GB1313197A - Copper electrodeposition bath and method - Google Patents

Copper electrodeposition bath and method

Info

Publication number
GB1313197A
GB1313197A GB5998270A GB5998270A GB1313197A GB 1313197 A GB1313197 A GB 1313197A GB 5998270 A GB5998270 A GB 5998270A GB 5998270 A GB5998270 A GB 5998270A GB 1313197 A GB1313197 A GB 1313197A
Authority
GB
United Kingdom
Prior art keywords
copper
bath
polyethyleneimine
electro
organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5998270A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Udylite Corp
Original Assignee
Udylite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Udylite Corp filed Critical Udylite Corp
Publication of GB1313197A publication Critical patent/GB1313197A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

1313197 Electro-deposition of copper UDYLITE CORP 17 Dec 1970 [12 Feb 1970] 59982/70 Heading C7B Copper is electro-deposited from an aqueous, acidic plating bath containing a brightening amount of a quaternary ammonium compound obtained by reacting polyethyleneimine with an organic compound capable of quaternizing polyethyleneimine. Various quarternizing agents are listed including benzine chloride, allyl bromide, dimethyl sulphate; and propane sultone; and the agent may be reacted with the polyethyleneimine in an organic solvent, eg dioxane. The bath may also contain a polyether, eg polyglycol, and an organic sulphide having at least one sulphonic group, eg a mercaptan, thiocarbamate or tioxanthate. The bath may be of low copper content, eg down to 7À5 g/l copper. The bath may be used for both plating and refining of copper.
GB5998270A 1970-02-12 1970-12-17 Copper electrodeposition bath and method Expired GB1313197A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US1102470A 1970-02-12 1970-02-12

Publications (1)

Publication Number Publication Date
GB1313197A true GB1313197A (en) 1973-04-11

Family

ID=21748527

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5998270A Expired GB1313197A (en) 1970-02-12 1970-12-17 Copper electrodeposition bath and method

Country Status (6)

Country Link
JP (1) JPS5118894B1 (en)
BR (1) BR7100263D0 (en)
FR (1) FR2079372B1 (en)
GB (1) GB1313197A (en)
NL (1) NL172085C (en)
ZA (1) ZA708430B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2141141A (en) * 1983-06-10 1984-12-12 Omi Int Corp Electrodepositing copper
CN103397354A (en) * 2013-08-08 2013-11-20 上海新阳半导体材料股份有限公司 Additive used for reducing voids generated after annealing of through-silicon-via copper plating
US9222188B2 (en) 2002-03-05 2015-12-29 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
US9493884B2 (en) 2002-03-05 2016-11-15 Enthone Inc. Copper electrodeposition in microelectronics
CN114351195A (en) * 2022-03-19 2022-04-15 深圳市创智成功科技有限公司 Electro-coppering formula for pulse through hole filling and electro-coppering process thereof

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA739310B (en) * 1972-12-14 1974-11-27 M & T Chemicals Inc Electrode position of copper
JPS53114596U (en) * 1977-02-14 1978-09-12
CA1105045A (en) * 1977-05-04 1981-07-14 Hans G. Creutz (Deceased) Electrodeposition of copper

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1246347B (en) * 1966-03-08 1967-08-03 Schering Ag Acid galvanic copper bath
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2141141A (en) * 1983-06-10 1984-12-12 Omi Int Corp Electrodepositing copper
US9222188B2 (en) 2002-03-05 2015-12-29 Enthone Inc. Defect reduction in electrodeposited copper for semiconductor applications
US9493884B2 (en) 2002-03-05 2016-11-15 Enthone Inc. Copper electrodeposition in microelectronics
CN103397354A (en) * 2013-08-08 2013-11-20 上海新阳半导体材料股份有限公司 Additive used for reducing voids generated after annealing of through-silicon-via copper plating
CN103397354B (en) * 2013-08-08 2016-10-26 上海新阳半导体材料股份有限公司 A kind of additive in cavity after reducing silicon through hole technology copper facing annealing
CN114351195A (en) * 2022-03-19 2022-04-15 深圳市创智成功科技有限公司 Electro-coppering formula for pulse through hole filling and electro-coppering process thereof

Also Published As

Publication number Publication date
NL172085C (en) 1983-07-01
FR2079372B1 (en) 1974-02-22
DE2105472A1 (en) 1971-08-26
JPS5118894B1 (en) 1976-06-14
FR2079372A1 (en) 1971-11-12
BR7100263D0 (en) 1973-05-24
NL7100321A (en) 1971-08-16
DE2105472B2 (en) 1975-11-20
ZA708430B (en) 1971-09-29

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Legal Events

Date Code Title Description
PS Patent sealed
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PE20 Patent expired after termination of 20 years