GB1000669A - Baths for the production of electrolytic metal coatings - Google Patents

Baths for the production of electrolytic metal coatings

Info

Publication number
GB1000669A
GB1000669A GB32909/62A GB3290962A GB1000669A GB 1000669 A GB1000669 A GB 1000669A GB 32909/62 A GB32909/62 A GB 32909/62A GB 3290962 A GB3290962 A GB 3290962A GB 1000669 A GB1000669 A GB 1000669A
Authority
GB
United Kingdom
Prior art keywords
baths
plating
production
butyl
sodium sulphonate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB32909/62A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DEHYDAG GmbH
Dehydag Deutsche Hydrierwerke GmbH
Original Assignee
DEHYDAG GmbH
Dehydag Deutsche Hydrierwerke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DEHYDAG GmbH, Dehydag Deutsche Hydrierwerke GmbH filed Critical DEHYDAG GmbH
Publication of GB1000669A publication Critical patent/GB1000669A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

Metal plating baths are improved by adding compounds of formula <FORM:1000669/C6-C7/1> where R is aliphatic, cycloaliphatic, or aromatic residue, X is a hetero atom, e.g. O, NH, NR, or S, R1 is a divalent hydrocarbon residue containing an aryl group, G is H or a base, either organic or inorganic. For example, N-butyl dithiocarbamic acid - S - benzyl ester - p - sodium sulphonate, n-butyl xanthogenic acid-S-naphthyl methyl ester-sodium sulphonate. The plating baths which may also include other lustering agents, wetting agents, and conducting salts, e.g. aluminium sulphate, may be applied to plating out Cu, Ni, Zn, Ag, Cd, bronze, or brass. Plating may be effected up to 70 DEG C., on bases of e.g. iron, steel, or zinc. A flash coat of copper from a cyanide bath may first be applied. Specification 888,493 is referred to.
GB32909/62A 1961-08-31 1962-08-28 Baths for the production of electrolytic metal coatings Expired GB1000669A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DED36927A DE1184172B (en) 1961-08-31 1961-08-31 Process for the galvanic deposition of firmly adhering and high-gloss copper coatings

Publications (1)

Publication Number Publication Date
GB1000669A true GB1000669A (en) 1965-08-11

Family

ID=7043356

Family Applications (1)

Application Number Title Priority Date Filing Date
GB32909/62A Expired GB1000669A (en) 1961-08-31 1962-08-28 Baths for the production of electrolytic metal coatings

Country Status (3)

Country Link
US (1) US3276979A (en)
DE (1) DE1184172B (en)
GB (1) GB1000669A (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1248415B (en) * 1964-03-07 1967-08-24 Dehydag Gmbh Acid galvanic copper baths
US3414493A (en) * 1965-10-19 1968-12-03 Lea Ronal Inc Electrodeposition of copper
US3518171A (en) * 1969-07-24 1970-06-30 Metalux Corp The Purification of nickel electroplating solutions
US3725220A (en) * 1972-04-27 1973-04-03 Lea Ronal Inc Electrodeposition of copper from acidic baths
US3878067A (en) * 1972-07-03 1975-04-15 Oxy Metal Finishing Corp Electrolyte and method for electrodepositing of bright nickel-iron alloy deposits
US3945894A (en) * 1975-04-11 1976-03-23 Oxy Metal Industries Corporation Bath composition and method of electrodepositing utilizing the same
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US6709568B2 (en) 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
US20050067304A1 (en) * 2003-09-26 2005-03-31 King Mackenzie E. Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US6984299B2 (en) * 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
US20070261963A1 (en) * 2006-02-02 2007-11-15 Advanced Technology Materials, Inc. Simultaneous inorganic, organic and byproduct analysis in electrochemical deposition solutions

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE888493C (en) * 1951-11-03 1953-09-03 Hydrierwerke A G Deutsche Process for the production of firmly adhering and shiny galvanic copper coatings
DE1001078B (en) * 1953-08-13 1957-01-17 Dehydag Gmbh Galvanic baths for the production of metal coatings
NL110737C (en) * 1953-09-19
DE1075398B (en) * 1954-03-22 1960-02-11 DEHYDAG Deutsche Hydrierwerke G.m.b.H., Düsseldorf Bath for the galvanic production of metal coatings
DE1152863B (en) * 1957-03-16 1963-08-14 Riedel & Co Acid baths for the production of leveling copper coatings
BE572016A (en) * 1957-11-30
BE572186A (en) * 1957-12-17

Also Published As

Publication number Publication date
US3276979A (en) 1966-10-04
DE1184172B (en) 1964-12-23

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