GB1128306A - Improvements in and relating to chemical copper-plating - Google Patents
Improvements in and relating to chemical copper-platingInfo
- Publication number
- GB1128306A GB1128306A GB6561/66A GB656166A GB1128306A GB 1128306 A GB1128306 A GB 1128306A GB 6561/66 A GB6561/66 A GB 6561/66A GB 656166 A GB656166 A GB 656166A GB 1128306 A GB1128306 A GB 1128306A
- Authority
- GB
- United Kingdom
- Prior art keywords
- rhodanine
- copper
- plating
- relating
- feb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Abstract
1,128,306. Coating with copper. SCHERING A.G. Feb. 15, 1966 [Feb.. 20, 1965], No. 6561/66. Heading C7F. Copper is chemically deposited on a substrate of e. g. ceramic, plastics or metal from a bath containing 0.001 to 0À5 g. 1.1. of a compound of the formula in which x = S or NH, R<SP>1</SP> = hydrogen, alkyl, optionally substituted aryl, carboxyalkyl or the amino group, and R<SP>2</SP> = hydrogen alkyl or the nitro group. Examples are rhodanine, N-methyl - or N-phenyl - rhodanine, rhodanine - N-acetic acid, N-amino - rhodanine, 3-phenyl - 5 nitrorhodanine - 5 - ethyl - rhodanine, and thiohydantoin. In a particular example a bath contains (g.1.1) Cu SO 4 5H 2 O 10, potassium sodium tartrate 16, sodium hydroxide 16, paraformaldehyde 8, and rhodanine, 0.005.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DESCH36568A DE1266099B (en) | 1965-02-20 | 1965-02-20 | Bath for the reductive copper deposition |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1128306A true GB1128306A (en) | 1968-09-25 |
Family
ID=7433913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB6561/66A Expired GB1128306A (en) | 1965-02-20 | 1966-02-15 | Improvements in and relating to chemical copper-plating |
Country Status (6)
Country | Link |
---|---|
US (1) | US3454416A (en) |
BE (1) | BE676720A (en) |
CH (1) | CH464643A (en) |
DE (1) | DE1266099B (en) |
GB (1) | GB1128306A (en) |
NL (1) | NL149857B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110983309A (en) * | 2019-12-26 | 2020-04-10 | 广东东硕科技有限公司 | Application of 2-thiohydantoin compound or salt thereof |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3649350A (en) * | 1970-06-29 | 1972-03-14 | Gen Electric | Electroless copper plating |
US3793038A (en) * | 1973-01-02 | 1974-02-19 | Crown City Plating Co | Process for electroless plating |
NL164906C (en) * | 1975-08-19 | 1981-02-16 | Philips Nv | PROCESS FOR PREPARING AN AQUEOUS ALKALINE SELLER BATH. |
DE2635457C2 (en) * | 1976-08-04 | 1985-06-05 | Schering AG, 1000 Berlin und 4709 Bergkamen | Catalytic varnish and its use in the manufacture of printed circuits |
US4908242A (en) * | 1986-10-31 | 1990-03-13 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
NL8702219A (en) * | 1987-09-16 | 1989-04-17 | Philips Nv | METHOD FOR LOCALLY APPLYING METAL TO A SUBSTRATE SURFACE |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2609339A (en) * | 1948-11-02 | 1952-09-02 | United Chromium Inc | Bright copper plating from cyanide baths |
DE1243493B (en) * | 1961-02-04 | 1967-06-29 | Bayer Ag | Aqueous bath for chemical deposition of boron-containing metal coatings |
US3361580A (en) * | 1963-06-18 | 1968-01-02 | Day Company | Electroless copper plating |
-
1965
- 1965-02-20 DE DESCH36568A patent/DE1266099B/en active Pending
- 1965-12-22 US US515753A patent/US3454416A/en not_active Expired - Lifetime
-
1966
- 1966-02-10 CH CH189366A patent/CH464643A/en unknown
- 1966-02-15 GB GB6561/66A patent/GB1128306A/en not_active Expired
- 1966-02-18 BE BE676720D patent/BE676720A/xx unknown
- 1966-02-18 NL NL666602102A patent/NL149857B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110983309A (en) * | 2019-12-26 | 2020-04-10 | 广东东硕科技有限公司 | Application of 2-thiohydantoin compound or salt thereof |
CN110983309B (en) * | 2019-12-26 | 2023-01-03 | 广东东硕科技有限公司 | Application of 2-thiohydantoin compound or salt thereof |
Also Published As
Publication number | Publication date |
---|---|
US3454416A (en) | 1969-07-08 |
NL149857B (en) | 1976-06-15 |
CH464643A (en) | 1968-10-31 |
BE676720A (en) | 1966-08-18 |
DE1266099B (en) | 1968-04-11 |
NL6602102A (en) | 1966-08-22 |
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