AU5116173A - Electroless copper tin plating solution and process - Google Patents

Electroless copper tin plating solution and process

Info

Publication number
AU5116173A
AU5116173A AU51161/73A AU5116173A AU5116173A AU 5116173 A AU5116173 A AU 5116173A AU 51161/73 A AU51161/73 A AU 51161/73A AU 5116173 A AU5116173 A AU 5116173A AU 5116173 A AU5116173 A AU 5116173A
Authority
AU
Australia
Prior art keywords
plating solution
electroless copper
tin plating
copper tin
electroless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU51161/73A
Other versions
AU478644B2 (en
Inventor
J. Macias Kenneth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Finishing Corp
Original Assignee
OMF California Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMF California Inc filed Critical OMF California Inc
Application granted granted Critical
Publication of AU478644B2 publication Critical patent/AU478644B2/en
Publication of AU5116173A publication Critical patent/AU5116173A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AU51161/73A 1972-01-17 1973-01-17 Electroless copper tin plating solution and process Expired AU478644B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US21848572A 1972-01-17 1972-01-17
USUS218485 1972-01-17
JP2626973A JPS5531181B2 (en) 1972-01-17 1973-03-07

Publications (2)

Publication Number Publication Date
AU478644B2 AU478644B2 (en) 1974-07-18
AU5116173A true AU5116173A (en) 1974-07-18

Family

ID=

Also Published As

Publication number Publication date
US3736157A (en) 1973-05-29
DE2301639A1 (en) 1973-07-26
FR2168317B1 (en) 1976-04-09
ZA73351B (en) 1973-11-28
FR2168317A1 (en) 1973-08-31
CA989103A (en) 1976-05-18
BE793769A (en) 1973-05-02
JPS5531181B2 (en) 1980-08-16
JPS49119832A (en) 1974-11-15

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