FR1210750A - Process for electroplating copper and copper alloys - Google Patents

Process for electroplating copper and copper alloys

Info

Publication number
FR1210750A
FR1210750A FR1210750DA FR1210750A FR 1210750 A FR1210750 A FR 1210750A FR 1210750D A FR1210750D A FR 1210750DA FR 1210750 A FR1210750 A FR 1210750A
Authority
FR
France
Prior art keywords
copper
electroplating
alloys
copper alloys
electroplating copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Primerica Inc
Original Assignee
Metal and Thermit Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metal and Thermit Corp filed Critical Metal and Thermit Corp
Application granted granted Critical
Publication of FR1210750A publication Critical patent/FR1210750A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
FR1210750D 1957-06-19 1958-06-16 Process for electroplating copper and copper alloys Expired FR1210750A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US666773A US2916423A (en) 1957-06-19 1957-06-19 Electrodeposition of copper and copper alloys

Publications (1)

Publication Number Publication Date
FR1210750A true FR1210750A (en) 1960-03-10

Family

ID=24675413

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1210750D Expired FR1210750A (en) 1957-06-19 1958-06-16 Process for electroplating copper and copper alloys

Country Status (4)

Country Link
US (1) US2916423A (en)
DE (2) DE1143075B (en)
FR (1) FR1210750A (en)
GB (1) GB836978A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3108006A (en) * 1959-07-13 1963-10-22 M & T Chemicals Inc Plating on aluminum
US3930965A (en) * 1974-03-18 1976-01-06 Mcgean Chemical Company, Inc. Zinc-copper alloy electroplating baths
US4376018A (en) * 1979-12-31 1983-03-08 Bell Telephone Laboratories, Incorporated Electrodeposition of nickel
US4310392A (en) * 1979-12-31 1982-01-12 Bell Telephone Laboratories, Incorporated Electrolytic plating
US4377448A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic gold plating
US4379738A (en) * 1979-12-31 1983-04-12 Bell Telephone Laboratories, Incorporated Electroplating zinc
US4377449A (en) * 1979-12-31 1983-03-22 Bell Telephone Laboratories, Incorporated Electrolytic silver plating
DE4324995C2 (en) * 1993-07-26 1995-12-21 Demetron Gmbh Cyanide-alkaline baths for the galvanic deposition of copper-tin alloy coatings
DE60144032D1 (en) * 2000-12-20 2011-03-24 Honda Motor Co Ltd GALVANICALLY SEPARATE COMPOSITE FILM AND METHOD FOR THE PRODUCTION THEREOF
US20020092673A1 (en) * 2001-01-17 2002-07-18 International Business Machines Corporation Tungsten encapsulated copper interconnections using electroplating
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
AT514818B1 (en) 2013-09-18 2015-10-15 W Garhöfer Ges M B H Ing Deposition of Cu, Sn, Zn coatings on metallic substrates
PT3150744T (en) 2015-09-30 2020-05-12 Coventya S P A Electroplating bath for electrochemical deposition of a cu-sn-zn-pd alloy, method for electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US694658A (en) * 1900-12-11 1902-03-04 Jules Meurant Electrolytic process.
US2287654A (en) * 1938-05-04 1942-06-23 Du Pont Copper plating
US2406072A (en) * 1941-02-15 1946-08-20 Univ Ohio State Res Found Electrodeposition of metals and bath composition therefor
US2548867A (en) * 1945-04-14 1951-04-17 Poor & Co Electroplating metals
FR960115A (en) * 1947-08-09 1950-04-13
US2763606A (en) * 1952-06-25 1956-09-18 American Brake Shoe Co Electrodepositing baths and plating methods

Also Published As

Publication number Publication date
DE1109000B (en) 1961-06-15
US2916423A (en) 1959-12-08
DE1143075B (en) 1963-01-31
GB836978A (en) 1960-06-09

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