GB1168370A - Improvements in and relating to plating Processes - Google Patents
Improvements in and relating to plating ProcessesInfo
- Publication number
- GB1168370A GB1168370A GB5769267A GB5769267A GB1168370A GB 1168370 A GB1168370 A GB 1168370A GB 5769267 A GB5769267 A GB 5769267A GB 5769267 A GB5769267 A GB 5769267A GB 1168370 A GB1168370 A GB 1168370A
- Authority
- GB
- United Kingdom
- Prior art keywords
- salt
- formaldehyde
- solution
- colourimeter
- spectro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
Abstract
1,168,370. Electroless deposition of copper. MATSUSHITA ELECTRIC INDUSTRIAL CO. Ltd. Dec.19, 1967 [Dec.19, 1966], No.57692/67. Heading C7F. [Also in Division G3] Cu is deposited from an aqueous solution comprising: A Cu salt Formaldehyde. A complexing agent An alkali hydroxide, replenished with a mixture of a Cu salt and formaldehyde, in a proportion corresponding to their rates of exhaustion and kept at an approximately constant pH by addition of alkalihydroxide. Substrates 4, which may be printed circuit boards and may be of a phenolic resin, activated by immersion in a solution of Sn chloride and Pd chloride, are immersed in bath 2, which may contain Cu sulphate, Cu nitrate or Cu chloride with EDTA, one of its alkali salts, tartaric acid or one of its alkali salts and NaOH, the pH being at least 12. Liquid from bath 2 is circulated through spectro-colourimeter 10 and pH meter 25 measures the pH at electrodes 23. Suitably an electric output from spectro-colourimeter 10, which measures the concentration of Cu ions, is arranged to control addition of a Cu salt/formaldehyde solution 19 to bath 2 and a signal from pH meter addition of alkali hydroxide solution 32, but the spectro-colourimeter and pH meter may be arranged to give visual outputs and the Cu salt and formaldehyde be added by any convenient means as a solution or powder, e.g. by an electrically operated powder feeding device.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8334766 | 1966-12-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1168370A true GB1168370A (en) | 1969-10-22 |
Family
ID=13799891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5769267A Expired GB1168370A (en) | 1966-12-19 | 1967-12-19 | Improvements in and relating to plating Processes |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR1551275A (en) |
GB (1) | GB1168370A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0016415A1 (en) * | 1979-03-21 | 1980-10-01 | Siemens Aktiengesellschaft | Method for measurement and regulation of the concentration of copper, formaldehyde and sodiumhydroxide in an electroless copper deposition bath and sampling apparatus for use in this method |
US4350717A (en) | 1979-12-29 | 1982-09-21 | C. Uyemura & Co., Ltd. | Controlling electroless plating bath |
US4353933A (en) | 1979-11-14 | 1982-10-12 | C. Uyemura & Co., Ltd. | Method for controlling electroless plating bath |
GB2198750A (en) * | 1986-10-31 | 1988-06-22 | Kollmorgen Corp | Controlling electroless deposition |
DE3718584A1 (en) * | 1987-06-03 | 1988-12-15 | Norddeutsche Affinerie | METHOD FOR MEASURING THE ACTIVE INHIBITOR CONCENTRATION DURING METAL DEPOSITION FROM AQUEOUS ELECTROLYTE |
GB2218714A (en) * | 1988-04-29 | 1989-11-22 | Kollmorgen Corp | Electroless plating. |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA936304A (en) * | 1970-08-10 | 1973-11-06 | B. Saubestre Edward | Electroless copper plating |
-
1967
- 1967-12-12 FR FR1551275D patent/FR1551275A/fr not_active Expired
- 1967-12-19 GB GB5769267A patent/GB1168370A/en not_active Expired
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0016415A1 (en) * | 1979-03-21 | 1980-10-01 | Siemens Aktiengesellschaft | Method for measurement and regulation of the concentration of copper, formaldehyde and sodiumhydroxide in an electroless copper deposition bath and sampling apparatus for use in this method |
US4353933A (en) | 1979-11-14 | 1982-10-12 | C. Uyemura & Co., Ltd. | Method for controlling electroless plating bath |
US4350717A (en) | 1979-12-29 | 1982-09-21 | C. Uyemura & Co., Ltd. | Controlling electroless plating bath |
GB2198750A (en) * | 1986-10-31 | 1988-06-22 | Kollmorgen Corp | Controlling electroless deposition |
GB2198750B (en) * | 1986-10-31 | 1991-01-02 | Kollmorgen Corp | Method for electrolessly depositing high quality copper |
DE3718584A1 (en) * | 1987-06-03 | 1988-12-15 | Norddeutsche Affinerie | METHOD FOR MEASURING THE ACTIVE INHIBITOR CONCENTRATION DURING METAL DEPOSITION FROM AQUEOUS ELECTROLYTE |
GB2218714A (en) * | 1988-04-29 | 1989-11-22 | Kollmorgen Corp | Electroless plating. |
GB2218714B (en) * | 1988-04-29 | 1992-10-14 | Kollmorgen Corp | Method of formulating and operating an electroless plating bath solution for forming cu-deposits which are essentially free of fissures |
Also Published As
Publication number | Publication date |
---|---|
DE1621294B2 (en) | 1975-07-24 |
FR1551275A (en) | 1968-12-27 |
DE1621294A1 (en) | 1971-06-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PE20 | Patent expired after termination of 20 years |