US2313371A - Electrodeposition of tin and its alloys - Google Patents
Electrodeposition of tin and its alloys Download PDFInfo
- Publication number
- US2313371A US2313371A US342955A US34295540A US2313371A US 2313371 A US2313371 A US 2313371A US 342955 A US342955 A US 342955A US 34295540 A US34295540 A US 34295540A US 2313371 A US2313371 A US 2313371A
- Authority
- US
- United States
- Prior art keywords
- tin
- group
- electrolyte
- sulphone
- benzene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title description 31
- 229910045601 alloy Inorganic materials 0.000 title description 5
- 239000000956 alloy Substances 0.000 title description 5
- 238000004070 electrodeposition Methods 0.000 title description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 39
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 26
- 239000003792 electrolyte Substances 0.000 description 23
- 239000000126 substance Substances 0.000 description 23
- 239000002253 acid Substances 0.000 description 21
- 125000001174 sulfone group Chemical group 0.000 description 19
- 238000000151 deposition Methods 0.000 description 14
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 14
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 13
- 229910001128 Sn alloy Inorganic materials 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 230000008021 deposition Effects 0.000 description 12
- 229930003836 cresol Natural products 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 10
- 238000007670 refining Methods 0.000 description 10
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 150000007513 acids Chemical class 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 239000004615 ingredient Substances 0.000 description 6
- 239000007769 metal material Substances 0.000 description 6
- 125000001424 substituent group Chemical group 0.000 description 6
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 5
- MIAUJDCQDVWHEV-UHFFFAOYSA-N benzene-1,2-disulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1S(O)(=O)=O MIAUJDCQDVWHEV-UHFFFAOYSA-N 0.000 description 5
- 125000001309 chloro group Chemical group Cl* 0.000 description 5
- 150000002739 metals Chemical group 0.000 description 5
- UFWIBTONFRDIAS-UHFFFAOYSA-N naphthalene-acid Natural products C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 5
- IQZPDFORWZTSKT-UHFFFAOYSA-N nitrosulphonic acid Chemical class OS(=O)(=O)[N+]([O-])=O IQZPDFORWZTSKT-UHFFFAOYSA-N 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000005323 electroforming Methods 0.000 description 3
- 235000011149 sulphuric acid Nutrition 0.000 description 3
- 239000001117 sulphuric acid Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000001464 adherent effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005363 electrowinning Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003223 protective agent Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical group [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- BAPROVDXKNPHAM-UHFFFAOYSA-N n-(2-aminoethyl)-3-(3,5-ditert-butyl-4-hydroxyphenyl)propanamide Chemical compound CC(C)(C)C1=CC(CCC(=O)NCCN)=CC(C(C)(C)C)=C1O BAPROVDXKNPHAM-UHFFFAOYSA-N 0.000 description 1
- 150000002790 naphthalenes Chemical class 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- -1 sulphonyl compounds Chemical class 0.000 description 1
- 229910000648 terne Inorganic materials 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
- C25C1/14—Electrolytic production, recovery or refining of metals by electrolysis of solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
Definitions
- This invention relates to the electrodeposition of metals and more particularly to the electroplating, electroreflning, lectrowinning and electroforming of tin and tin alloys, such as solder and terne.
- One object of the present invention is to provide a novel and improved process and electrolyte for the production of a smooth, dense, fine, adherent deposit of the above metals and alloys, which is free from objectionable impurities.
- Another object is to provide a cheap, dependable, efficient and commercially practical process and electrolyte for electrodepositing a plate or coating of superior quality.
- Another object is to provide an emcient, dependable and economical process for the commercial production of tin plate.
- Another object is to provide a novel and improved process for the electrorefining, electroplating, electrowinning or electroforming of tin, and tin-lead alloys.
- the present process is an improvement on that disclosed-in my prior Patent No. 1,487,124, dated Mar. 18, 1924, which utilizes th aromatic sulphonic acids of benzene, phenol and cresol, together with a protective agent, such as sulfuric acid, to precipitate lead as an electrolyte for the electrodeposition of tin.
- a protective agent such as sulfuric acid
- the process functions very satisfactorily for certain refining operations.
- organic addition agents, particularly cresylic acid and like materials contain impurities of a tarry nature.
- the present invention is also applicable to,
- electrorefining, electroforming or electrowinning operations and provides a deposit which adheres to the cathode and may subsequently be stripped therefrom and/or melted down for the recovery of th metal.
- the metal is cast into anodes which are used in a suitable electrolyte for plating or depositing onto a cathode. If tin only is to be deposited, the electrolyte is o erated under conditions to prevent deposition of other metals.
- the bath may, for example, contain a protective agent such-as sulphuric acid to precipitate any lead which may be present and prevent the same from depositing at the cathode. If lead and tin are to be co-deposited as an alloy such an agent is, of course, omitted.
- the present invention provides an ingredient which, when incorporated in the electrolyte,
- This ingredient is herein referred to for convenience as an addition agent, although it is not consumed to the extent of the usual addition agent, but is. substantially permanent in its effect, being in this respect similar to a catalyst.
- addition agent is accordingly not to be construed as descriptive of the operation or action of the ingredient.
- tin electrolyte may comprise the monoand poly-sulphonic acids or benzene, phenol and cresol and the related chloro and nitro sulphonic acids, fluosilicic acid or fluoboric Grams per liter Benzene meta disulphonic acid 200-400 Sulphone of phenol 25 Tin, or tin and lead c 20- 80 Other suitable acids may. of course, be substituted in place of benzene disulphonic acid.
- a temperature .range of from 40 to 80 degrees C. may be used with a current density of from to 100 amperes per sq. foot.
- the cell voltage at a current density of am'peres per sq. foot and an electrode spacing of 1%, inches may vary from 0.10 volt to 0.30
- the sulphone is the essential ingredient in promoting the formation of a smooth, dense, firm, adherent deposit, substantially free from organic impurities.
- the comparatively high acid content and elevated temperature range is favorable to good deposition and reduces the electrical energy required.
- a precipitating agent such as sulphuric acid is added to remove the lead as in my prior Patent No. 1,487,124.
- the other metals which may be present as impurities are either insoluble and go into the slimes, or are not deposited until after the tin has been removed.
- the above described electrolyte has been found to continuously produce a deposit which is substantially free from objectionable organic impurities, and will operat without adjustment over considerably longer periods of time than has heretofore been possible.
- the process is suited to any use in :which tin is to be deposited, such as refining, winning, forming, plating, etc. and is also applicable to the deposition of tin-lead al-. loys such as solder or teme.
- the presence of sulphuric acid in the electrolyte would be avoided, otherwise the lead would be precipitated out and deposition thereof would be prevented.
- tin-lead alloys which comprises an acid solution of said substance and a sulphone of a substance selected from the group consisting of phenol, cresol, resorcinol and naphthol.
- stance selected from the group consisting of tin,
- stance selected from the group consisting of tin and tin-lead alloys which comprises said substance in solution in an acid selected from the group consisting of the mono and poly sulphonic acids of benzene, phenol and cresol, and the related chloro and ultra sulphonic acids, and a sulphone of a substance selected from the class consisting of phenol, cresol, resorcinol and naphthol.
- An electrolyte for the deposition of a su stance selected from the group consisting of tin, and tin-lead alloys, which comprises said substance in solution in benzene disulphonic acid and a sulphone of phenol.
- the method of refining metallic materials containing a substance selected from the group consisting of tin, and tin-lead alloys which comprises making such material into an anode and electrolyzing the same in an electrolyte comprising an acid selected from thegroup consisting of the mono and poly sulphonic acids of benzene, phenol and cresol, and the related chloro and nitro sulphonic acids, and a sulphone of a substance selected from the group consisting of phenol, cresol, resorcinol and naphthol.
- An electrolyte for the deposition of a substance selected from the group consisting of tin, and tin-lead alloys which comprises an acid solution of said substance and a sulphone represented by the formula where R and R each represents an aromatic radical selected from the group consisting of the benzene and the naphthalene radicals, each arcmatic radical having as substituent at least one hydroxy group.
- An electrolyte for the deposition of a substance selected from the group consisting of tin, and tin-lead alloys which comprises said substance in solution in an acid selected from the group consisting of the mono and poly sulphonic acids of benzene, phenol and cresol, and the related chloro and nitro sulphonic acids, and a sulphone represented by the formula SOg where R and R each represents an aromatic radical selected from the group consisting of the benzene and the naphthalene radicals, each aromatic radical having as substituent at least one hydroxy group.
- the method of refining metallic materials containing a substance selected from the group consisting of tin, and tin-lead alloys which comprises making such material'into an anode and electrolyzing the same in an electrolyte comprising an acid selected from the group consisting of the mono and poly sulphonic acids of benzene, phenol and cresol, and the related chloro and nitro sulphonic acids, and a sulphone represented by the formula where R and R each represents an aromatic radical selected from the group consisting of the benzene and the naphthalene radicals, each aromatic radical having as substituent at least one hydroxy group.
Description
Patented Mar. 9, 1943 2.313.371 ELECTRODEPOSITION or TIN AND rrs ALLOYS James R. Stack, Pittsbur- Montpelier, Vt, Stack, deceased,
gh, Pa; Alvllda' L. Stack, executrix of said James R.
assignor,
by mesne assignments, to Carnegie-Illinois Steel Corporation,
Pittsburgh, Pa., a corp oration or New Jersey No Drawing. Application June 28, 1940,
v Serial No. 342,955 Claims. (01. 204-54) This invention relates to the electrodeposition of metals and more particularly to the electroplating, electroreflning, lectrowinning and electroforming of tin and tin alloys, such as solder and terne.
One object of the present invention is to provide a novel and improved process and electrolyte for the production of a smooth, dense, fine, adherent deposit of the above metals and alloys, which is free from objectionable impurities.
Another object is to provide a cheap, dependable, efficient and commercially practical process and electrolyte for electrodepositing a plate or coating of superior quality. I
Another object is to provide an emcient, dependable and economical process for the commercial production of tin plate.
Another object is to provide a novel and improved process for the electrorefining, electroplating, electrowinning or electroforming of tin, and tin-lead alloys.
Various other objects and advantages will be apparent as the nature of the invention is more fully disclosed.
Although the novel features which are believed to be characteristic of this invention are more particularly pointed out in the claims appended hereto, the invention itself may be better understood by referring to the following description in which a specific embodiment thereof ha been set forth for purposes of illustration.
The present process is an improvement on that disclosed-in my prior Patent No. 1,487,124, dated Mar. 18, 1924, which utilizes th aromatic sulphonic acids of benzene, phenol and cresol, together with a protective agent, such as sulfuric acid, to precipitate lead as an electrolyte for the electrodeposition of tin. When used in conjunction with cresylic acid and glue as addition agents, according to Pat. No. 1,397,222 to F. C. Mather, dated Nov. 15,1921, the process functions very satisfactorily for certain refining operations. However, organic addition agents, particularly cresylic acid and like materials, contain impurities of a tarry nature. The latter not only contaminate the bath, but are, to a certain extent, mechanically occluded or co-deposited with the metal at the cathode. While this action may be unobjectionable from a refining standpoint where the cathode i eventually melted, the presence of such material is highly objectionable in a plating operation producing thin tin coatings for protective or decorative purposes. Moreover, the usual addition agents formerly used are depleted rapidly during the electrolysis, thus requiring constant renewal, if th optimum concentration of addition agent is to be maintained and the best deposit produced at all times. I have found that, if a compound of the class hereinafter disclosed is present as a component of the electrolyte, smooth, dense, fine crystalline deposits substantially fre from objectionable organic impurities can be continuously produced.
The present invention is also applicable to,
electrorefining, electroforming or electrowinning operations and provides a deposit which adheres to the cathode and may subsequently be stripped therefrom and/or melted down for the recovery of th metal.
In the electrodeposition of tin, the metal is cast into anodes which are used in a suitable electrolyte for plating or depositing onto a cathode. If tin only is to be deposited, the electrolyte is o erated under conditions to prevent deposition of other metals. The bath may, for example, contain a protective agent such-as sulphuric acid to precipitate any lead which may be present and prevent the same from depositing at the cathode. If lead and tin are to be co-deposited as an alloy such an agent is, of course, omitted.
The present invention provides an ingredient which, when incorporated in the electrolyte,
causes the deposit to have the characteristics above mentioned. This ingredient is herein referred to for convenience as an addition agent, although it is not consumed to the extent of the usual addition agent, but is. substantially permanent in its effect, being in this respect similar to a catalyst. The term addition agent is accordingly not to be construed as descriptive of the operation or action of the ingredient.
More specifically, I have found that certain sulphonyl compounds (sulphones) of the type \K. where R and R represent aromatic radicals of the benzene or naphthalene series, each having as substituents one or more hydroxy groups, are suited for the above purpose. I prefer a. sulphone of phenol having the formula (CsHsOH) 2802 Other soluble aromatic sulphones may also be used, such as the sulphones of cresol, resorcinol,
and naphthol, or, in general, those forming soluble salts of the metal or metals to be deposited.
The above mentioned substances may be used in various electrolytes. or tin-lead alloys the For the deposition of tin electrolyte may comprise the monoand poly-sulphonic acids or benzene, phenol and cresol and the related chloro and nitro sulphonic acids, fluosilicic acid or fluoboric Grams per liter Benzene meta disulphonic acid 200-400 Sulphone of phenol 25 Tin, or tin and lead c 20- 80 Other suitable acids may. of course, be substituted in place of benzene disulphonic acid.
For refining purposes, a temperature .range of from 40 to 80 degrees C. may be used with a current density of from to 100 amperes per sq. foot. The cell voltage at a current density of am'peres per sq. foot and an electrode spacing of 1%, inches may vary from 0.10 volt to 0.30
volt, depending upon the age and purity of the anode. For plating thin deposits, higher voltages and current densities may be employed.
Other addition agents, such as glue, may be used if desired, but are not essential and if used at all the quantity should be small. The sulphone is the essential ingredient in promoting the formation of a smooth, dense, firm, adherent deposit, substantially free from organic impurities. The comparatively high acid content and elevated temperature range is favorable to good deposition and reduces the electrical energy required.
In all cases for the deposition of pur tin, a precipitating agent such as sulphuric acid is added to remove the lead as in my prior Patent No. 1,487,124. The other metals which may be present as impurities are either insoluble and go into the slimes, or are not deposited until after the tin has been removed.
The above described electrolyte has been found to continuously produce a deposit which is substantially free from objectionable organic impurities, and will operat without adjustment over considerably longer periods of time than has heretofore been possible. The process is suited to any use in :which tin is to be deposited, such as refining, winning, forming, plating, etc. and is also applicable to the deposition of tin-lead al-. loys such as solder or teme. Of course, for the latter purpose the presence of sulphuric acid in the electrolyte would be avoided, otherwise the lead would be precipitated out and deposition thereof would be prevented.
While certain specific embodiments of the invention have been set forth for purposes of illustration, it is to be understood that the invention may be applied to various uses and that changes and modifications 'may be made therein as will be apparent to a person skilled in the art. The invention is only to be limited in accordance with the following claims.
What is claimed is:
1. An electrolyte for the deposition of a substance selected from the group consisting of tin,v
and tin-lead alloys, which comprises an acid solution of said substance and a sulphone of a substance selected from the group consisting of phenol, cresol, resorcinol and naphthol.
stance selected from the group consisting of tin,
stance selected from the group consisting of tin and tin-lead alloys which comprises said substance in solution in an acid selected from the group consisting of the mono and poly sulphonic acids of benzene, phenol and cresol, and the related chloro and ultra sulphonic acids, and a sulphone of a substance selected from the class consisting of phenol, cresol, resorcinol and naphthol. I
4. An electrolyte for the deposition of a su stance selected from the group consisting of tin, and tin-lead alloys, which comprises said substance in solution in benzene disulphonic acid and a sulphone of phenol.
5. An electrolyte for the deposition of a substance selected from the group consisting of tin and tin-lead alloys, which comprises the following ingredients in about the following proportions:
' Grams per liter Benzene disulphonic acid 200 to 400 Sulphone of phenol 5 to 25 Tin or tin plus lead 20 to 80 ing an acid solution of said substance, and a sulphone of asubstance selected from the group consisting of phenol, cresol, resorcinol and naphthol.
7. The method of refining metallic materials containing a substance selected from the group consisting of tin, and tin-lead alloys, which comprises making such material into an anode and electrolyzing the same in an electrolytecomprising an acid solution of said substance and a sulphone of phenol.
8. The method of refining metallic materials containing a substance selected from the group consisting of tin, and tin-lead alloys, which comprises making such material into an anode and electrolyzing the same in an electrolyte comprising an acid selected from thegroup consisting of the mono and poly sulphonic acids of benzene, phenol and cresol, and the related chloro and nitro sulphonic acids, and a sulphone of a substance selected from the group consisting of phenol, cresol, resorcinol and naphthol.
9. The method of refining metallic materials containing a substance selected from the group consisting of tin, and tin-lead alloys, which comprises making such material into an anode and electrolyzing the same in an electrolyte comprising benzene disulphonic acid and a sulphone of phenol. a
10. The method of refining metallic materials containing a substance selected from the group consisting of tin, and tin-lead alloys, which comprises making such material into an anode and electrolyzing the same in an electrolyte comprising the following ingredients in about the following proportion:
Grams per liter Benzene disulphonic acid 200to400 Sulphone of phenol 5to 25 Tin or tin plus lead. 20 to 80 2. An electrolyte for the deposition of a sublead alloys from an acid electrolyte containing said substance in solution, which comprises electrolyzing the same in the presence of a sulphone represented by the formula it where R and R each represents an aromatic radical selected from the group consisting of the benzene and the naphthalene radicals, each aromatic radical having as substituent at least one hydroxy group.
12. An electrolyte for the deposition of a substance selected from the group consisting of tin, and tin-lead alloys, which comprises an acid solution of said substance and a sulphone represented by the formula where R and R each represents an aromatic radical selected from the group consisting of the benzene and the naphthalene radicals, each arcmatic radical having as substituent at least one hydroxy group.
13. An electrolyte for the deposition of a substance selected from the group consisting of tin, and tin-lead alloys, which comprises said substance in solution in an acid selected from the group consisting of the mono and poly sulphonic acids of benzene, phenol and cresol, and the related chloro and nitro sulphonic acids, and a sulphone represented by the formula SOg where R and R each represents an aromatic radical selected from the group consisting of the benzene and the naphthalene radicals, each aromatic radical having as substituent at least one hydroxy group.
14. The method of refining metallic materials containing a substance selected from the group consisting of tin, and tin-lead alloys, which comprises making such material into an anode and electrolyzing the same in an electrolyte comprising an acid solution of said substance and a sulphone represented by the formula where R and R each represents an aromatic radical selected from the group consisting of the benzene and the naphthalene radicals, each arcmatic radical having as substituent at least one hydroxy group.
15. The method of refining metallic materials containing a substance selected from the group consisting of tin, and tin-lead alloys, which comprises making such material'into an anode and electrolyzing the same in an electrolyte compris ing an acid selected from the group consisting of the mono and poly sulphonic acids of benzene, phenol and cresol, and the related chloro and nitro sulphonic acids, and a sulphone represented by the formula where R and R each represents an aromatic radical selected from the group consisting of the benzene and the naphthalene radicals, each aromatic radical having as substituent at least one hydroxy group.
. JAMES R. STACK.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US342955A US2313371A (en) | 1940-06-28 | 1940-06-28 | Electrodeposition of tin and its alloys |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US342955A US2313371A (en) | 1940-06-28 | 1940-06-28 | Electrodeposition of tin and its alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2313371A true US2313371A (en) | 1943-03-09 |
Family
ID=23344024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US342955A Expired - Lifetime US2313371A (en) | 1940-06-28 | 1940-06-28 | Electrodeposition of tin and its alloys |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2313371A (en) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2450795A (en) * | 1945-10-05 | 1948-10-05 | Carnegie Illinois Steel Corp | Electrodeposition of tin |
| US2450794A (en) * | 1945-10-05 | 1948-10-05 | Carnegie Illinois Steel Corp | Electrodeposition of tin |
| US2633450A (en) * | 1949-04-27 | 1953-03-31 | United States Steel Corp | Tin and tin alloy plating bath |
| US2634303A (en) * | 1949-02-02 | 1953-04-07 | Edison Inc Thomas A | Storage battery |
| US2677652A (en) * | 1949-07-02 | 1954-05-04 | United States Steel Corp | Method of electrotinning continuous steel strip |
| US3404075A (en) * | 1962-04-05 | 1968-10-01 | Geigy Chem Corp | Electrodeposition of tin |
| US3483099A (en) * | 1964-08-20 | 1969-12-09 | Dai Ichi Kogyo Seiyaku Co Ltd | Tin electroplating electrolyte |
| JPS4916176B1 (en) * | 1970-11-16 | 1974-04-20 | ||
| US4052276A (en) * | 1976-04-14 | 1977-10-04 | Nippon Steel Corporation | Treatment process for electrolytic purifying of used solution for electrolytic tin plating |
| FR2524252A1 (en) * | 1982-03-30 | 1983-10-07 | Mach Agricoles Cie Fse | Fixture for wear-resistant plate e.g. on plough - uses bolt passing through self locking washer and plate to screw into threaded hole in share |
| US4459185A (en) * | 1982-10-08 | 1984-07-10 | Obata, Doni, Daiwa, Fine Chemicals Co., Ltd. | Tin, lead, and tin-lead alloy plating baths |
| US4582576A (en) * | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
| US4885064A (en) * | 1989-05-22 | 1989-12-05 | Mcgean-Rohco, Inc. | Additive composition, plating bath and method for electroplating tin and/or lead |
| DE4022361A1 (en) * | 1990-06-26 | 1992-01-16 | Toyo Kohan Co Ltd | TIN STEEL PLATE WITH A CHROMIN DOUBLE LAYER AND A COPOLYESTER RESIN LAMINATE, METHOD FOR THE PRODUCTION THEREOF AND ITS USE |
| EP0786539A2 (en) | 1996-01-26 | 1997-07-30 | Elf Atochem North America, Inc. | High current density zinc organosulfonate electrogalvanizing process and composition |
| US20080283407A1 (en) * | 2005-12-30 | 2008-11-20 | Martyak Nicholas M | High Speed Tin Plating Process |
| EP3385409A1 (en) * | 2017-04-04 | 2018-10-10 | Estanos y Soldaduras Senra, S.L.U. | Electrolytic sulphuric acid bath and method for tin electrorefinig |
-
1940
- 1940-06-28 US US342955A patent/US2313371A/en not_active Expired - Lifetime
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2450795A (en) * | 1945-10-05 | 1948-10-05 | Carnegie Illinois Steel Corp | Electrodeposition of tin |
| US2450794A (en) * | 1945-10-05 | 1948-10-05 | Carnegie Illinois Steel Corp | Electrodeposition of tin |
| US2634303A (en) * | 1949-02-02 | 1953-04-07 | Edison Inc Thomas A | Storage battery |
| US2633450A (en) * | 1949-04-27 | 1953-03-31 | United States Steel Corp | Tin and tin alloy plating bath |
| US2677652A (en) * | 1949-07-02 | 1954-05-04 | United States Steel Corp | Method of electrotinning continuous steel strip |
| US3404075A (en) * | 1962-04-05 | 1968-10-01 | Geigy Chem Corp | Electrodeposition of tin |
| US3483099A (en) * | 1964-08-20 | 1969-12-09 | Dai Ichi Kogyo Seiyaku Co Ltd | Tin electroplating electrolyte |
| JPS4916176B1 (en) * | 1970-11-16 | 1974-04-20 | ||
| US4052276A (en) * | 1976-04-14 | 1977-10-04 | Nippon Steel Corporation | Treatment process for electrolytic purifying of used solution for electrolytic tin plating |
| FR2524252A1 (en) * | 1982-03-30 | 1983-10-07 | Mach Agricoles Cie Fse | Fixture for wear-resistant plate e.g. on plough - uses bolt passing through self locking washer and plate to screw into threaded hole in share |
| US4459185A (en) * | 1982-10-08 | 1984-07-10 | Obata, Doni, Daiwa, Fine Chemicals Co., Ltd. | Tin, lead, and tin-lead alloy plating baths |
| US4582576A (en) * | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
| US4885064A (en) * | 1989-05-22 | 1989-12-05 | Mcgean-Rohco, Inc. | Additive composition, plating bath and method for electroplating tin and/or lead |
| DE4022361A1 (en) * | 1990-06-26 | 1992-01-16 | Toyo Kohan Co Ltd | TIN STEEL PLATE WITH A CHROMIN DOUBLE LAYER AND A COPOLYESTER RESIN LAMINATE, METHOD FOR THE PRODUCTION THEREOF AND ITS USE |
| EP0786539A2 (en) | 1996-01-26 | 1997-07-30 | Elf Atochem North America, Inc. | High current density zinc organosulfonate electrogalvanizing process and composition |
| US20080283407A1 (en) * | 2005-12-30 | 2008-11-20 | Martyak Nicholas M | High Speed Tin Plating Process |
| US8197663B2 (en) * | 2005-12-30 | 2012-06-12 | Arkema Inc. | High speed tin plating process |
| EP3385409A1 (en) * | 2017-04-04 | 2018-10-10 | Estanos y Soldaduras Senra, S.L.U. | Electrolytic sulphuric acid bath and method for tin electrorefinig |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US2313371A (en) | Electrodeposition of tin and its alloys | |
| US2525942A (en) | Electrodepositing bath and process | |
| US2436316A (en) | Bright alloy plating | |
| US2693444A (en) | Electrodeposition of chromium and alloys thereof | |
| US2250556A (en) | Electrodeposition of copper and bath therefor | |
| US2370986A (en) | Electroplating baths | |
| US2457061A (en) | Method for bonding a nickel electrodeposit to a nickel surface | |
| US2075623A (en) | Zinc plating | |
| US905837A (en) | Electrolyte. | |
| US2750333A (en) | Electrodeposition of antimony and antimony alloys | |
| US2511395A (en) | Process for the electrodeposition of tin alloys | |
| US4297179A (en) | Palladium electroplating bath and process | |
| US2773022A (en) | Electrodeposition from copper electrolytes containing dithiocarbamate addition agents | |
| US2287654A (en) | Copper plating | |
| US2577365A (en) | Rhodium plating | |
| US2734025A (en) | Twatktnw att | |
| US2489523A (en) | Electrodeposition of tin or lead-tin alloys | |
| US1787139A (en) | Process of forming iron foils | |
| US2398614A (en) | Electrodeposition of manganese | |
| US4411744A (en) | Bath and process for high speed nickel electroplating | |
| US2421265A (en) | Rapid zinc depositing bath | |
| CA1180677A (en) | Bath and process for high speed nickel electroplating | |
| US2439935A (en) | Indium electroplating | |
| US2739933A (en) | Electrodeposition of ternary alloys | |
| US2809929A (en) | Anode for copper plating |