GB836978A - Electrodeposition of copper and copper alloys - Google Patents
Electrodeposition of copper and copper alloysInfo
- Publication number
- GB836978A GB836978A GB18211/58A GB1821158A GB836978A GB 836978 A GB836978 A GB 836978A GB 18211/58 A GB18211/58 A GB 18211/58A GB 1821158 A GB1821158 A GB 1821158A GB 836978 A GB836978 A GB 836978A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- zinc
- june
- metal
- baths
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 4
- 229910000881 Cu alloy Inorganic materials 0.000 title abstract 4
- 239000010949 copper Substances 0.000 title abstract 4
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 238000004070 electrodeposition Methods 0.000 title 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- -1 polyoxy Chemical group 0.000 abstract 2
- 239000011701 zinc Substances 0.000 abstract 2
- 229910052725 zinc Inorganic materials 0.000 abstract 2
- QNAYBMKLOCPYGJ-UHFFFAOYSA-N Alanine Chemical group CC([NH3+])C([O-])=O QNAYBMKLOCPYGJ-UHFFFAOYSA-N 0.000 abstract 1
- 229910001369 Brass Inorganic materials 0.000 abstract 1
- 229910000906 Bronze Inorganic materials 0.000 abstract 1
- OCUCCJIRFHNWBP-IYEMJOQQSA-L Copper gluconate Chemical compound [Cu+2].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O OCUCCJIRFHNWBP-IYEMJOQQSA-L 0.000 abstract 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 abstract 1
- PHOQVHQSTUBQQK-SQOUGZDYSA-N D-glucono-1,5-lactone Chemical compound OC[C@H]1OC(=O)[C@H](O)[C@@H](O)[C@@H]1O PHOQVHQSTUBQQK-SQOUGZDYSA-N 0.000 abstract 1
- RGHNJXZEOKUKBD-SQOUGZDYSA-N Gluconic acid Natural products OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 abstract 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 238000007792 addition Methods 0.000 abstract 1
- 239000003513 alkali Substances 0.000 abstract 1
- 229910052783 alkali metal Inorganic materials 0.000 abstract 1
- 150000001340 alkali metals Chemical class 0.000 abstract 1
- 150000001412 amines Chemical group 0.000 abstract 1
- 150000001462 antimony Chemical class 0.000 abstract 1
- 239000010953 base metal Substances 0.000 abstract 1
- XKGUZGHMWUIYDR-UHFFFAOYSA-N benzyl n-(3-fluoro-4-morpholin-4-ylphenyl)carbamate Chemical compound C=1C=C(N2CCOCC2)C(F)=CC=1NC(=O)OCC1=CC=CC=C1 XKGUZGHMWUIYDR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract 1
- 239000010951 brass Substances 0.000 abstract 1
- 239000010974 bronze Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 229940108925 copper gluconate Drugs 0.000 abstract 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract 1
- LEKPFOXEZRZPGW-UHFFFAOYSA-N copper;dicyanide Chemical compound [Cu+2].N#[C-].N#[C-] LEKPFOXEZRZPGW-UHFFFAOYSA-N 0.000 abstract 1
- 238000004512 die casting Methods 0.000 abstract 1
- 239000003792 electrolyte Substances 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 abstract 1
- 235000012208 gluconic acid Nutrition 0.000 abstract 1
- 239000000174 gluconic acid Substances 0.000 abstract 1
- 235000012209 glucono delta-lactone Nutrition 0.000 abstract 1
- 229960003681 gluconolactone Drugs 0.000 abstract 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 abstract 1
- 238000011221 initial treatment Methods 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 230000010287 polarization Effects 0.000 abstract 1
- 239000011669 selenium Substances 0.000 abstract 1
- 229910052711 selenium Inorganic materials 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
- 150000003498 tellurium compounds Chemical class 0.000 abstract 1
- 150000003751 zinc Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
836,978. Copper and copper alloy plating baths. METAL & THERMIT CORPORATION. June 6, 1958 [June 19, 1957], No. 18211/58. Class 41. An electrolytic plating bath for copper or copper alloys includes gluconic acid, an alkali metal or ammonium gluconate, copper gluconate, or glucono-lactone, which improves anode; current efficiency and reduces polarization. About 0.065 to 0.26 mols. per litre is added. Alkali cyanide copper baths are specified in which either tin or zinc salts may be present to give bronze or brass coatings. Optional additions include, selenium and tellurium compounds, lead, zinc, bismuth or antimony salts; quaternary amines, aminopropionates, or polyoxy glycol ethers. The electrolyte or the cathode may be agitated or moved, and the current periodically reversed. The electroplate may be applied to any conventional base metal, but in the case of iron, steel, or zinc die castings a flash coating of copper is a preferred initial treatment. Specifications 836,977, 836,979 and U.S.A. Specification 2,548,867 are referred to.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US666773A US2916423A (en) | 1957-06-19 | 1957-06-19 | Electrodeposition of copper and copper alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB836978A true GB836978A (en) | 1960-06-09 |
Family
ID=24675413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB18211/58A Expired GB836978A (en) | 1957-06-19 | 1958-06-06 | Electrodeposition of copper and copper alloys |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US2916423A (en) |
| DE (2) | DE1143075B (en) |
| FR (1) | FR1210750A (en) |
| GB (1) | GB836978A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015039152A1 (en) | 2013-09-18 | 2015-03-26 | Ing.W.Garhöfer Gesellschaft M.B.H. | Deposition of cu, sn, zn-layers on metallic substrates |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3108006A (en) * | 1959-07-13 | 1963-10-22 | M & T Chemicals Inc | Plating on aluminum |
| US3930965A (en) * | 1974-03-18 | 1976-01-06 | Mcgean Chemical Company, Inc. | Zinc-copper alloy electroplating baths |
| US4310392A (en) * | 1979-12-31 | 1982-01-12 | Bell Telephone Laboratories, Incorporated | Electrolytic plating |
| US4376018A (en) * | 1979-12-31 | 1983-03-08 | Bell Telephone Laboratories, Incorporated | Electrodeposition of nickel |
| US4379738A (en) * | 1979-12-31 | 1983-04-12 | Bell Telephone Laboratories, Incorporated | Electroplating zinc |
| US4377448A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic gold plating |
| US4377449A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic silver plating |
| DE4324995C2 (en) * | 1993-07-26 | 1995-12-21 | Demetron Gmbh | Cyanide-alkaline baths for the galvanic deposition of copper-tin alloy coatings |
| US7022419B2 (en) * | 2000-12-20 | 2006-04-04 | Honda Giken Kogyo Kabushiki Kaisha | Composite plating film and a process for forming the same |
| US20020092673A1 (en) * | 2001-01-17 | 2002-07-18 | International Business Machines Corporation | Tungsten encapsulated copper interconnections using electroplating |
| US20060260948A2 (en) * | 2005-04-14 | 2006-11-23 | Enthone Inc. | Method for electrodeposition of bronzes |
| EP3150744B1 (en) | 2015-09-30 | 2020-02-12 | COVENTYA S.p.A. | Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy layer, method for electrochemical deposition of said alloy layer, substrate comprising said alloy layer and uses of the coated substrate |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US694658A (en) * | 1900-12-11 | 1902-03-04 | Jules Meurant | Electrolytic process. |
| US2287654A (en) * | 1938-05-04 | 1942-06-23 | Du Pont | Copper plating |
| US2406072A (en) * | 1941-02-15 | 1946-08-20 | Univ Ohio State Res Found | Electrodeposition of metals and bath composition therefor |
| US2548867A (en) * | 1945-04-14 | 1951-04-17 | Poor & Co | Electroplating metals |
| FR960115A (en) * | 1947-08-09 | 1950-04-13 | ||
| US2763606A (en) * | 1952-06-25 | 1956-09-18 | American Brake Shoe Co | Electrodepositing baths and plating methods |
-
1957
- 1957-06-19 US US666773A patent/US2916423A/en not_active Expired - Lifetime
-
1958
- 1958-06-06 GB GB18211/58A patent/GB836978A/en not_active Expired
- 1958-06-16 FR FR1210750D patent/FR1210750A/en not_active Expired
- 1958-06-18 DE DEM37960A patent/DE1143075B/en active Pending
- 1958-06-18 DE DEM37961A patent/DE1109000B/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015039152A1 (en) | 2013-09-18 | 2015-03-26 | Ing.W.Garhöfer Gesellschaft M.B.H. | Deposition of cu, sn, zn-layers on metallic substrates |
Also Published As
| Publication number | Publication date |
|---|---|
| US2916423A (en) | 1959-12-08 |
| DE1143075B (en) | 1963-01-31 |
| DE1109000B (en) | 1961-06-15 |
| FR1210750A (en) | 1960-03-10 |
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