DE1143075B - Process for the electrodeposition of copper and copper alloys? - Google Patents
Process for the electrodeposition of copper and copper alloys?Info
- Publication number
- DE1143075B DE1143075B DEM37960A DEM0037960A DE1143075B DE 1143075 B DE1143075 B DE 1143075B DE M37960 A DEM37960 A DE M37960A DE M0037960 A DEM0037960 A DE M0037960A DE 1143075 B DE1143075 B DE 1143075B
- Authority
- DE
- Germany
- Prior art keywords
- bath
- copper
- liter
- gluconate
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 17
- 229910052802 copper Inorganic materials 0.000 title claims description 17
- 239000010949 copper Substances 0.000 title claims description 17
- 238000000034 method Methods 0.000 title claims description 10
- 238000004070 electrodeposition Methods 0.000 title claims description 8
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 6
- RGHNJXZEOKUKBD-SQOUGZDYSA-M D-gluconate Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O RGHNJXZEOKUKBD-SQOUGZDYSA-M 0.000 claims description 10
- 229940050410 gluconate Drugs 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 8
- OCUCCJIRFHNWBP-IYEMJOQQSA-L Copper gluconate Chemical class [Cu+2].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O OCUCCJIRFHNWBP-IYEMJOQQSA-L 0.000 claims description 6
- 239000003513 alkali Substances 0.000 claims description 6
- 229910052783 alkali metal Inorganic materials 0.000 claims description 6
- 229910000906 Bronze Inorganic materials 0.000 claims description 5
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims description 5
- HLCFGWHYROZGBI-JJKGCWMISA-M Potassium gluconate Chemical compound [K+].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O HLCFGWHYROZGBI-JJKGCWMISA-M 0.000 claims description 5
- 239000010974 bronze Substances 0.000 claims description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 5
- 239000004224 potassium gluconate Substances 0.000 claims description 5
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 238000007792 addition Methods 0.000 claims description 4
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims description 3
- XKGUZGHMWUIYDR-UHFFFAOYSA-N benzyl n-(3-fluoro-4-morpholin-4-ylphenyl)carbamate Chemical compound C=1C=C(N2CCOCC2)C(F)=CC=1NC(=O)OCC1=CC=CC=C1 XKGUZGHMWUIYDR-UHFFFAOYSA-N 0.000 claims description 3
- 238000002474 experimental method Methods 0.000 claims description 3
- 239000000174 gluconic acid Substances 0.000 claims description 3
- 235000012208 gluconic acid Nutrition 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229940108925 copper gluconate Drugs 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 4
- 239000010953 base metal Substances 0.000 claims 3
- 229910000831 Steel Inorganic materials 0.000 claims 2
- 229910052742 iron Inorganic materials 0.000 claims 2
- 239000010959 steel Substances 0.000 claims 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 1
- XGRYDJSRYGHYOO-UHFFFAOYSA-N Thesine Natural products C1=CC(O)=CC=C1C1C(C(=O)OCC2C3CCCN3CC2)C(C=2C=CC(O)=CC=2)C1C(=O)OCC1C2CCCN2CC1 XGRYDJSRYGHYOO-UHFFFAOYSA-N 0.000 claims 1
- 150000001340 alkali metals Chemical class 0.000 claims 1
- 229910052792 caesium Inorganic materials 0.000 claims 1
- 238000005266 casting Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 229910052700 potassium Inorganic materials 0.000 claims 1
- 239000011591 potassium Substances 0.000 claims 1
- 239000001509 sodium citrate Substances 0.000 claims 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims 1
- 159000000000 sodium salts Chemical class 0.000 claims 1
- -1 alkali metal cyanide Chemical class 0.000 description 6
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 4
- 229960003189 potassium gluconate Drugs 0.000 description 4
- 235000013926 potassium gluconate Nutrition 0.000 description 4
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 2
- 229940074439 potassium sodium tartrate Drugs 0.000 description 2
- 239000000176 sodium gluconate Substances 0.000 description 2
- 235000012207 sodium gluconate Nutrition 0.000 description 2
- 229940005574 sodium gluconate Drugs 0.000 description 2
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- VGGUVGVAVAAODK-ZROIWOOFSA-N (5z)-2-amino-5-[(3-cyclopentyloxy-4-methoxyphenyl)methylidene]-1,3-thiazol-4-one Chemical compound C1=C(OC2CCCC2)C(OC)=CC=C1\C=C1/SC(=N)NC1=O VGGUVGVAVAAODK-ZROIWOOFSA-N 0.000 description 1
- ZOBPZXTWZATXDG-UHFFFAOYSA-N 1,3-thiazolidine-2,4-dione Chemical compound O=C1CSC(=O)N1 ZOBPZXTWZATXDG-UHFFFAOYSA-N 0.000 description 1
- IPDWABJNXLNLRA-UHFFFAOYSA-N 2,3-dihydroxybutanedioic acid;2-hydroxypropane-1,2,3-tricarboxylic acid Chemical compound OC(=O)C(O)C(O)C(O)=O.OC(=O)CC(O)(C(O)=O)CC(O)=O IPDWABJNXLNLRA-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- ICPMTQOYWXXMIG-OPDGVEILSA-K aluminum;(2r,3s,4r,5r)-2,3,4,5,6-pentahydroxyhexanoate Chemical compound [Al+3].OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O.OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O ICPMTQOYWXXMIG-OPDGVEILSA-K 0.000 description 1
- 150000001462 antimony Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012990 dithiocarbamate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- AVTYONGGKAJVTE-OLXYHTOASA-L potassium L-tartrate Chemical compound [K+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O AVTYONGGKAJVTE-OLXYHTOASA-L 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- 229960002635 potassium citrate Drugs 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- 235000011082 potassium citrates Nutrition 0.000 description 1
- 239000001472 potassium tartrate Substances 0.000 description 1
- 229940111695 potassium tartrate Drugs 0.000 description 1
- 235000011005 potassium tartrates Nutrition 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- KIWUVOGUEXMXSV-UHFFFAOYSA-N rhodanine Chemical compound O=C1CSC(=S)N1 KIWUVOGUEXMXSV-UHFFFAOYSA-N 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- 150000003892 tartrate salts Chemical class 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 210000001550 testis Anatomy 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
- C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
Die Erfindung bezieht sich auf ein Verfahren zum galvanischen Abscheiden von Kupfer- und Kupferlegierungsüberzügen aus einem Alkalicyanidbad, das einen Gehalt an einem Glukonat besitzt.The invention relates to a method for the electrodeposition of copper and copper alloy coatings from an alkali metal cyanide bath containing a gluconate.
Es ist an sich bekannt, zur galvanischen Abscheidung von Kupfer Alkalicanidbäder zu verwenden, die einen Gehalt an Kaliumglukonat besitzen, wobei die Abscheidung des Kupfers durch einen gleichstrom überlagerten Wechselstrom erfolgt, wodurch gute Abscheidungen erzielt werden sollen. In der betreffenden Veröffentlichung ist ausdrücklich hervorgehoben, daß bei Anwendung von Gleichstrom allein hierbei keine befriedigende Abscheidung erzielt wird, hingegen nur bei Anwendung des gleichstromüberlagerten Wechselstromes auch ohne Anwendung des Aluminiumglukonats gute Abscheidungen erzielt werden.It is known per se to use alkali anide baths for the electrodeposition of copper, the one Have potassium gluconate content, with the deposition of copper superimposed by a direct current Alternating current takes place, whereby good deposits are to be achieved. In the relevant Publication is expressly emphasized that when using direct current alone here none satisfactory deposition is achieved, however, only when using the direct current superimposed alternating current Good separations can also be achieved without using the aluminum gluconate.
Es wurde nun gefunden, daß bei Zusatz bestimmter Glukonate in geringen Mengen zu Alkalicyanidbädern für das galvanische Abscheiden von Kupfer- und Kupferlegierungsüberzügen sehr gute Ergebnisse erzielt werden, und zwar mit guten Stromausbeuten. Die Erfindung betrifft demgemäß ein Verfahren, wobei dem Alkalicyanidbad mindestens 0,065 Mol/Liter von wenigstens einem der folgenden Glukonate: Alkaliglukonat, Kupferglukonat, Ammoniumglukonat, GIukonsäure und Glukondeltalacton, zugesetzt werden und das Bad mittels Gleichstrom unter üblichen Bedingungen betrieben wird.It has now been found that when certain gluconates are added in small amounts to alkali metal cyanide baths achieved very good results for the electrodeposition of copper and copper alloy coatings with good current yields. The invention accordingly relates to a method, wherein the Alkali cyanide bath at least 0.065 mol / liter of at least one of the following gluconates: alkali gluconate, Copper gluconate, ammonium gluconate, gluconic acid and glucondeltalactone can be added and the bath is operated by means of direct current under normal conditions.
Dem Bad werden zwischen 0,065 und 0,26 Mol/Liter, vorzugsweise 0,09 bis 0,26 Mol/Liter, wenigstens eines Glukonats zugesetzt.Between 0.065 and 0.26 moles / liter, preferably 0.09 to 0.26 moles / liter, at least one is added to the bath Gluconate added.
Wie schon erwähnt, werden bei Anwendung der Bäder gemäß der Erfindung verbesserte Stromausbeuten erzielt, und zwar verbesserte Anodenstromausbeuten besonders bei höheren Stromdichten, als auch verbesserte Kathodenstromausbeuten, wenn die Alkalicyanidbäder ein Glukonat in einer Menge von mindestens 0,065 Mol/Liter enthalten. Die aus solchen Bädern hergestellten Überzüge sind glatt und feinkörnig, so daß auf den so abgeschiedenen Überzügen mit gutem Erfolg weitere Überzüge aus Nickel, Chrom und anderen Metallen abgeschieden werden können.As already mentioned, when using the baths according to the invention, improved current yields are achieved achieved, namely improved anode current yields especially at higher current densities than also improved cathode current yields when the alkali metal cyanide baths contain a gluconate in an amount of contain at least 0.065 mol / liter. The coatings made from such baths are smooth and fine-grained, so that further coatings of nickel or chromium are successfully applied to the coatings thus deposited and other metals can be deposited.
Das Alkalicyanidbad kann auch die üblichen weiteren Zusätze enthalten, wie primäre blankmachende Mittel, wie Selen- und Tellurdithiocarbamate, z. B. Selenbisdiäthyldithiocarbamat, Rhodanin, Pseudothiohydantoin, 2,4-Dioxothiazolidin usw., und zwar allein oder in Verbindung mit sekundären Blankmachern, wie Blei-, Zink-, Wismut-, Antimonsalzen usw.The alkali metal cyanide bath can also contain the usual other additives, such as primary shining agents Agents such as selenium and tellurium dithiocarbamates, e.g. B. Selenbisdiäthyldithiocarbamat, Rhodanin, Pseudothiohydantoin, 2,4-Dioxothiazolidine, etc., alone or in conjunction with secondary brighteners, such as lead, zinc, bismuth, antimony salts, etc.
Den Alkalicyanidbädern können naturgemäß auch noch die üblichen Zusatzmittel, wie Netzmittel aus
Verfahren zum galvanischen Abscheiden
von Kupfer- und Kupferlegierung©» f λ The alkali metal cyanide baths can of course also contain the usual additives, such as wetting agents from processes for electrodeposition
of copper and copper alloys © » f λ
Anmelder:Applicant:
Metal & Thermit Corporation,Metal & Thermit Corporation,
Rahway, N. J.,
und Frank Passal, Detroit, Mich. (V. St. A.)Rahway, NJ,
and Frank Passal, Detroit, Mich. (V. St. A.)
Vertreter: Dr.-Ing. H. Fincke, Dipl.-Ing. H. BohrRepresentative: Dr.-Ing. H. Fincke, Dipl.-Ing. H. Bohr
und Dipl.-Ing. S. Staeger, Patentanwälte,and Dipl.-Ing. S. Staeger, patent attorneys,
München 5, Müllerstr. 31Munich 5, Müllerstr. 31
Beanspruchte Priorität:
V. St. v. Amerika vom 19. Juni 1957 (Nr. 666 767)Claimed priority:
V. St. v. America, June 19, 1957 (No. 666 767)
Frank Passal, Detroit, Mich. (V. St. A.),
ist als Erfinder genannt wordenFrank Passal, Detroit, Mich. (V. St. A.),
has been named as the inventor
quaternären Aminen, wie C-Decylbetain, Trimethylbenzylammoniumchlorid oder Alkyl-^-aminopropionate, Alkyl-ß-iminodipropionate, Alkylpolyoxyäthylenglykoläther usw., zugesetzt werden.quaternary amines such as C-decylbetaine, trimethylbenzylammonium chloride or alkyl - ^ - aminopropionate, alkyl-ß-iminodipropionate, alkyl polyoxyethylene glycol ether etc., can be added.
Sehr gute Ergebnisse werden beim vorliegenden Verfahren erzielt, wenn bei der galvanischen Abscheidung eine Arbeitsweise angewandt wird, bei der die Bildung eines unmittelbar an der Kathode haftenden dünnen Films vermieden wird, durch den eine Verarmung an Metallionen im Bad entsteht. Dies erfolgt üblicherweise durch Bewegen des Bades, beispielsweise durch Umpumpen der Lösung, Kathodenbewegung, Rühren durch Einleiten von Luft oder durch Diffusionswirkungen, z. B. durch Stromunterbrechungen, periodische Stromsteuerungen usw. oder durch Kombinationen dieser Maßnahmen. Ausgezeichnete Ergebnisse werden erzielt, wenn Stromunterbrechungen in Verbindung mit einer Kathodenbewegung angewandt werden.Very good results are achieved with the present method when using electrodeposition a procedure is used in which the formation of a directly adhering to the cathode thin film is avoided, as a result of which there is a depletion of metal ions in the bath. this usually takes place by moving the bath, for example by pumping the solution, cathode movement, Stirring by introducing air or by diffusion effects, e.g. B. by power interruptions, periodic current controls etc. or a combination of these measures. Excellent Results are obtained when current interruptions are associated with cathodic movement can be applied.
Der Erfindungsgegenstand ist in den folgenden Beispielen näher erläutert.The subject matter of the invention is explained in more detail in the following examples.
309 507/259309 507/259
CuCN 26,1 g/LiterCuCN 26.1 g / liter
NaCN 34,5 g/LiterNaCN 34.5 g / liter
Na8CO3 30 g/LiterNa 8 CO 3 30 g / liter
KOH 30 g/LiterKOH 30 g / liter
Natriumglukonat 45 g/LiterSodium gluconate 45 g / liter
(0,2 Mol/Liter) Temperatur 66° C(0.2 mol / liter) temperature 66 ° C
Das Bad wurde bei Stromdichten von 14, 28 und Amp./930 cm2 betrieben und ergab fehlerfreie Niederschläge bei hohen Stromausbeuten.The bath was operated at current densities of 14, 28 and Amp./930 cm 2 and produced fault-free precipitations with high current yields.
CuCN 60 g/LiterCuCN 60 g / liter
KCN 90 g/LiterKCN 90 g / liter
KOH 22,5 g/LiterKOH 22.5 g / liter
Kaliumglukonat 22,5 g/LiterPotassium gluconate 22.5 g / liter
(0,1 Mol/Liter)(0.1 mol / liter)
CuCN 60 g/LiterCuCN 60 g / liter
KCN 90 g/LiterKCN 90 g / liter
KOH 22,5 g/LiterKOH 22.5 g / liter
Kaliumtartrat 22,5 g/LiterPotassium tartrate 22.5 g / liter
Fehlerfreies Kupfer wurde aus den Bädern der Beispiele 2 und 3 bei den gleichen Verfahrensbedingungen galvanisch abgeschieden. Die Verfahrensbedingungen und die sich ergebenden Stromausbeuten sind in der folgenden Tabelle I enthalten.Flawless copper was obtained from the baths of Examples 2 and 3 under the same process conditions galvanically deposited. The process conditions and the resulting current yields are included in Table I below.
Dieses Bad wurde auch mit 60 g/Liter Zusätzen der oben aufgeführten Verbindungen (a) und (b) angewandt. This bath was also used with 60 g / liter additions of the compounds (a) and (b) listed above.
CuCN 60 g/LiterCuCN 60 g / liter
KCN 90 g/LiterKCN 90 g / liter
so KOH 22,5 g/Literso KOH 22.5 g / liter
Natriumglukonat 30,75 g/LiterSodium gluconate 30.75 g / liter
Stromdichte (Anode) 40 Amp./93O cm2 Current density (anode) 40 amps / 930 cm 2
Das Bad des Beispiels 5 wurde 1 Stunde lang bei 24° C in Betrieb bei einem Gesamtstrom von einem Ampere und einer Anodenstromdichte von 40 Amp./ 930 cm2 gehalten und ergab fehlerfreie galvanische Kupferabscheidungen mit im wesentlichen höheren Anodenleistungen als das gleiche Bad unter den gleichen Bedingungen bei Anwendung von 52,3 g/Liter Kaliumnatriumtartrat oder 44,4 g/Liter Kaliumzitrat.The bath of Example 5 was kept in operation at 24 ° C for 1 hour at a total current of one ampere and an anode current density of 40 amps / 930 cm 2 and gave fault-free electrodepositions with substantially higher anode powers than the same bath under the same Conditions using 52.3 g / liter potassium sodium tartrate or 44.4 g / liter potassium citrate.
Die betreffenden Anodengewichtsschwunde und Anodenstromausbeuten sind in Tabelle III angegeben.The relevant anode weight loss and anode current yields are given in Table III.
Bador
bath
BadCat
bath
Badtesticle
bath
raturtempe
rature
BadAt
bath
28,20.6679
28.2
2,550.0605
2.55
3,430.0812
3.43
Anodenstromausbeute
(%) 40 Weight Loss (g) ...
Anode current efficiency
(%)
Die in der obigen Tabelle aufgeführten Ergebnisse zeigen die Überlegenheit des Bades von Beispiel 2 gegenüber dem von Beispeil 3.The results shown in the table above show the superiority of the bath of Example 2 compared to that of example 3.
CuCN 60 g/LiterCuCN 60 g / liter
freies KCN 11,2 g/Literfree KCN 11.2 g / liter
KOH 22,5 g/LiterKOH 22.5 g / liter
Temperatur 66°CTemperature 66 ° C
a) Kaliumglukonat 15 g/Litera) Potassium gluconate 15 g / liter
b) Kaliumnatriumtartrat 15 g/Literb) Potassium Sodium Tartrate 15 g / liter
c) Kein Zusatz Kontrollec) No additional control
Das Bad des Beispiels 4 wurde mit Zusätzen a) und b) und ohne Zusatz angewandt. Die Ergebnisse der Versuche sind in der Tabelle II enthalten.The bath of Example 4 was used with additives a) and b) and without additives. The results of the Experiments are included in Table II.
Dieses Bad wurde auch bei 660C und einer Stromstärke von 56 Amp./930 cm2 und Verwendung von 22,5 g/Liter Glukonat betrieben und ergab ähnlich gute Ergebnisse.This bath was also at 66 0 C and a current of 56 Amp./930 cm 2, and using 22.5 g / liter gluconate operated and gave similar good results.
CuCN 30 g/LiterCuCN 30 g / liter
KCN 67,5 g/LiterKCN 67.5 g / liter
KOH 11,4 g/LiterKOH 11.4 g / liter
K2SnO3-2H2O 37,5 g/LiterK 2 SnO 3 -2H 2 O 37.5 g / liter
Kaliumglukonat 22,5 g/LiterPotassium gluconate 22.5 g / liter
(0,097MoI/
Liter)(0.097MoI /
Liter)
Dieses Bad wurde bei 54 und 660C mit Stromdichten 6u von 10, 30 und 50 Amp./930 cm2 betrieben und ergab glänzende Bronzeniederschläge bei ausgezeichneten Stromausbeuten. Die Abscheidungen sind ein wenig roter als diejenigen aus Bädern der gleichen Zusammensetzung, wobei Tartrate an Stelle von Glukonaten zugesetzt sind und eine Abscheidung erhalten wird, die mehr Kupfer und weniger Zinn enthält. Dies ergibt sich aus der größeren Kupferstromausbeute, die für das Bad kennzeichnend ist.This bath was at 54 and 66 0 C and current densities of 10 6u, 30 and 50 cm 2 Amp./930 operated and gave bright bronze deposits with excellent current efficiencies. The deposits are a little redder than those from baths of the same composition, with tartrates added instead of gluconates, and a deposit is obtained that contains more copper and less tin. This results from the greater copper current yield, which is characteristic of the bath.
Claims (1)
Temperatur von 68° C angewandt. Es wurden sowohl 1. Verfahren zum galvanischen Abscheiden von Kupfer- als auch Bronzeanoden jedoch in getrennten Kupfer- und Kupferlegierungsüberzügen aus einem Versuchen verwendet. Bei allen untersuchten Strom- Alkalicyanidbad mit einem Gehalt an einem GIudichten (10, 20, 30, 40 und 50 Amp./930cm2) für mit 20 konat, dadurch gekennzeichnet, daß dem Bad Kupfer bzw. Bronzeanoden betriebene Bäder waren mindestens 0,065 Mol/Liter von wenigstens einem die Anodenstromausbeuten, die mit dem Bad des der folgenden Glukonate: Alkaliglukonat, Kupfer-Beispiels 7 erhalten wurden, höher als die mit dem Bad glukonat, Ammoniumglukonat, Glukonsäure und von Beispiel 8 erhaltenen. Die durchschnittliche Glukondeltalacton, zugesetzt werden und das Bad Stromausbeute bei 45 Versuchen, die aus dem Bad des 25 mittels Gleichstrom unter üblichen Bedingungen Beispiels 7 durchgeführt wurden, war 83°/0; bei dem betrieben wird.The baths of Examples 7 and 8 were used in a patent claim:
Temperature of 68 ° C applied. Both 1. Methods of electrodeposition of copper and bronze anodes but in separate copper and copper alloy coatings from an experiment were used. In all investigated current alkali cyanide bath with a content of one density (10, 20, 30, 40 and 50 Amp./930cm 2 ) for with 20 conat, characterized in that the baths operated with copper or bronze anodes were at least 0.065 mol / Liters of at least one, the anodic current yields obtained with the bath of the following gluconates: alkali gluconate, copper example 7, are higher than those obtained with the gluconate, ammonium gluconate, gluconic acid and example 8 bath. The average glucondeltalactone to be added and the bath current efficiency in 45 experiments, which were carried out from the bath of 25 by means of direct current under the usual conditions of Example 7, was 83 ° / 0 ; at which is operated.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US666773A US2916423A (en) | 1957-06-19 | 1957-06-19 | Electrodeposition of copper and copper alloys |
Publications (1)
Publication Number | Publication Date |
---|---|
DE1143075B true DE1143075B (en) | 1963-01-31 |
Family
ID=24675413
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DEM37961A Pending DE1109000B (en) | 1957-06-19 | 1958-06-18 | Bath for the galvanic deposition of copper and copper alloy coatings |
DEM37960A Pending DE1143075B (en) | 1957-06-19 | 1958-06-18 | Process for the electrodeposition of copper and copper alloys? |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DEM37961A Pending DE1109000B (en) | 1957-06-19 | 1958-06-18 | Bath for the galvanic deposition of copper and copper alloy coatings |
Country Status (4)
Country | Link |
---|---|
US (1) | US2916423A (en) |
DE (2) | DE1109000B (en) |
FR (1) | FR1210750A (en) |
GB (1) | GB836978A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4310392A (en) * | 1979-12-31 | 1982-01-12 | Bell Telephone Laboratories, Incorporated | Electrolytic plating |
US4376018A (en) * | 1979-12-31 | 1983-03-08 | Bell Telephone Laboratories, Incorporated | Electrodeposition of nickel |
US4377449A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic silver plating |
US4377448A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic gold plating |
US4379738A (en) * | 1979-12-31 | 1983-04-12 | Bell Telephone Laboratories, Incorporated | Electroplating zinc |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3108006A (en) * | 1959-07-13 | 1963-10-22 | M & T Chemicals Inc | Plating on aluminum |
US3930965A (en) * | 1974-03-18 | 1976-01-06 | Mcgean Chemical Company, Inc. | Zinc-copper alloy electroplating baths |
DE4324995C2 (en) * | 1993-07-26 | 1995-12-21 | Demetron Gmbh | Cyanide-alkaline baths for the galvanic deposition of copper-tin alloy coatings |
WO2002050342A2 (en) * | 2000-12-20 | 2002-06-27 | Honda Giken Kogyo Kabushiki Kaisha | Composite plating film and a process for forming the same |
US20020092673A1 (en) * | 2001-01-17 | 2002-07-18 | International Business Machines Corporation | Tungsten encapsulated copper interconnections using electroplating |
US20060260948A2 (en) * | 2005-04-14 | 2006-11-23 | Enthone Inc. | Method for electrodeposition of bronzes |
AT514818B1 (en) | 2013-09-18 | 2015-10-15 | W Garhöfer Ges M B H Ing | Deposition of Cu, Sn, Zn coatings on metallic substrates |
ES2790583T3 (en) | 2015-09-30 | 2020-10-28 | Coventya S P A | Electrochemical bath for the electrochemical deposition of a Cu-Sn-Zn-Pd alloy, procedure for the electrochemical deposition of said alloy, substrate comprising said alloy and uses of the substrate |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2548867A (en) * | 1945-04-14 | 1951-04-17 | Poor & Co | Electroplating metals |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US694658A (en) * | 1900-12-11 | 1902-03-04 | Jules Meurant | Electrolytic process. |
US2287654A (en) * | 1938-05-04 | 1942-06-23 | Du Pont | Copper plating |
US2406072A (en) * | 1941-02-15 | 1946-08-20 | Univ Ohio State Res Found | Electrodeposition of metals and bath composition therefor |
FR960115A (en) * | 1947-08-09 | 1950-04-13 | ||
US2763606A (en) * | 1952-06-25 | 1956-09-18 | American Brake Shoe Co | Electrodepositing baths and plating methods |
-
1957
- 1957-06-19 US US666773A patent/US2916423A/en not_active Expired - Lifetime
-
1958
- 1958-06-06 GB GB18211/58A patent/GB836978A/en not_active Expired
- 1958-06-16 FR FR1210750D patent/FR1210750A/en not_active Expired
- 1958-06-18 DE DEM37961A patent/DE1109000B/en active Pending
- 1958-06-18 DE DEM37960A patent/DE1143075B/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2548867A (en) * | 1945-04-14 | 1951-04-17 | Poor & Co | Electroplating metals |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4310392A (en) * | 1979-12-31 | 1982-01-12 | Bell Telephone Laboratories, Incorporated | Electrolytic plating |
US4376018A (en) * | 1979-12-31 | 1983-03-08 | Bell Telephone Laboratories, Incorporated | Electrodeposition of nickel |
US4377449A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic silver plating |
US4377448A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic gold plating |
US4379738A (en) * | 1979-12-31 | 1983-04-12 | Bell Telephone Laboratories, Incorporated | Electroplating zinc |
Also Published As
Publication number | Publication date |
---|---|
US2916423A (en) | 1959-12-08 |
FR1210750A (en) | 1960-03-10 |
DE1109000B (en) | 1961-06-15 |
GB836978A (en) | 1960-06-09 |
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