GB1370387A - Electrochemical solutions and process - Google Patents

Electrochemical solutions and process

Info

Publication number
GB1370387A
GB1370387A GB5243972A GB5243972A GB1370387A GB 1370387 A GB1370387 A GB 1370387A GB 5243972 A GB5243972 A GB 5243972A GB 5243972 A GB5243972 A GB 5243972A GB 1370387 A GB1370387 A GB 1370387A
Authority
GB
United Kingdom
Prior art keywords
ligand
phosphonate
metal ion
metal
nov
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5243972A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Monsanto Co
Original Assignee
Monsanto Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monsanto Co filed Critical Monsanto Co
Publication of GB1370387A publication Critical patent/GB1370387A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)

Abstract

1370387 Plating bath MONSANTO CO 14 Nov 1972 [15 Nov 1971(2)] 52439/72 Heading C7B A plating bath comprises an aqueous solution of an ethylenediamine tetra (methylene=phosphonate) ligand and a complex of a metal ion and a 1-hydroxy ethylidene-1, 1-diphosphonate ligand. It may also comprise a complex of a metal ion and an amino tri (methylene=phosphonate) ligand. O II The phosphonate group may be -P(OM) 2 where M=hydrogen, alkali metal, ammonium or alkyl ammonium. The metal ion may be Ag, Au, Cu, Sn, Fe, Ni, Zn, Co or Cd. The metal may comprise 0À1-5À0 wt per cent of the solution. Both additions may be buffers, levelling agents and brighteners such as selenites, arsenites, aldehydes and ketones. The pH may be 6-13 Cu/ Ni or Cu/Zn may be co-deposited. The substrate may be Zn, Fe, brass, steel or Al.
GB5243972A 1971-11-15 1972-11-14 Electrochemical solutions and process Expired GB1370387A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US19902871A 1971-11-15 1971-11-15
US19903671A 1971-11-15 1971-11-15

Publications (1)

Publication Number Publication Date
GB1370387A true GB1370387A (en) 1974-10-16

Family

ID=26894390

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5243972A Expired GB1370387A (en) 1971-11-15 1972-11-14 Electrochemical solutions and process

Country Status (7)

Country Link
US (2) US3706635A (en)
JP (1) JPS568113B2 (en)
BE (1) BE791401A (en)
CA (1) CA1009177A (en)
DE (1) DE2255728C2 (en)
FR (1) FR2160458B1 (en)
GB (1) GB1370387A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2133040A (en) * 1983-01-03 1984-07-18 Omi Int Corp Copper plating bath process and anode therefore
USH325H (en) 1980-07-30 1987-09-01 Richardson Chemical Company Electroless deposition of transition metals

Families Citing this family (45)

* Cited by examiner, † Cited by third party
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US3914162A (en) * 1973-06-25 1975-10-21 Monsanto Co Compositions and process for the electrodeposition of metals
DE2333127C2 (en) * 1973-06-29 1982-04-15 Wabco Fahrzeugbremsen Gmbh, 3000 Hannover Anti-lock control system for pressure medium-actuated vehicle brakes
FR2244708B1 (en) * 1973-09-25 1977-08-12 Ugine Kuhlmann
USRE31511E (en) 1978-08-07 1984-01-31 The Robbins Company Rotary cutterhead for an earth boring machine
US4193637A (en) * 1978-08-07 1980-03-18 The Robbins Company Rotary cutterhead for an earth boring machine
US4197172A (en) * 1979-04-05 1980-04-08 American Chemical & Refining Company Incorporated Gold plating composition and method
US4265715A (en) * 1979-07-13 1981-05-05 Oxy Metal Industries Corporation Silver electrodeposition process
US4253920A (en) * 1980-03-20 1981-03-03 American Chemical & Refining Company, Incorporated Composition and method for gold plating
US4396471A (en) * 1981-12-14 1983-08-02 American Chemical & Refining Company, Inc. Gold plating bath and method using maleic anhydride polymer chelate
US4469569A (en) * 1983-01-03 1984-09-04 Omi International Corporation Cyanide-free copper plating process
US4935065A (en) * 1986-08-22 1990-06-19 Ecolab Inc. Phosphate-free alkaline detergent for cleaning-in-place of food processing equipment
US4904354A (en) * 1987-04-08 1990-02-27 Learonal Inc. Akaline cyanide-free Cu-Zu strike baths and electrodepositing processes for the use thereof
US4933051A (en) * 1989-07-24 1990-06-12 Omi International Corporation Cyanide-free copper plating process
US5559035A (en) * 1992-08-24 1996-09-24 Umpqua Research Company Solid phase calibration standards
US5266212A (en) * 1992-10-13 1993-11-30 Enthone-Omi, Inc. Purification of cyanide-free copper plating baths
US5607570A (en) * 1994-10-31 1997-03-04 Rohbani; Elias Electroplating solution
US5736256A (en) * 1995-05-31 1998-04-07 Howard A. Fromson Lithographic printing plate treated with organo-phosphonic acid chelating compounds and processes relating thereto
US5683568A (en) * 1996-03-29 1997-11-04 University Of Tulsa Electroplating bath for nickel-iron alloys and method
JP2943691B2 (en) * 1996-04-25 1999-08-30 日本電気株式会社 Plasma processing equipment
US6921467B2 (en) 1996-07-15 2005-07-26 Semitool, Inc. Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces
US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
TWI223678B (en) * 1998-03-20 2004-11-11 Semitool Inc Process for applying a metal structure to a workpiece, the treated workpiece and a solution for electroplating copper
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
JP4288010B2 (en) 1999-04-13 2009-07-01 セミトゥール・インコーポレイテッド Workpiece processing apparatus having a processing chamber for improving the flow of processing fluid
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
AU2001282879A1 (en) 2000-07-08 2002-01-21 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
WO2003018874A2 (en) 2001-08-31 2003-03-06 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6974767B1 (en) * 2002-02-21 2005-12-13 Advanced Micro Devices, Inc. Chemical solution for electroplating a copper-zinc alloy thin film
US6893505B2 (en) * 2002-05-08 2005-05-17 Semitool, Inc. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
US20060076036A1 (en) * 2004-10-12 2006-04-13 Whitefield Bruce J Metal removal from solvent
DE502007002479D1 (en) * 2007-02-14 2010-02-11 Umicore Galvanotechnik Gmbh Copper-tin electrolyte and process for the deposition of bronze layers
JP5554121B2 (en) * 2010-03-31 2014-07-23 富士フイルム株式会社 Polishing liquid and polishing method
DE102013021502A1 (en) * 2013-12-19 2015-06-25 Schlenk Metallfolien Gmbh & Co. Kg Electrically conductive fluids based on metal diphosphonate complexes
US20160145756A1 (en) * 2014-11-21 2016-05-26 Rohm And Haas Electronic Materials Llc Environmentally friendly gold electroplating compositions and methods
US11618951B2 (en) 2020-05-27 2023-04-04 Global Circuit Innovations Incorporated Chemical evaporation control system
RU2762733C1 (en) * 2021-02-18 2021-12-22 Федеральное государственное бюджетное образовательное учреждение высшего образования "Российский химико-технологический университет имени Д.И. Менделеева" (РХТУ им. Д.И. Менделеева) Solution for chemical nickeling of metal products

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1458492A (en) * 1964-09-22 1966-03-04 Monsanto Co Compositions and process for electrochemical reactions, in particular electroplating, as well as articles conforming to those obtained
DE1496916B1 (en) * 1964-09-22 1969-10-23 Monsanto Co Cyanide-free, galvanic bath and process for the deposition of galvanic coatings
FR1539226A (en) * 1966-09-16 1968-09-13 Process for producing deposits of gold or a gold-based alloy
FR96342E (en) * 1967-12-09 1972-06-16
DE1909144B2 (en) * 1969-02-20 1977-09-08 Schering Ag, 1000 Berlin Und 4619 Bergkamen BATH FOR GALVANIC DEPOSITION OF GLAZING GOLD ALLOY DEPOSIT
CA965729A (en) * 1969-05-15 1975-04-08 Fred I. Nobel Cyanide free electroplating solutions

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USH325H (en) 1980-07-30 1987-09-01 Richardson Chemical Company Electroless deposition of transition metals
GB2133040A (en) * 1983-01-03 1984-07-18 Omi Int Corp Copper plating bath process and anode therefore

Also Published As

Publication number Publication date
FR2160458B1 (en) 1975-01-03
JPS4861337A (en) 1973-08-28
US3706634A (en) 1972-12-19
BE791401A (en) 1973-05-14
DE2255728C2 (en) 1982-07-01
JPS568113B2 (en) 1981-02-21
DE2255728A1 (en) 1973-05-24
CA1009177A (en) 1977-04-26
US3706635A (en) 1972-12-19
FR2160458A1 (en) 1973-06-29

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee