AU443206B2 - Electroless copper plating - Google Patents

Electroless copper plating

Info

Publication number
AU443206B2
AU443206B2 AU46811/72A AU4681172A AU443206B2 AU 443206 B2 AU443206 B2 AU 443206B2 AU 46811/72 A AU46811/72 A AU 46811/72A AU 4681172 A AU4681172 A AU 4681172A AU 443206 B2 AU443206 B2 AU 443206B2
Authority
AU
Australia
Prior art keywords
copper plating
electroless copper
electroless
plating
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU46811/72A
Other versions
AU4681172A (en
Inventor
JR. LUCIA H. SHIPLEY MICHAEL GULLA and OLEH BORYS BUTKEVYCH CHARLES R. SHIPLEY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to AU46811/72A priority Critical patent/AU443206B2/en
Application granted granted Critical
Publication of AU4681172A publication Critical patent/AU4681172A/en
Publication of AU443206B2 publication Critical patent/AU443206B2/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
AU46811/72A 1972-09-19 1972-09-19 Electroless copper plating Expired AU443206B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU46811/72A AU443206B2 (en) 1972-09-19 1972-09-19 Electroless copper plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AU46811/72A AU443206B2 (en) 1972-09-19 1972-09-19 Electroless copper plating

Publications (2)

Publication Number Publication Date
AU4681172A AU4681172A (en) 1973-12-13
AU443206B2 true AU443206B2 (en) 1973-12-13

Family

ID=3733762

Family Applications (1)

Application Number Title Priority Date Filing Date
AU46811/72A Expired AU443206B2 (en) 1972-09-19 1972-09-19 Electroless copper plating

Country Status (1)

Country Link
AU (1) AU443206B2 (en)

Also Published As

Publication number Publication date
AU4681172A (en) 1973-12-13

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