AU5622773A - Copper plating bath and process - Google Patents

Copper plating bath and process

Info

Publication number
AU5622773A
AU5622773A AU56227/73A AU5622773A AU5622773A AU 5622773 A AU5622773 A AU 5622773A AU 56227/73 A AU56227/73 A AU 56227/73A AU 5622773 A AU5622773 A AU 5622773A AU 5622773 A AU5622773 A AU 5622773A
Authority
AU
Australia
Prior art keywords
plating bath
copper plating
copper
bath
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU56227/73A
Other versions
AU477446B2 (en
Inventor
SILVESTER PAUL MALAYIL and DONALD ALAN ARCILESI OTTO KARDOS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M&T Chemicals Inc
Original Assignee
M&T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M&T Chemicals Inc filed Critical M&T Chemicals Inc
Application granted granted Critical
Publication of AU477446B2 publication Critical patent/AU477446B2/en
Publication of AU5622773A publication Critical patent/AU5622773A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AU56227/73A 1972-06-19 1973-05-29 Copper plating bath and process Expired AU477446B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
USUS264,193 1972-06-19
US00264193A US3804729A (en) 1972-06-19 1972-06-19 Electrolyte and process for electro-depositing copper

Publications (2)

Publication Number Publication Date
AU477446B2 AU477446B2 (en) 1974-12-05
AU5622773A true AU5622773A (en) 1974-12-05

Family

ID=

Also Published As

Publication number Publication date
FR2190943B1 (en) 1977-09-09
BR7304502D0 (en) 1974-08-15
AR200018A1 (en) 1974-10-15
JPS4952133A (en) 1974-05-21
US3804729A (en) 1974-04-16
FR2190943A1 (en) 1974-02-01
DE2331180C2 (en) 1982-12-23
GB1433039A (en) 1976-04-22
DE2331180A1 (en) 1974-01-17
NL7308515A (en) 1973-12-21
CA1038326A (en) 1978-09-12
ZA733838B (en) 1974-08-28
JPS5727189B2 (en) 1982-06-09
IT988460B (en) 1975-04-10

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