CA989103A - Electroless copper tin plating solution and process - Google Patents

Electroless copper tin plating solution and process

Info

Publication number
CA989103A
CA989103A CA161,510A CA161510A CA989103A CA 989103 A CA989103 A CA 989103A CA 161510 A CA161510 A CA 161510A CA 989103 A CA989103 A CA 989103A
Authority
CA
Canada
Prior art keywords
plating solution
electroless copper
tin plating
copper tin
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA161,510A
Other versions
CA161510S (en
Inventor
Kenneth J. Hacias
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Finishing Corp
Original Assignee
Oxy Metal Finishing Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Finishing Corp filed Critical Oxy Metal Finishing Corp
Application granted granted Critical
Publication of CA989103A publication Critical patent/CA989103A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48Coating with alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CA161,510A 1972-01-17 1973-01-17 Electroless copper tin plating solution and process Expired CA989103A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US21848572A 1972-01-17 1972-01-17
JP2626973A JPS5531181B2 (en) 1972-01-17 1973-03-07

Publications (1)

Publication Number Publication Date
CA989103A true CA989103A (en) 1976-05-18

Family

ID=26364024

Family Applications (1)

Application Number Title Priority Date Filing Date
CA161,510A Expired CA989103A (en) 1972-01-17 1973-01-17 Electroless copper tin plating solution and process

Country Status (7)

Country Link
US (1) US3736157A (en)
JP (1) JPS5531181B2 (en)
BE (1) BE793769A (en)
CA (1) CA989103A (en)
DE (1) DE2301639A1 (en)
FR (1) FR2168317B1 (en)
ZA (1) ZA73351B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993491A (en) * 1973-12-07 1976-11-23 Surface Technology, Inc. Electroless plating
JPS59108953U (en) * 1982-12-27 1984-07-23 富士通株式会社 reading stand
JPS60140158U (en) * 1984-02-28 1985-09-17 富士通株式会社 reading table
JPS6244356U (en) * 1985-08-30 1987-03-17
US5196053A (en) * 1991-11-27 1993-03-23 Mcgean-Rohco, Inc. Complexing agent for displacement tin plating

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1248419B (en) * 1964-08-17 1967-08-24 Collardin Gmbh Gerhard Immersion bath for the electroless deposition of copper-tin layers
DE1287394B (en) * 1965-09-09 1969-01-16 Collardin Gmbh Gerhard Process for the electroless deposition of copper-tin layers
DE1621291B2 (en) * 1967-08-05 1971-02-11 Metallgesellschaft Ag Process for the electroless production of a copper coating on iron and iron alloys

Also Published As

Publication number Publication date
ZA73351B (en) 1973-11-28
AU5116173A (en) 1974-07-18
FR2168317A1 (en) 1973-08-31
BE793769A (en) 1973-05-02
JPS5531181B2 (en) 1980-08-16
DE2301639A1 (en) 1973-07-26
US3736157A (en) 1973-05-29
FR2168317B1 (en) 1976-04-09
JPS49119832A (en) 1974-11-15

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