341B1 (en) |
GB (1) | GB1318247A (en) |
NL (1) | NL7012928A (en) |
NO (1) | NO129754B (en) |
SE (1) | SE369203B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2122456B1 (en) * | 1971-01-20 | 1976-07-23 | Hoechst Ag | |
US3904792A (en) * | 1972-02-09 | 1975-09-09 | Shipley Co | Catalyst solution for electroless metal deposition on a substrate |
US3982054A (en) * | 1972-02-14 | 1976-09-21 | Rca Corporation | Method for electrolessly depositing metals using improved sensitizer composition |
US3956528A (en) * | 1974-11-15 | 1976-05-11 | Minnesota Mining And Manufacturing Company | Selective plating by galvanic action |
PH23907A (en) * | 1983-09-28 | 1989-12-18 | Rohm & Haas | Catalytic process and systems |
US4770751A (en) * | 1986-12-30 | 1988-09-13 | Okuno Chemical Industry Co., Ltd. | Method for forming on a nonconductor a shielding layer against electromagnetic radiation |
CN105401149B (en) * | 2015-11-13 | 2018-08-07 | 北京卫星制造厂 | A kind of preparation method of copper diamond composite gold tin welding coating |
-
0
- BE BE755520D patent/BE755520A/en unknown
-
1969
- 1969-09-01 DE DE19691944314 patent/DE1944314A1/en active Pending
-
1970
- 1970-08-26 CH CH1278770A patent/CH556392A/en not_active IP Right Cessation
- 1970-08-28 US US3764488D patent/US3764488A/en not_active Expired - Lifetime
- 1970-08-31 FR FR7031676A patent/FR2060341B1/fr not_active Expired
- 1970-08-31 SE SE1181170A patent/SE369203B/xx unknown
- 1970-08-31 CA CA092,039A patent/CA973308A/en not_active Expired
- 1970-08-31 NO NO03306/70A patent/NO129754B/no unknown
- 1970-09-01 GB GB4186070A patent/GB1318247A/en not_active Expired
- 1970-09-01 NL NL7012928A patent/NL7012928A/xx unknown
- 1970-09-01 AT AT791570A patent/AT305722B/en not_active IP Right Cessation
- 1970-09-01 JP JP7663070A patent/JPS4817385B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
FR2060341A1 (en) | 1971-06-18 |
US3764488A (en) | 1973-10-09 |
AT305722B (en) | 1973-03-12 |
NL7012928A (en) | 1971-03-03 |
BE755520A (en) | 1971-02-01 |
DE1944314A1 (en) | 1971-03-11 |
JPS4817385B1 (en) | 1973-05-29 |
CH556392A (en) | 1974-11-29 |
FR2060341B1 (en) | 1974-09-20 |
CA973308A (en) | 1975-08-26 |
SE369203B (en) | 1974-08-12 |
GB1318247A (en) | 1973-05-23 |
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