GB1354840A - Electro deposition of copper from acidic baths - Google Patents

Electro deposition of copper from acidic baths

Info

Publication number
GB1354840A
GB1354840A GB5059472A GB5059472A GB1354840A GB 1354840 A GB1354840 A GB 1354840A GB 5059472 A GB5059472 A GB 5059472A GB 5059472 A GB5059472 A GB 5059472A GB 1354840 A GB1354840 A GB 1354840A
Authority
GB
United Kingdom
Prior art keywords
sulphonium
electro
propanesulphonate
brighteners
bis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5059472A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Inc filed Critical LeaRonal Inc
Publication of GB1354840A publication Critical patent/GB1354840A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

1354840 Electro-plating bright copper LEA-RONAL Inc 2 Nov 1972 [27 April 1972] 50594/72 Heading C7B An aqueous acid Cu electro-plating bath comprises a Cu salt, e.g. sulphate, sulphamate or fluoborate with the corresponding acid, and as brightener a sulphoniumalkane sulphonate or carboxylate compound of formula:- RRS<SP>+</SP>-(CH 2 or C 2 H 4 ) 1-6 -(SO 3 or COO)<SP>-</SP> in which each R (same or different) is chosen from H; C 1 -C 8 alkyl; C 6 -C 12 aryl; in which each R<SP>1</SP> is C 1 -C 6 alkyl and r is 1 or O. Many examples are specified, e.g. 3-(cyclohexylamino-2-benzothiazolyl sulphonium)-1- propane sulphonate bis(dimethylthiocarbamyl) - sulphonium-1-propanesulphonate or carboxylate; and bis(benzothiazole)-thio-2-sulphonium-1- propanesulphonate. The bath may also contain other brighteners or levellers: (methoxy) polyethylene glycols; amine or triphenyl methane dyes e.g. Methyl Violet; and/or aminothiazoles or aminothiazolines e.g. 2-thiazolidinethione. The Cu salt may be added as CuCO 3 e.g. with HBF 4 . Prior brighteners are disclosed as alkane mercapto sulphonates or carboxylates. The substrate may be a printed circuit board.
GB5059472A 1972-04-27 1972-11-02 Electro deposition of copper from acidic baths Expired GB1354840A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24816072A 1972-04-27 1972-04-27

Publications (1)

Publication Number Publication Date
GB1354840A true GB1354840A (en) 1974-06-05

Family

ID=22937944

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5059472A Expired GB1354840A (en) 1972-04-27 1972-11-02 Electro deposition of copper from acidic baths

Country Status (4)

Country Link
US (1) US3725220A (en)
DE (1) DE2255584C2 (en)
FR (1) FR2186544B1 (en)
GB (1) GB1354840A (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038161A (en) * 1976-03-05 1977-07-26 R. O. Hull & Company, Inc. Acid copper plating and additive composition therefor
US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
WO1997011591A1 (en) * 1995-09-22 1997-03-27 Minnesota Mining And Manufacturing Company Flexible circuits with bumped interconnection capability
US6024857A (en) * 1997-10-08 2000-02-15 Novellus Systems, Inc. Electroplating additive for filling sub-micron features
US6309969B1 (en) 1998-11-03 2001-10-30 The John Hopkins University Copper metallization structure and method of construction
WO2000026444A1 (en) * 1998-11-03 2000-05-11 The John Hopkins University Copper metallization structure and method of construction
US6652731B2 (en) * 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US6709568B2 (en) 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
US7297247B2 (en) * 2003-05-06 2007-11-20 Applied Materials, Inc. Electroformed sputtering target
US20050067304A1 (en) * 2003-09-26 2005-03-31 King Mackenzie E. Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US6984299B2 (en) * 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
CN101065519B (en) * 2004-11-24 2011-04-20 住友电气工业株式会社 Molten salt bath, precipitate, and process for producing metal precipitate
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US8647484B2 (en) * 2005-11-25 2014-02-11 Applied Materials, Inc. Target for sputtering chamber
US8968536B2 (en) * 2007-06-18 2015-03-03 Applied Materials, Inc. Sputtering target having increased life and sputtering uniformity
US7887693B2 (en) * 2007-06-22 2011-02-15 Maria Nikolova Acid copper electroplating bath composition
US7901552B2 (en) 2007-10-05 2011-03-08 Applied Materials, Inc. Sputtering target with grooves and intersecting channels
CN115536561A (en) * 2022-10-11 2022-12-30 广东利尔化学有限公司 Brightener suitable for acidic copper electroplating solution and preparation method thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1007592B (en) * 1955-01-19 1957-05-02 Dehydag Gmbh Bath for the production of galvanic metal coatings
DE1152863B (en) * 1957-03-16 1963-08-14 Riedel & Co Acid baths for the production of leveling copper coatings
NL274211A (en) * 1961-02-02
DE1177142B (en) * 1961-07-08 1964-09-03 Dehydag Gmbh Process for the preparation of dithiocarbamic acid ester derivatives containing sulfonic acid groups
DE1184172B (en) * 1961-08-31 1964-12-23 Dehydag Gmbh Process for the galvanic deposition of firmly adhering and high-gloss copper coatings
DE1248415B (en) * 1964-03-07 1967-08-24 Dehydag Gmbh Acid galvanic copper baths
US3414493A (en) * 1965-10-19 1968-12-03 Lea Ronal Inc Electrodeposition of copper
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
SE322956B (en) * 1966-08-20 1970-04-20 Schering Ag
US3542655A (en) * 1968-04-29 1970-11-24 M & T Chemicals Inc Electrodeposition of copper

Also Published As

Publication number Publication date
DE2255584A1 (en) 1973-11-08
DE2255584C2 (en) 1983-02-17
FR2186544A1 (en) 1974-01-11
US3725220A (en) 1973-04-03
FR2186544B1 (en) 1976-06-04

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee