GB1414896A - Electroless copper plating - Google Patents
Electroless copper platingInfo
- Publication number
- GB1414896A GB1414896A GB207373A GB207373A GB1414896A GB 1414896 A GB1414896 A GB 1414896A GB 207373 A GB207373 A GB 207373A GB 207373 A GB207373 A GB 207373A GB 1414896 A GB1414896 A GB 1414896A
- Authority
- GB
- United Kingdom
- Prior art keywords
- alkyl
- salts
- mole
- aryl
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
1414896 Electroless Cu plating DYNACHEM CORP 15 Jan 1973 [17 Jan 1972] 2073/73 Heading C7F An aqueous alkaline electroless Cu bath has pH 10.5-14 and contains (1) a soluble Cu salt, (2) a complexing agent for Cu<SP>++</SP> ion, (3) H CHO and (4) a primary stabilizer which is:- where R and R'" are C 1 -C 12 alkyl or aryl or substituted C 1 -C 12 alkyl or aryl, X, Y, and Z are 0 or S and R Z is a group hydrolyzable in the alkaline bath, the groups RY and R'"X not being hydrolyzable. R' may be H, substituted alkyl or aryl having as substituent halogen (e.g. Cl, Br, I), hydroxyl, amino, lower alkyl- or alkanol-amino, amido, nitro, carbalkoxy, alkylthio, alkoxy, aryloxy, or pyrimidyl; 0.0001-0.001 mole of (4) may be added per mole of Cu salt (1) which may be 0.002-0.15 moles/l of the sulphate, nitrate, chloride or acetate. (2) may be triethanolamine, tetrakis-N, N, N, N-hydroxypropyl-ethylenediamine, salts of nitrilotriacetic acid, salts of ethylenediamine acetates, salts of hydroxy-carboxylic acids such as gluconic, tartaric, or citric and is preferably mixed EDTA/tartaric acid salts; a surfactant may be added, and the pH is adjusted with alkali metal hydroxide, carbonate or phosphate, e.g. a.m. hydroxide/carbonate mixture. A secondary stabilizer which is R X -(CH 2 ) n -C#CH may be added, R" being C 1 -C 12 alkyl or phenyl or napthyl (optionally substituted) or forming a ring with X' when X' = N, X' being -O-, -CO-, -S-, sulphonyl, sulphoxide, imino or N, and n being 1, 2, or 3, in amount 0.0001-0.001 mole/mole Cu<SP>++</SP>. The solution is used at ambient-125F at S.G. 1.04-1.05 with agitation in a plastic-lined metal tank, e.g. for 10-30 min., and stainless steel, epoxy plastic, or plastic or ceramic impregnated with Cu 2 O may be plated, where necessary after SnCl 2 /PdCl 2 treatment.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US21845972A | 1972-01-17 | 1972-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1414896A true GB1414896A (en) | 1975-11-19 |
Family
ID=22815208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB207373A Expired GB1414896A (en) | 1972-01-17 | 1973-01-15 | Electroless copper plating |
Country Status (23)
| Country | Link |
|---|---|
| US (1) | US3790392A (en) |
| JP (1) | JPS5519983B2 (en) |
| AT (1) | AT320372B (en) |
| AU (1) | AU464729B2 (en) |
| BE (1) | BE794048A (en) |
| CH (1) | CH599981A5 (en) |
| DD (1) | DD107490A5 (en) |
| DE (1) | DE2300748C3 (en) |
| DK (1) | DK143948C (en) |
| ES (1) | ES410652A1 (en) |
| FI (1) | FI54500C (en) |
| FR (1) | FR2168364B1 (en) |
| GB (1) | GB1414896A (en) |
| HK (1) | HK65076A (en) |
| IL (1) | IL41331A (en) |
| IT (1) | IT980460B (en) |
| LU (1) | LU66834A1 (en) |
| NL (1) | NL177330C (en) |
| NO (1) | NO135188C (en) |
| PL (1) | PL94000B1 (en) |
| RO (1) | RO69172A (en) |
| SE (1) | SE387664B (en) |
| ZA (1) | ZA73328B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103225092A (en) * | 2013-05-22 | 2013-07-31 | 南通鑫平制衣有限公司 | Plated copper for plastics |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL164906C (en) * | 1975-08-19 | 1981-02-16 | Philips Nv | PROCESS FOR PREPARING AN AQUEOUS ALKALINE SELLER BATH. |
| JPS60159328U (en) * | 1984-03-31 | 1985-10-23 | 株式会社 高津製作所 | Oil level gauge with drain alarm |
| US4666858A (en) * | 1984-10-22 | 1987-05-19 | International Business Machines Corporation | Determination of amount of anionic material in a liquid sample |
| US5626736A (en) | 1996-01-19 | 1997-05-06 | Shipley Company, L.L.C. | Electroplating process |
| EP2639335B1 (en) * | 2012-03-14 | 2015-09-16 | Atotech Deutschland GmbH | Alkaline plating bath for electroless deposition of cobalt alloys |
| JP6176841B2 (en) * | 2013-07-19 | 2017-08-09 | ローム・アンド・ハース電子材料株式会社 | Electroless copper plating solution |
| US10060034B2 (en) | 2017-01-23 | 2018-08-28 | Rohm And Haas Electronic Materials Llc | Electroless copper plating compositions |
| US10294569B2 (en) | 2017-10-06 | 2019-05-21 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
| US10655227B2 (en) | 2017-10-06 | 2020-05-19 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1192021B (en) * | 1963-01-12 | 1965-04-29 | Dehydag Gmbh | Galvanic baths |
| US3457089A (en) * | 1967-04-07 | 1969-07-22 | Shipley Co | Electroless copperplating |
| US3635758A (en) * | 1969-08-04 | 1972-01-18 | Photocircuits Corp | Electroless metal deposition |
-
0
- BE BE794048D patent/BE794048A/en not_active IP Right Cessation
-
1972
- 1972-01-17 US US00218459A patent/US3790392A/en not_active Expired - Lifetime
-
1973
- 1973-01-05 AU AU50768/73A patent/AU464729B2/en not_active Expired
- 1973-01-08 DE DE2300748A patent/DE2300748C3/en not_active Expired
- 1973-01-08 AT AT13573A patent/AT320372B/en not_active IP Right Cessation
- 1973-01-11 NO NO123/73A patent/NO135188C/no unknown
- 1973-01-12 SE SE7300440A patent/SE387664B/en unknown
- 1973-01-15 LU LU66834A patent/LU66834A1/xx unknown
- 1973-01-15 CH CH52373A patent/CH599981A5/xx not_active IP Right Cessation
- 1973-01-15 GB GB207373A patent/GB1414896A/en not_active Expired
- 1973-01-15 FR FR7301315A patent/FR2168364B1/fr not_active Expired
- 1973-01-16 IT IT67057/73A patent/IT980460B/en active
- 1973-01-16 DD DD168260A patent/DD107490A5/xx unknown
- 1973-01-16 ES ES410652A patent/ES410652A1/en not_active Expired
- 1973-01-16 ZA ZA730328A patent/ZA73328B/en unknown
- 1973-01-16 DK DK23573A patent/DK143948C/en not_active IP Right Cessation
- 1973-01-16 FI FI117/73A patent/FI54500C/en active
- 1973-01-16 NL NLAANVRAGE7300599,A patent/NL177330C/en not_active IP Right Cessation
- 1973-01-17 RO RO7373524A patent/RO69172A/en unknown
- 1973-01-17 IL IL41331A patent/IL41331A/en unknown
- 1973-01-17 PL PL1973160307A patent/PL94000B1/pl unknown
- 1973-01-17 JP JP774073A patent/JPS5519983B2/ja not_active Expired
-
1976
- 1976-10-14 HK HK650/76*UA patent/HK65076A/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103225092A (en) * | 2013-05-22 | 2013-07-31 | 南通鑫平制衣有限公司 | Plated copper for plastics |
Also Published As
| Publication number | Publication date |
|---|---|
| CH599981A5 (en) | 1978-06-15 |
| DK143948B (en) | 1981-11-02 |
| IL41331A (en) | 1975-11-25 |
| NL177330C (en) | 1985-09-02 |
| JPS5519983B2 (en) | 1980-05-30 |
| BE794048A (en) | 1973-07-16 |
| FI54500B (en) | 1978-08-31 |
| ES410652A1 (en) | 1976-01-01 |
| DE2300748B2 (en) | 1975-03-13 |
| FR2168364B1 (en) | 1975-03-28 |
| IT980460B (en) | 1974-09-30 |
| ZA73328B (en) | 1973-10-31 |
| NL7300599A (en) | 1973-07-19 |
| JPS4999934A (en) | 1974-09-20 |
| US3790392A (en) | 1974-02-05 |
| AT320372B (en) | 1975-02-10 |
| LU66834A1 (en) | 1973-03-19 |
| PL94000B1 (en) | 1977-07-30 |
| DE2300748C3 (en) | 1975-10-30 |
| AU464729B2 (en) | 1975-09-04 |
| NO135188B (en) | 1976-11-15 |
| FR2168364A1 (en) | 1973-08-31 |
| DK143948C (en) | 1982-04-19 |
| SE387664B (en) | 1976-09-13 |
| HK65076A (en) | 1976-10-22 |
| FI54500C (en) | 1978-12-11 |
| DD107490A5 (en) | 1974-08-05 |
| DE2300748A1 (en) | 1973-07-26 |
| NO135188C (en) | 1977-02-23 |
| AU5076873A (en) | 1974-07-11 |
| NL177330B (en) | 1985-04-01 |
| RO69172A (en) | 1980-01-15 |
| IL41331A0 (en) | 1973-03-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |