CA928902A - Electroless plating baths with improved deposition rates - Google Patents

Electroless plating baths with improved deposition rates

Info

Publication number
CA928902A
CA928902A CA110714A CA110714A CA928902A CA 928902 A CA928902 A CA 928902A CA 110714 A CA110714 A CA 110714A CA 110714 A CA110714 A CA 110714A CA 928902 A CA928902 A CA 928902A
Authority
CA
Canada
Prior art keywords
electroless plating
deposition rates
plating baths
improved deposition
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA110714A
Other versions
CA110714S (en
Inventor
Paunovic Milan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Application granted granted Critical
Publication of CA928902A publication Critical patent/CA928902A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
CA110714A 1970-06-04 1971-04-19 Electroless plating baths with improved deposition rates Expired CA928902A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4355370A 1970-06-04 1970-06-04

Publications (1)

Publication Number Publication Date
CA928902A true CA928902A (en) 1973-06-26

Family

ID=21927745

Family Applications (1)

Application Number Title Priority Date Filing Date
CA110714A Expired CA928902A (en) 1970-06-04 1971-04-19 Electroless plating baths with improved deposition rates

Country Status (3)

Country Link
US (1) US3645749A (en)
JP (1) JPS526928B1 (en)
CA (1) CA928902A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3963842A (en) * 1974-06-20 1976-06-15 London Laboratories Limited Co. Deposition of copper
JPS5147535A (en) * 1974-10-22 1976-04-23 Toko Inc DOMUDEN KAIMETSUKYOKU
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
US4935267A (en) * 1987-05-08 1990-06-19 Nippondenso Co., Ltd. Process for electrolessly plating copper and plating solution therefor
JP3986743B2 (en) * 2000-10-03 2007-10-03 株式会社日立製作所 WIRING BOARD, MANUFACTURING METHOD THEREOF, AND ELECTROLESS COPPER PLATING LIQUID USED FOR THE SAME
US10773817B1 (en) 2018-03-08 2020-09-15 Northrop Grumman Systems Corporation Bi-directional flow ram air system for an aircraft

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions

Also Published As

Publication number Publication date
JPS526928B1 (en) 1977-02-25
US3645749A (en) 1972-02-29

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