GB736832A - Improvements in or relating to the electrodeposition of antimony - Google Patents

Improvements in or relating to the electrodeposition of antimony

Info

Publication number
GB736832A
GB736832A GB21423/53A GB2142353A GB736832A GB 736832 A GB736832 A GB 736832A GB 21423/53 A GB21423/53 A GB 21423/53A GB 2142353 A GB2142353 A GB 2142353A GB 736832 A GB736832 A GB 736832A
Authority
GB
United Kingdom
Prior art keywords
antimony
electrodeposition
lead
fluoborate
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB21423/53A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motors Liquidation Co
Original Assignee
Motors Liquidation Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motors Liquidation Co filed Critical Motors Liquidation Co
Publication of GB736832A publication Critical patent/GB736832A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/54—Electroplating: Baths therefor from solutions of metals not provided for in groups C25D3/04 - C25D3/50
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

736,832. Electrodeposition of antimony. GENERAL MOTORS CORPORATION. Aug. 4, 1953 [Sept. 22, 1952], No. 21423/53. Class 41. A bath for the electrodeposition of antimony comprises an aqueous solution of an antimony compound and boric acid and/or fluoboric acid and/or a soluble salt of fluoboric acid. The bath may also contain an anode corrosion promoter, when antimony anodes are used, such as dibasic ammonium citrate or acid sodium tartrate. The antimony compound may be antimony chloride, antimony potassium tartrate or antimony oxide. The fluoboric acid salt may be sodium fluoborate, ammonium fluoborate or ferrous fluoborate. Animal glue may be added as an anti-filling agent. The pH should be between 4.5 and 5.5, the voltage between 2 and 4 volts, and the cathode current density between 15 and 25 amperes per square foot. The antimony may be deposited on lead, indium, alloys of lead and indium, which surfaces may have been obtained by electrodeposition, copper, iron, steel, zinc, tin, cadmium and alloys of lead and antimony. The antimony layer may be plated with nickel or chromium.
GB21423/53A 1952-09-22 1953-08-04 Improvements in or relating to the electrodeposition of antimony Expired GB736832A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US310926A US2737485A (en) 1952-09-22 1952-09-22 Electrodeposition of copper

Publications (1)

Publication Number Publication Date
GB736832A true GB736832A (en) 1955-09-14

Family

ID=23204649

Family Applications (1)

Application Number Title Priority Date Filing Date
GB21423/53A Expired GB736832A (en) 1952-09-22 1953-08-04 Improvements in or relating to the electrodeposition of antimony

Country Status (3)

Country Link
US (1) US2737485A (en)
FR (2) FR1082485A (en)
GB (1) GB736832A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109680310A (en) * 2019-01-04 2019-04-26 中国计量大学 A kind of nickel antimony electroplating solution and preparation method thereof
CN109778259A (en) * 2019-01-04 2019-05-21 中国计量大学 A kind of antimony electroplating solution and preparation method thereof

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2814590A (en) * 1954-07-20 1957-11-26 Lloyd B Portzer Electrodeposition of copper
US2876178A (en) * 1956-03-06 1959-03-03 Ewald H Mccoy Electrodepositing copper
US2825684A (en) * 1956-10-09 1958-03-04 Du Pont Bright copper plating
US2859159A (en) * 1956-10-09 1958-11-04 Elechem Corp Bright copper plating bath containing mixtures of metal compounds
US2881122A (en) * 1957-03-14 1959-04-07 Hanson Van Winkle Munning Co Electroplating
DE1072449B (en) * 1957-06-19 1959-12-31 Metal iS. Thermit Corporation, Rahway, N. J., und Frank Passal, Detroit, Mich. (V. St. A.) Cyanide bath for the galvanic deposition of complete copper coatings
US2955992A (en) * 1957-08-08 1960-10-11 Macdermid Inc Bright copper plating process
GB895156A (en) * 1959-03-19 1962-05-02 Metal & Thermit Corp Electrodeposition of copper
DE1224582B (en) * 1961-05-02 1966-09-08 M & T Chemicals Inc Cyanide bath for the galvanic deposition of copper coatings
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
JP4480509B2 (en) * 2004-08-05 2010-06-16 新光電気工業株式会社 Copper strike plating bath
US20150197870A1 (en) * 2014-01-15 2015-07-16 The Board Of Trustees Of The Leland Stanford Junior University Method for Plating Fine Grain Copper Deposit on Metal Substrate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1566265A (en) * 1922-01-11 1925-12-22 Antisell Frank Linden Process of producing electrolytic copper
NL69965C (en) * 1945-08-10
US2541700A (en) * 1946-02-28 1951-02-13 Du Pont Electroplating copper
NL71719C (en) * 1948-05-01
US2694677A (en) * 1949-11-10 1954-11-16 Barnet D Ostrow Bright copper plating bath
US2701234A (en) * 1951-07-11 1955-02-01 Du Pont Addition agent for copper plating

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109680310A (en) * 2019-01-04 2019-04-26 中国计量大学 A kind of nickel antimony electroplating solution and preparation method thereof
CN109778259A (en) * 2019-01-04 2019-05-21 中国计量大学 A kind of antimony electroplating solution and preparation method thereof
CN109680310B (en) * 2019-01-04 2020-07-07 中国计量大学 Nickel-antimony electroplating solution and preparation method thereof

Also Published As

Publication number Publication date
FR1083799A (en) 1955-01-12
US2737485A (en) 1956-03-06
FR1082485A (en) 1954-12-29

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