GB1433039A - Electrodeposition of copper and plating baths therefor - Google Patents

Electrodeposition of copper and plating baths therefor

Info

Publication number
GB1433039A
GB1433039A GB2685273A GB2685273A GB1433039A GB 1433039 A GB1433039 A GB 1433039A GB 2685273 A GB2685273 A GB 2685273A GB 2685273 A GB2685273 A GB 2685273A GB 1433039 A GB1433039 A GB 1433039A
Authority
GB
United Kingdom
Prior art keywords
hydrogen
groups
group
carbon atoms
heterocyclic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2685273A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M&T Chemicals Inc
Original Assignee
M&T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M&T Chemicals Inc filed Critical M&T Chemicals Inc
Publication of GB1433039A publication Critical patent/GB1433039A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Abstract

1433039 Composition for electrodeposition M & T CHEMICALS Inc 5 June 1973 [19 June 1972] 26852/73 Heading C3R [Also in Divisions C6-C7] A mixture for addition to an aqueous acidic chloride copper plating bath comprising (a) a polysulphide compound of the formula wherein n is 2 or more, R is a divalent or aromatic non-heterocyclic group of 1-10 carbon atoms, and R<SP>1</SP> is hydrogen, a metal cation, a monovalent aliphatic or aromatic group of 1-20 carbon atoms, or the group R-SO 3 M or R-(S) q -RSO 3 M where q = 2-5 and R is as above; (B) a heterocyclic sulphur compound containing the grouping wherein R<SP>11</SP> is hydrogen, a metal ion or one of the groups wherein R<SP>111</SP>, R<SP>111</SP> 0 and R<SP>111</SP> 00 are chosen from hydrogen, alkyl groups of 1-6 carbon atoms, aryl, alkaryl or alalkyl groups, and wherein the nitrogen atom and the two carbon atoms are part of a heterocyclic ring, or a heterocyclic sulphur compound having the formula or a tautomer thereof, a N-oxide of the compound, an isothiourea derivative, isothioamide derivative or dithiocarbamate derivative thereof where R 10 is hydrogen, a metal cation or chosen from the groups wherein R<SP>11</SP> 8 and R<SP>11</SP> 9 are chosen from hydrogen, alkyl atoms, aryl, alkaryl, or aralkyl groups, X is -CR<SP>11</SP> 8 = or -C(R<SP>11</SP> 8 )(R<SP>11</SP> 9 ) = wherein R<SP>11</SP> 8 and R<SP>11</SP> 9 are as defined above, and Y is a divalent organo group forming one or more cyclic ring structures with the group wherein X and R 10 are as defined above; and (c) a polyether containing at least 5 ether oxygen molecules per atom.
GB2685273A 1972-06-19 1973-06-05 Electrodeposition of copper and plating baths therefor Expired GB1433039A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00264193A US3804729A (en) 1972-06-19 1972-06-19 Electrolyte and process for electro-depositing copper

Publications (1)

Publication Number Publication Date
GB1433039A true GB1433039A (en) 1976-04-22

Family

ID=23004985

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2685273A Expired GB1433039A (en) 1972-06-19 1973-06-05 Electrodeposition of copper and plating baths therefor

Country Status (11)

Country Link
US (1) US3804729A (en)
JP (1) JPS5727189B2 (en)
AR (1) AR200018A1 (en)
BR (1) BR7304502D0 (en)
CA (1) CA1038326A (en)
DE (1) DE2331180C2 (en)
FR (1) FR2190943B1 (en)
GB (1) GB1433039A (en)
IT (1) IT988460B (en)
NL (1) NL7308515A (en)
ZA (1) ZA733838B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2746938A1 (en) * 1977-10-17 1979-04-19 Schering Ag ACID GALVANIC COPPER BATH
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
DE4126502C1 (en) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3542655A (en) * 1968-04-29 1970-11-24 M & T Chemicals Inc Electrodeposition of copper
US3682788A (en) * 1970-07-28 1972-08-08 M & T Chemicals Inc Copper electroplating

Also Published As

Publication number Publication date
DE2331180A1 (en) 1974-01-17
JPS4952133A (en) 1974-05-21
DE2331180C2 (en) 1982-12-23
ZA733838B (en) 1974-08-28
FR2190943A1 (en) 1974-02-01
FR2190943B1 (en) 1977-09-09
BR7304502D0 (en) 1974-08-15
JPS5727189B2 (en) 1982-06-09
AR200018A1 (en) 1974-10-15
AU5622773A (en) 1974-12-05
NL7308515A (en) 1973-12-21
CA1038326A (en) 1978-09-12
IT988460B (en) 1975-04-10
US3804729A (en) 1974-04-16

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee