CA979603A - Electroless copper plating - Google Patents

Electroless copper plating

Info

Publication number
CA979603A
CA979603A CA134,344A CA134344A CA979603A CA 979603 A CA979603 A CA 979603A CA 134344 A CA134344 A CA 134344A CA 979603 A CA979603 A CA 979603A
Authority
CA
Canada
Prior art keywords
copper plating
electroless copper
electroless
plating
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA134,344A
Other versions
CA134344S (en
Inventor
Michael Gulla
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Application granted granted Critical
Publication of CA979603A publication Critical patent/CA979603A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CA134,344A 1971-05-20 1972-02-09 Electroless copper plating Expired CA979603A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14550871A 1971-05-20 1971-05-20

Publications (1)

Publication Number Publication Date
CA979603A true CA979603A (en) 1975-12-16

Family

ID=22513423

Family Applications (1)

Application Number Title Priority Date Filing Date
CA134,344A Expired CA979603A (en) 1971-05-20 1972-02-09 Electroless copper plating

Country Status (5)

Country Link
US (1) US3661597A (en)
JP (1) JPS5236089B1 (en)
CA (1) CA979603A (en)
GB (1) GB1352087A (en)
IT (1) IT946822B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3751289A (en) * 1971-08-20 1973-08-07 M & T Chemicals Inc Method of preparing surfaces for electroplating
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution
DE3473890D1 (en) * 1983-07-25 1988-10-13 Hitachi Ltd Electroless copper plating solution
DE3585017D1 (en) * 1984-09-27 1992-02-06 Toshiba Kawasaki Kk CURRENT COPPER PLATING SOLUTION.
US4600609A (en) * 1985-05-03 1986-07-15 Macdermid, Incorporated Method and composition for electroless nickel deposition
US5120578A (en) * 1990-05-31 1992-06-09 Shipley Company Inc. Coating composition
US5075039A (en) * 1990-05-31 1991-12-24 Shipley Company Inc. Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles
US5288313A (en) * 1990-05-31 1994-02-22 Shipley Company Inc. Electroless plating catalyst
US6395402B1 (en) 1999-06-09 2002-05-28 Laird Technologies, Inc. Electrically conductive polymeric foam and method of preparation thereof
US20050121327A1 (en) * 2003-12-04 2005-06-09 Giin-Shan Chen Electroless-plated deposit process for silicon based dielectric insulating material
EP1793013B1 (en) * 2005-12-05 2017-07-19 Rohm and Haas Electronic Materials LLC Metallization of dielectrics
EP2639335B1 (en) * 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkaline plating bath for electroless deposition of cobalt alloys
TWI707061B (en) * 2015-11-27 2020-10-11 德商德國艾托特克公司 Plating bath composition and method for electroless plating of palladium

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3472664A (en) * 1966-09-15 1969-10-14 Enthone Inhibiting stardusting in electroless copper plating
US3457089A (en) * 1967-04-07 1969-07-22 Shipley Co Electroless copperplating

Also Published As

Publication number Publication date
GB1352087A (en) 1974-05-15
IT946822B (en) 1973-05-21
DE2205869B2 (en) 1976-02-19
DE2205869A1 (en) 1972-12-07
JPS5236089B1 (en) 1977-09-13
US3661597A (en) 1972-05-09

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