GB872879A - Electrolytic copper-plating baths - Google Patents

Electrolytic copper-plating baths

Info

Publication number
GB872879A
GB872879A GB11122/60A GB1112260A GB872879A GB 872879 A GB872879 A GB 872879A GB 11122/60 A GB11122/60 A GB 11122/60A GB 1112260 A GB1112260 A GB 1112260A GB 872879 A GB872879 A GB 872879A
Authority
GB
United Kingdom
Prior art keywords
copper
plating baths
lustring
agent
compounds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB11122/60A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DEHYDAG GmbH
Dehydag Deutsche Hydrierwerke GmbH
Original Assignee
DEHYDAG GmbH
Dehydag Deutsche Hydrierwerke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DEHYDAG GmbH, Dehydag Deutsche Hydrierwerke GmbH filed Critical DEHYDAG GmbH
Publication of GB872879A publication Critical patent/GB872879A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Abstract

872,879. Copper-plating baths. DEHYDAG DEUTSCHE HYDRIERWERKE G.m.b.H. March 30, 1960 [May 6, 1959], No. 11122/60. Class 41. Copper-plating baths include as levelling- agent (1) an alkyl or aryl thiourea containing a carboxy group linked to N, together with (2) a lustring agent. Compounds (1) include N- phenyl-N<1>-carboxymethyl thiourea, and the corresponding N - butyl - N<1> - 4 - carboxyphenyl derivative. Lustring agents (2) preferred, contain one or more C atoms linked solely to hetero atoms, a short alkyl group linked to an S atom, and a sulphonic group, e.g. N,N-pentamethylene dithiocarbamic acid-n-propyl-ester sodium sulphonate. The ductility of the copper coating may be improved by adding amino compounds free of carboxy groups, e.g. 1 : 3-propylene diamine, or their derivatives containing sulphonic acid or sulphuric ester groups, or halogen compounds of tertiary amines, e.g. 2 - diethylamino - 3 - chloro - propanol-2.
GB11122/60A 1961-02-20 1960-03-30 Electrolytic copper-plating baths Expired GB872879A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DED35441A DE1142741B (en) 1961-02-20 1961-02-20 Acid galvanic copper baths

Publications (1)

Publication Number Publication Date
GB872879A true GB872879A (en) 1961-07-12

Family

ID=7042639

Family Applications (2)

Application Number Title Priority Date Filing Date
GB11122/60A Expired GB872879A (en) 1961-02-20 1960-03-30 Electrolytic copper-plating baths
GB44559/61A Expired GB919272A (en) 1961-02-20 1961-12-13 Electrolytic copper plating baths

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB44559/61A Expired GB919272A (en) 1961-02-20 1961-12-13 Electrolytic copper plating baths

Country Status (3)

Country Link
US (2) US3023152A (en)
DE (1) DE1142741B (en)
GB (2) GB872879A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB872879A (en) * 1961-02-20 1961-07-12 Dehydag Gmbh Electrolytic copper-plating baths
JPS544329B2 (en) * 1973-03-20 1979-03-06
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
KR20040073974A (en) * 2003-02-14 2004-08-21 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. Electroplating composition
DE102014208733A1 (en) 2014-05-09 2015-11-12 Dr. Hesse Gmbh & Cie Kg Process for the electrolytic deposition of copper from water-based electrolytes

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2563360A (en) * 1941-05-24 1951-08-07 Gen Motors Corp Electrodeposition of copper
US2696467A (en) * 1952-01-04 1954-12-07 Gen Motors Corp Copper plating bath and process
US2738318A (en) * 1954-12-28 1956-03-13 Udylite Res Corp Electrodeposition of copper from an acid bath
BE565994A (en) * 1957-04-16
US2954331A (en) * 1958-08-14 1960-09-27 Dayton Bright Copper Company Bright copper plating bath
GB872879A (en) * 1961-02-20 1961-07-12 Dehydag Gmbh Electrolytic copper-plating baths

Also Published As

Publication number Publication date
DE1142741B (en) 1963-01-24
US3179578A (en) 1965-04-20
US3023152A (en) 1962-02-27
GB919272A (en) 1963-02-20

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