CA838568A - Electroless copper plating - Google Patents

Electroless copper plating

Info

Publication number
CA838568A
CA838568A CA838568DA CA838568A CA 838568 A CA838568 A CA 838568A CA 838568D A CA838568D A CA 838568DA CA 838568 A CA838568 A CA 838568A
Authority
CA
Canada
Prior art keywords
copper plating
electroless copper
electroless
plating
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Inventor
J. Zeblisky Rudolph
Frederick W. Schneble, Jr.
F. Mccormack John
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Publication date
Application granted granted Critical
Publication of CA838568A publication Critical patent/CA838568A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
CA838568D Electroless copper plating Expired CA838568A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA838568T

Publications (1)

Publication Number Publication Date
CA838568A true CA838568A (en) 1970-04-07

Family

ID=36322764

Family Applications (1)

Application Number Title Priority Date Filing Date
CA838568D Expired CA838568A (en) Electroless copper plating

Country Status (1)

Country Link
CA (1) CA838568A (en)

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