GB1411429A - Replenishment of electroless copper solutions - Google Patents

Replenishment of electroless copper solutions

Info

Publication number
GB1411429A
GB1411429A GB4710372A GB4710372A GB1411429A GB 1411429 A GB1411429 A GB 1411429A GB 4710372 A GB4710372 A GB 4710372A GB 4710372 A GB4710372 A GB 4710372A GB 1411429 A GB1411429 A GB 1411429A
Authority
GB
United Kingdom
Prior art keywords
bath
replenishment
solution
cupric
replenisher
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4710372A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of GB1411429A publication Critical patent/GB1411429A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemically Coating (AREA)

Abstract

1411429 Replenishment of electroless Cu solutions SHIPLEY CO Inc 12 Oct 1972 [12 Oct 1971] 47103/72 Heading C7F An electroless copper-plating bath is replenished by additions in dry form, i.e. powder or tablets, or as concentrated solutions having at least 75% solids content. The additions are made below the bath surface and agitated, or by circulating some of the bath solution through the replenisher constituents. The replenisher constituents include a source of cupric ions, eg CuSO 4 , CuCl 2 , Cu(NO 3 ) 2 , Cu(OH) 2 , cupric tartrate or cupric acetate; a source of formaldehyde, eg paraformaldehyde; a complexing agent, eg Rochelle salt, Na salts of EDTA, modified EDTA acids, tartaric acid, sodium salicylate, sodium tartrate, or nitrilotriacetic acid and alkali metal salts thereof; a hydroxide, eg NaOH; and also chelating agents, stabilizers, brighteners, surfactants etc. In Fig. 1, overflow from the bath 101 can be passed through valve 107, and to outlet 202 where it enters a Venturi nozzle 203 tangentially. The swirling solution then passes through replenishment powders 204 held in a porous bag 205, after which the replenished solution is fed back into the overflow tank 102 and into the bath 101 through valve 108. An example discloses coating phenolic substrates.
GB4710372A 1971-10-12 1972-10-12 Replenishment of electroless copper solutions Expired GB1411429A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US18824371A 1971-10-12 1971-10-12

Publications (1)

Publication Number Publication Date
GB1411429A true GB1411429A (en) 1975-10-22

Family

ID=22692340

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4710372A Expired GB1411429A (en) 1971-10-12 1972-10-12 Replenishment of electroless copper solutions

Country Status (5)

Country Link
US (1) US3770464A (en)
JP (1) JPS536934B2 (en)
CA (1) CA966256A (en)
GB (1) GB1411429A (en)
NL (1) NL7213480A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160040291A1 (en) * 2014-08-08 2016-02-11 Gary P. Wainwright Roll-to-roll electroless plating system with micro-bubble injector

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4138267A (en) * 1976-12-28 1979-02-06 Okuno Chemical Industry Company, Limited Compositions for chemical copper plating
JPS5561204U (en) * 1978-10-24 1980-04-25
JPS588931A (en) * 1981-06-23 1983-01-19 ボツシユシ−メンス・ハウスゲレ−テ・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング Incorporating type electric cooker
JPS61243181A (en) * 1985-04-19 1986-10-29 Hitachi Ltd Chemical copper plating device
US5106413A (en) * 1990-02-01 1992-04-21 Hitachi, Ltd. Measurement method, adjustment method and adjustment system for the concentrations of ingredients in electroless plating solution
US20100059385A1 (en) * 2008-09-06 2010-03-11 Delin Li Methods for fabricating thin film solar cells
JP6047714B2 (en) * 2012-08-08 2016-12-21 石原ケミカル株式会社 Paste tin replenisher and replenishment method for electroless tin plating solution
JP6714714B2 (en) 2016-10-18 2020-06-24 本田技研工業株式会社 Vehicle control device
CN114452892A (en) * 2021-12-27 2022-05-10 西安泰金工业电化学技术有限公司 Gas-liquid mixing self-suction device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2819188A (en) * 1954-05-18 1958-01-07 Gen Am Transport Processes of chemical nickel plating
US2938805A (en) * 1958-03-31 1960-05-31 Gen Electric Process of stabilizing autocatalytic copper plating solutions
US3532519A (en) * 1967-11-28 1970-10-06 Matsushita Electric Ind Co Ltd Electroless copper plating process
US3595684A (en) * 1968-06-27 1971-07-27 Enthone Electroless copper plating
US3649350A (en) * 1970-06-29 1972-03-14 Gen Electric Electroless copper plating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160040291A1 (en) * 2014-08-08 2016-02-11 Gary P. Wainwright Roll-to-roll electroless plating system with micro-bubble injector

Also Published As

Publication number Publication date
JPS536934B2 (en) 1978-03-13
DE2250034B2 (en) 1977-06-08
US3770464A (en) 1973-11-06
NL7213480A (en) 1973-04-16
CA966256A (en) 1975-04-22
DE2250034A1 (en) 1973-04-19
JPS4846527A (en) 1973-07-03

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees