GB902082A - Baths for the production of electrolytic copper coatings - Google Patents
Baths for the production of electrolytic copper coatingsInfo
- Publication number
- GB902082A GB902082A GB33513/58A GB3351358A GB902082A GB 902082 A GB902082 A GB 902082A GB 33513/58 A GB33513/58 A GB 33513/58A GB 3351358 A GB3351358 A GB 3351358A GB 902082 A GB902082 A GB 902082A
- Authority
- GB
- United Kingdom
- Prior art keywords
- atom
- examples
- plating baths
- electrolytic copper
- lustering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 238000000576 coating method Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- -1 polymethylene chain Polymers 0.000 abstract 2
- YMDNODNLFSHHCV-UHFFFAOYSA-N 2-chloro-n,n-diethylethanamine Chemical compound CCN(CC)CCCl YMDNODNLFSHHCV-UHFFFAOYSA-N 0.000 abstract 1
- CJXBHFANXQMZBF-UHFFFAOYSA-N 2-phenylethanethioamide Chemical compound NC(=S)CC1=CC=CC=C1 CJXBHFANXQMZBF-UHFFFAOYSA-N 0.000 abstract 1
- QIOZLISABUUKJY-UHFFFAOYSA-N Thiobenzamide Chemical compound NC(=S)C1=CC=CC=C1 QIOZLISABUUKJY-UHFFFAOYSA-N 0.000 abstract 1
- 125000002015 acyclic group Chemical group 0.000 abstract 1
- 238000007792 addition Methods 0.000 abstract 1
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 125000003710 aryl alkyl group Chemical group 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- 125000004432 carbon atom Chemical group C* 0.000 abstract 1
- 125000004122 cyclic group Chemical group 0.000 abstract 1
- 125000000753 cycloalkyl group Chemical group 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- AEOCXXJPGCBFJA-UHFFFAOYSA-N ethionamide Chemical compound CCC1=CC(C(N)=S)=CC=N1 AEOCXXJPGCBFJA-UHFFFAOYSA-N 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 239000008233 hard water Substances 0.000 abstract 1
- 125000005842 heteroatom Chemical group 0.000 abstract 1
- 125000004433 nitrogen atom Chemical group N* 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 abstract 1
- 125000004434 sulfur atom Chemical group 0.000 abstract 1
- 239000000080 wetting agent Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Hydrogenated Pyridines (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
Abstract
902,082. Copper electrolytic plating baths. DEHYDAG DEUTSCHE HYDRIERWERKE G.m.b.H. Oct. 21, 1958 [Nov. 30, 1957], No. 33513/58. Class 41. Electrolytic copper plating baths include (1) a lustering agent in which a C atom is linked to hetero atoms and linked via a S or N atom to group conferring solubility, e.g. a sulphonic group, and (2) a cyclic or acyclic derivative of a thio amide of formula where R, R<SP>1</SP>, R<SP>11</SP> are aliphatic, aromatic, aralkyl, or cycloalkyl residues, but R<SP>1</SP> or R<SP>11</SP> may also be H, or a polymethylene chain. Examples of (2) include thiobenzamide, phenyl thioacetamide, thioaceto-m-chloranilide, o-hydroxy thiobenzopiperidine, and butyrothiolactam. Examples of lustering agents (1) are N: N-diethyl dithio carbamic acid ethyl ester- #-sulphonic acid. Optional additions are wetting agents reducing the effect of hard water, e.g. 2-diethyl amino-ethyl chloride, and halogen salts of quaternary ammonium compounds, Specifications 762,257, 784,091, 806,403, 807,574. 815,908, 817,133, 823,152, 847,841 and 884,035 are referred to.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DED26934A DE1084098B (en) | 1957-11-30 | 1957-11-30 | Acid baths for the production of galvanic copper coatings |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB902082A true GB902082A (en) | 1962-07-25 |
Family
ID=7039058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB33513/58A Expired GB902082A (en) | 1957-11-30 | 1958-10-21 | Baths for the production of electrolytic copper coatings |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3051634A (en) |
| BE (1) | BE572016A (en) |
| CH (1) | CH375581A (en) |
| DE (1) | DE1084098B (en) |
| FR (1) | FR1227239A (en) |
| GB (1) | GB902082A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1184172B (en) * | 1961-08-31 | 1964-12-23 | Dehydag Gmbh | Process for the galvanic deposition of firmly adhering and high-gloss copper coatings |
| DE1184584B (en) * | 1963-02-07 | 1964-12-31 | Langbein Pfanhauser Werke Ag | Acid galvanic bath, especially acidic copper bath |
| US3414493A (en) * | 1965-10-19 | 1968-12-03 | Lea Ronal Inc | Electrodeposition of copper |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| EP2568063A1 (en) * | 2011-09-09 | 2013-03-13 | Rohm and Haas Electronic Materials LLC | Low internal stress copper electroplating method |
| CN102995077B (en) * | 2012-12-28 | 2014-12-31 | 武汉吉和昌化工科技有限公司 | Cyanide-free alkaline bright copper plating solution and preparation method and electroplating process thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2489538A (en) * | 1941-05-24 | 1949-11-29 | Gen Motors Corp | Electrodeposition of copper |
| US2663684A (en) * | 1952-06-02 | 1953-12-22 | Houdaille Hershey Corp | Method of and composition for plating copper |
| DE1001078B (en) * | 1953-08-13 | 1957-01-17 | Dehydag Gmbh | Galvanic baths for the production of metal coatings |
| US2773022A (en) * | 1953-08-17 | 1956-12-04 | Westinghouse Electric Corp | Electrodeposition from copper electrolytes containing dithiocarbamate addition agents |
| NL110737C (en) * | 1953-09-19 | |||
| DE1007592B (en) * | 1955-01-19 | 1957-05-02 | Dehydag Gmbh | Bath for the production of galvanic metal coatings |
| NL217034A (en) * | 1956-06-15 |
-
0
- BE BE572016D patent/BE572016A/xx unknown
-
1957
- 1957-11-30 DE DED26934A patent/DE1084098B/en active Pending
-
1958
- 1958-09-18 CH CH6407758A patent/CH375581A/en unknown
- 1958-10-21 GB GB33513/58A patent/GB902082A/en not_active Expired
- 1958-11-21 US US775354A patent/US3051634A/en not_active Expired - Lifetime
- 1958-11-28 FR FR780323A patent/FR1227239A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR1227239A (en) | 1960-08-19 |
| US3051634A (en) | 1962-08-28 |
| DE1084098B (en) | 1960-06-23 |
| BE572016A (en) | |
| CH375581A (en) | 1964-02-29 |
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