GB1426849A - Electroplating bath for depositing coatings of brilliant gold - Google Patents
Electroplating bath for depositing coatings of brilliant goldInfo
- Publication number
- GB1426849A GB1426849A GB4543774A GB4543774A GB1426849A GB 1426849 A GB1426849 A GB 1426849A GB 4543774 A GB4543774 A GB 4543774A GB 4543774 A GB4543774 A GB 4543774A GB 1426849 A GB1426849 A GB 1426849A
- Authority
- GB
- United Kingdom
- Prior art keywords
- gold
- bath
- electroplating bath
- plating
- sulphonic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
1426849 Gold electro-plating DEUTSCHE GOLD-UND SILBER SCHEIDEANSTALT 21 Oct 1974 [7 Nov 1973] 45437/74 Heading C7B A gold electro-plating bath contains at least one compound of a sulphonic acid or salt thereof with a heterocyclic nitrogen containing hydrocarbon, e.g. pyridine, picoline or quinoline sulphonic acid. The bath may contain KAu (CN)2, citric and/or tartaric acid and/or a phosphate or borate (e.g. KH 2 PO 4 ), an alkali (e.g.KoH) to pH 3À0-5À5 and optionally a water soluble salt (e.g. citrate) of Fe, Co, Ni, Cr, Cd, Cu, Zn, Su, In and/or Sb to give 5-100 mg/l of metal. When Fe is present a steel anode may be used. A c.d. up to 5A/dm<SP>2</SP> is possible at a deposition rate for 1 Ám as low as 36 seconds. The workpiece may be moved and the bath vibrated.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2355581A DE2355581C3 (en) | 1973-11-07 | 1973-11-07 | Galvanic bright gold bath with high deposition rate |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1426849A true GB1426849A (en) | 1976-03-03 |
Family
ID=5897412
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4543774A Expired GB1426849A (en) | 1973-11-07 | 1974-10-21 | Electroplating bath for depositing coatings of brilliant gold |
Country Status (12)
Country | Link |
---|---|
US (1) | US3929595A (en) |
JP (1) | JPS5615472B2 (en) |
BE (1) | BE821923A (en) |
BR (1) | BR7409243A (en) |
CH (1) | CH603825A5 (en) |
DE (1) | DE2355581C3 (en) |
ES (1) | ES430054A1 (en) |
FR (1) | FR2249979B1 (en) |
GB (1) | GB1426849A (en) |
IT (1) | IT1020940B (en) |
NL (1) | NL186825C (en) |
SE (1) | SE7413961L (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2242200A (en) * | 1990-02-20 | 1991-09-25 | Omi International | Plating compositions and processes |
GB2306508A (en) * | 1995-11-03 | 1997-05-07 | Enthone Omi | Gold-iron alloy electroplating processes compositions and deposits |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8334226D0 (en) * | 1983-12-22 | 1984-02-01 | Learonal Uk Ltd | Electrodeposition of gold alloys |
GB8501245D0 (en) * | 1985-01-18 | 1985-02-20 | Engelhard Corp | Gold electroplating bath |
JPS61276992A (en) * | 1985-05-30 | 1986-12-06 | Shinko Electric Ind Co Ltd | Gold electroplating solution |
JPS61276990A (en) * | 1985-05-30 | 1986-12-06 | Shinko Electric Ind Co Ltd | Gold electroplating solution |
US4670107A (en) * | 1986-03-05 | 1987-06-02 | Vanguard Research Associates, Inc. | Electrolyte solution and process for high speed gold plating |
GB8612361D0 (en) * | 1986-05-21 | 1986-06-25 | Engelhard Corp | Gold electroplating bath |
JPS637390A (en) * | 1986-06-26 | 1988-01-13 | Nippon Engeruharudo Kk | Gold-cobalt alloy plating liquid |
US4744871A (en) * | 1986-09-25 | 1988-05-17 | Vanguard Research Associates, Inc. | Electrolyte solution and process for gold electroplating |
US4755264A (en) * | 1987-05-29 | 1988-07-05 | Vanguard Research Associates, Inc. | Electrolyte solution and process for gold electroplating |
CH680370A5 (en) * | 1989-12-19 | 1992-08-14 | H E Finishing Sa | |
CN1200774A (en) | 1995-11-03 | 1998-12-02 | 恩索恩Omi公司 | Electroplating processes compositions and deposits |
DE19629658C2 (en) * | 1996-07-23 | 1999-01-14 | Degussa | Cyanide-free galvanic bath for the deposition of gold and gold alloys |
DE19745602C1 (en) * | 1997-10-08 | 1999-07-15 | Atotech Deutschland Gmbh | Method and solution for the production of gold layers |
JP3933930B2 (en) | 1999-06-17 | 2007-06-20 | デグサ ガルヴァノテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツング | Acid bath and electrodeposition brightener for electrodeposition of shiny gold and gold alloy layers |
US20050205425A1 (en) * | 2002-06-25 | 2005-09-22 | Integran Technologies | Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents |
US6805786B2 (en) * | 2002-09-24 | 2004-10-19 | Northrop Grumman Corporation | Precious alloyed metal solder plating process |
JP2011122192A (en) * | 2009-12-09 | 2011-06-23 | Ne Chemcat Corp | Electrolytic hard gold plating liquid and plating method using the same |
DE102011114931B4 (en) | 2011-10-06 | 2013-09-05 | Umicore Galvanotechnik Gmbh | Process for more selective electrolytic deposition of gold or a gold alloy |
DE102012004348B4 (en) | 2012-03-07 | 2014-01-09 | Umicore Galvanotechnik Gmbh | Use of organic thiourea compounds to increase the galvanic deposition rate of gold and gold alloys |
CN103397356B (en) * | 2013-07-15 | 2017-04-19 | 苏州苏凯路化学科技有限公司 | Non-toxic gold salt for gold plating and synthetic method thereof |
WO2016115494A1 (en) * | 2015-01-16 | 2016-07-21 | Hutchinson Technology Incorporated | Gold electroplating solution and method |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE534101A (en) * | 1954-03-13 | |||
BE534701A (en) * | 1954-03-22 | |||
BE570261A (en) * | 1957-08-13 | |||
NL273924A (en) * | 1961-01-24 | |||
US3149058A (en) * | 1959-12-31 | 1964-09-15 | Technic | Bright gold plating process |
US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
USB373094I5 (en) * | 1964-08-26 |
-
1973
- 1973-11-07 DE DE2355581A patent/DE2355581C3/en not_active Expired
-
1974
- 1974-09-14 ES ES430054A patent/ES430054A1/en not_active Expired
- 1974-10-02 NL NLAANVRAGE7413010,A patent/NL186825C/en not_active IP Right Cessation
- 1974-10-04 IT IT69975/74A patent/IT1020940B/en active
- 1974-10-18 JP JP12022574A patent/JPS5615472B2/ja not_active Expired
- 1974-10-21 GB GB4543774A patent/GB1426849A/en not_active Expired
- 1974-10-30 CH CH1453074A patent/CH603825A5/xx not_active IP Right Cessation
- 1974-11-04 US US520844A patent/US3929595A/en not_active Expired - Lifetime
- 1974-11-05 BR BR9243/74A patent/BR7409243A/en unknown
- 1974-11-06 BE BE6044809A patent/BE821923A/en not_active IP Right Cessation
- 1974-11-06 FR FR7436860A patent/FR2249979B1/fr not_active Expired
- 1974-11-06 SE SE7413961A patent/SE7413961L/xx unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2242200A (en) * | 1990-02-20 | 1991-09-25 | Omi International | Plating compositions and processes |
GB2242200B (en) * | 1990-02-20 | 1993-11-17 | Omi International | Plating compositions and processes |
GB2306508A (en) * | 1995-11-03 | 1997-05-07 | Enthone Omi | Gold-iron alloy electroplating processes compositions and deposits |
GB2306508B (en) * | 1995-11-03 | 1999-04-28 | Enthone Omi | Electroplating processes compositions and deposits |
Also Published As
Publication number | Publication date |
---|---|
IT1020940B (en) | 1977-12-30 |
DE2355581C3 (en) | 1979-07-12 |
DE2355581B2 (en) | 1978-11-16 |
NL7413010A (en) | 1975-05-12 |
ES430054A1 (en) | 1976-10-16 |
CH603825A5 (en) | 1978-08-31 |
US3929595A (en) | 1975-12-30 |
JPS5615472B2 (en) | 1981-04-10 |
DE2355581A1 (en) | 1975-05-28 |
SE7413961L (en) | 1975-05-09 |
FR2249979A1 (en) | 1975-05-30 |
NL186825C (en) | 1991-03-01 |
JPS5075531A (en) | 1975-06-20 |
BR7409243A (en) | 1976-05-18 |
BE821923A (en) | 1975-05-06 |
FR2249979B1 (en) | 1976-10-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PE20 | Patent expired after termination of 20 years |
Effective date: 19941020 |