ES430054A1 - Electrolytic burnished gold bath with higher rate of deposition - Google Patents

Electrolytic burnished gold bath with higher rate of deposition

Info

Publication number
ES430054A1
ES430054A1 ES430054A ES430054A ES430054A1 ES 430054 A1 ES430054 A1 ES 430054A1 ES 430054 A ES430054 A ES 430054A ES 430054 A ES430054 A ES 430054A ES 430054 A1 ES430054 A1 ES 430054A1
Authority
ES
Spain
Prior art keywords
deposition
electrolytic
higher rate
gold bath
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES430054A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Degussa GmbH
Deutsche Gold und Silber Scheideanstalt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Degussa GmbH, Deutsche Gold und Silber Scheideanstalt filed Critical Degussa GmbH
Publication of ES430054A1 publication Critical patent/ES430054A1/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

There is provided an electrolytic gold bath for the deposition of thicker, bright gold coatings at high rates of deposition. The bath contains a heterocyclic azohydrocarbon sulfonic acid or salt thereof, e.g. pyridine sulfonic acid.
ES430054A 1973-11-07 1974-09-14 Electrolytic burnished gold bath with higher rate of deposition Expired ES430054A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2355581A DE2355581C3 (en) 1973-11-07 1973-11-07 Galvanic bright gold bath with high deposition rate

Publications (1)

Publication Number Publication Date
ES430054A1 true ES430054A1 (en) 1976-10-16

Family

ID=5897412

Family Applications (1)

Application Number Title Priority Date Filing Date
ES430054A Expired ES430054A1 (en) 1973-11-07 1974-09-14 Electrolytic burnished gold bath with higher rate of deposition

Country Status (12)

Country Link
US (1) US3929595A (en)
JP (1) JPS5615472B2 (en)
BE (1) BE821923A (en)
BR (1) BR7409243A (en)
CH (1) CH603825A5 (en)
DE (1) DE2355581C3 (en)
ES (1) ES430054A1 (en)
FR (1) FR2249979B1 (en)
GB (1) GB1426849A (en)
IT (1) IT1020940B (en)
NL (1) NL186825C (en)
SE (1) SE7413961L (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8334226D0 (en) * 1983-12-22 1984-02-01 Learonal Uk Ltd Electrodeposition of gold alloys
GB8501245D0 (en) * 1985-01-18 1985-02-20 Engelhard Corp Gold electroplating bath
JPS61276992A (en) * 1985-05-30 1986-12-06 Shinko Electric Ind Co Ltd Gold electroplating solution
JPS61276990A (en) * 1985-05-30 1986-12-06 Shinko Electric Ind Co Ltd Gold electroplating solution
US4670107A (en) * 1986-03-05 1987-06-02 Vanguard Research Associates, Inc. Electrolyte solution and process for high speed gold plating
GB8612361D0 (en) * 1986-05-21 1986-06-25 Engelhard Corp Gold electroplating bath
JPS637390A (en) * 1986-06-26 1988-01-13 Nippon Engeruharudo Kk Gold-cobalt alloy plating liquid
US4744871A (en) * 1986-09-25 1988-05-17 Vanguard Research Associates, Inc. Electrolyte solution and process for gold electroplating
US4755264A (en) * 1987-05-29 1988-07-05 Vanguard Research Associates, Inc. Electrolyte solution and process for gold electroplating
CH680370A5 (en) * 1989-12-19 1992-08-14 H E Finishing Sa
GB2242200B (en) * 1990-02-20 1993-11-17 Omi International Plating compositions and processes
AU7320996A (en) 1995-11-03 1997-05-29 Enthone-Omi Inc Electroplating processes compositions and deposits
GB9522591D0 (en) * 1995-11-03 1996-01-03 Enthone Omi Suisse S A Electroplating processes compositions and deposits
DE19629658C2 (en) * 1996-07-23 1999-01-14 Degussa Cyanide-free galvanic bath for the deposition of gold and gold alloys
DE19745602C1 (en) * 1997-10-08 1999-07-15 Atotech Deutschland Gmbh Method and solution for the production of gold layers
EP1192297B1 (en) 1999-06-17 2007-01-10 Degussa Galvanotechnik GmbH Acidic bath for galvanic deposition of lustrous gold and gold alloy layers and lustring additive therfor
US20050205425A1 (en) * 2002-06-25 2005-09-22 Integran Technologies Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
US6805786B2 (en) * 2002-09-24 2004-10-19 Northrop Grumman Corporation Precious alloyed metal solder plating process
JP2011122192A (en) * 2009-12-09 2011-06-23 Ne Chemcat Corp Electrolytic hard gold plating liquid and plating method using the same
DE102011114931B4 (en) 2011-10-06 2013-09-05 Umicore Galvanotechnik Gmbh Process for more selective electrolytic deposition of gold or a gold alloy
DE102012004348B4 (en) 2012-03-07 2014-01-09 Umicore Galvanotechnik Gmbh Use of organic thiourea compounds to increase the galvanic deposition rate of gold and gold alloys
CN103397356B (en) * 2013-07-15 2017-04-19 苏州苏凯路化学科技有限公司 Non-toxic gold salt for gold plating and synthetic method thereof
CN107250440B (en) * 2015-01-16 2019-07-30 哈钦森技术股份有限公司 Golden electroplating solution and method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE534101A (en) * 1954-03-13
DE1075398B (en) * 1954-03-22 1960-02-11 DEHYDAG Deutsche Hydrierwerke G.m.b.H., Düsseldorf Bath for the galvanic production of metal coatings
NL230397A (en) * 1957-08-13
NL273924A (en) * 1961-01-24
US3149058A (en) * 1959-12-31 1964-09-15 Technic Bright gold plating process
US2967135A (en) * 1960-06-08 1961-01-03 Barnet D Ostrow Electroplating baths for hard bright gold deposits
USB373094I5 (en) * 1964-08-26

Also Published As

Publication number Publication date
JPS5615472B2 (en) 1981-04-10
SE7413961L (en) 1975-05-09
IT1020940B (en) 1977-12-30
DE2355581A1 (en) 1975-05-28
US3929595A (en) 1975-12-30
JPS5075531A (en) 1975-06-20
FR2249979A1 (en) 1975-05-30
DE2355581C3 (en) 1979-07-12
GB1426849A (en) 1976-03-03
CH603825A5 (en) 1978-08-31
NL186825C (en) 1991-03-01
FR2249979B1 (en) 1976-10-22
BR7409243A (en) 1976-05-18
NL7413010A (en) 1975-05-12
DE2355581B2 (en) 1978-11-16
BE821923A (en) 1975-05-06

Similar Documents

Publication Publication Date Title
ES430054A1 (en) Electrolytic burnished gold bath with higher rate of deposition
CA1009177A (en) Cyanide-free electroplating bath containing phosphonate ligands
JPS51151633A (en) Aqueous electroplating bath for depositing zinc
ES390675A1 (en) Electrodeposition of bright acid tin and electrolytes therefor
JPS5782490A (en) Plating of zinc from zinc electroplating bath using quarternary compound having plural nitrogen atom
IT1111409B (en) BATH FOR CATAPHORETIC ELECTRODEPOSITION, ESPECIALLY FOR ANTI-CORROSIVE METALLIFERROSIS COATING
AU497419B2 (en) Cyanide-free silver plating bath
CA1023687A (en) Bath for the electrodeposition of bright tin-cobalt alloy
SE415671B (en) Procedure for Electrolytic Precipitation of Zinc from an Alkaline, Cyanide-Free Zinc Plating Bath
AU458551B2 (en) Composition of baths for electrodeposition of bright zinc from aqueous, acid, electroplating baths
ES375824A1 (en) Copper electrodeposition electrolytes and method
AU471580B2 (en) An aqueous bath for the electrolytic deposition of gold or gold alloys
ES8101657A1 (en) Silver electrodeposition process
ES410652A1 (en) Electroless copper plating
YU106175A (en) Process for the electrolytic deposition of gold coatings
CA928902A (en) Electroless plating baths with improved deposition rates
CH613724A5 (en) Process and electroplating bath for the deposition of nickel/iron and nickel/cobalt/iron alloys, and process for the electrodeposition of nickel and/or cobalt from a bath which contains iron as an impurity
ES459571A1 (en) Electrodeposition of ruthenium
ES395741A1 (en) Acid galvanic copper bath
GB1047789A (en) Electrodeposition of silver
CA842773A (en) Electroplating bath for producing bright zinc deposits
SE415672B (en) Procedure for Electrolytic Precipitation of Zinc from an Alkaline, Cyanide-Free Zinc-containing Plating Bath
JPS5230845A (en) Pretreatment for the electro-deposition coating of metals
JPS5245538A (en) Method of preventing discoloration of watch case plated with plating solution incorporating paint
JPS51144342A (en) Alkali bright zinc electroplating bath