GB1372850A - Acidic copper electrolytes - Google Patents

Acidic copper electrolytes

Info

Publication number
GB1372850A
GB1372850A GB4938671A GB4938671A GB1372850A GB 1372850 A GB1372850 A GB 1372850A GB 4938671 A GB4938671 A GB 4938671A GB 4938671 A GB4938671 A GB 4938671A GB 1372850 A GB1372850 A GB 1372850A
Authority
GB
United Kingdom
Prior art keywords
copper
acid
compound
oct
listed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4938671A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of GB1372850A publication Critical patent/GB1372850A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Conductive Materials (AREA)

Abstract

1372850 Acid copper electrolytes SCHERING A G 25 Oct 1971 [29 Oct 1970] 49386/71 Heading C7B An acidic, aqueous copper electrolyte contains a selenium compound of the formula: in which n = I or 2, R 1 is an aromatic aliphatic, cycloaliphatic, araliphatic or heterocyclic hydrocarbon group containing a sulphonic acid group, and R 2 is either an organic group as listed for R 1 , a cyanide or a sulphonic acid group; or a salt of such compound. Various compounds are listed. The plating bath may comprise copper sulphate and sulphuric acid in which chloride may be present, or copper fluoborate/fluoboric acid. An oxygen containing high molecular weight compound, e.g. polyvinyl alcohol, carboxy methyl cellulose, etc., may also be present in the bath.
GB4938671A 1970-10-29 1971-10-25 Acidic copper electrolytes Expired GB1372850A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2053860A DE2053860C3 (en) 1970-10-29 1970-10-29 Acid aqueous bath for the galvanic deposition of shiny copper coatings

Publications (1)

Publication Number Publication Date
GB1372850A true GB1372850A (en) 1974-11-06

Family

ID=5786940

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4938671A Expired GB1372850A (en) 1970-10-29 1971-10-25 Acidic copper electrolytes

Country Status (18)

Country Link
US (1) US3767539A (en)
JP (1) JPS5126893B1 (en)
AT (1) AT307844B (en)
AU (1) AU450638B2 (en)
BE (1) BE774697A (en)
BR (1) BR7107116D0 (en)
CA (1) CA967110A (en)
CH (1) CH563466A5 (en)
DE (1) DE2053860C3 (en)
ES (1) ES395741A1 (en)
FR (1) FR2111926B1 (en)
GB (1) GB1372850A (en)
IE (1) IE35774B1 (en)
NL (1) NL169353C (en)
SE (1) SE364737B (en)
SU (1) SU452107A3 (en)
YU (1) YU34721B (en)
ZA (1) ZA716879B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4417956A (en) * 1980-07-17 1983-11-29 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
US4540473A (en) * 1983-11-22 1985-09-10 International Business Machines Corporation Copper plating bath having increased plating rate, and method
US6024857A (en) 1997-10-08 2000-02-15 Novellus Systems, Inc. Electroplating additive for filling sub-micron features
KR100659544B1 (en) * 1999-11-12 2006-12-19 에바라 유지라이토 코포레이션 리미티드 Via-filling process
US6676823B1 (en) * 2002-03-18 2004-01-13 Taskem, Inc. High speed acid copper plating

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE322956B (en) * 1966-08-20 1970-04-20 Schering Ag
US3492135A (en) * 1967-02-01 1970-01-27 Schering Ag Stabilized bath for deposition of copper by chemical reduction
BE759316A (en) * 1969-12-30 1971-04-30 Parker Ste Continentale COMPOSITION AND METHOD FOR FORMING A COPPER DEPOSIT ON FERROUS METAL SURFACES

Also Published As

Publication number Publication date
SE364737B (en) 1974-03-04
BR7107116D0 (en) 1973-03-29
DE2053860C3 (en) 1980-11-06
CA967110A (en) 1975-05-06
ZA716879B (en) 1972-06-28
BE774697A (en) 1972-05-02
DE2053860A1 (en) 1972-06-08
IE35774B1 (en) 1976-05-12
NL169353B (en) 1982-02-01
SU452107A3 (en) 1974-11-30
AU450638B2 (en) 1974-07-18
US3767539A (en) 1973-10-23
IE35774L (en) 1972-04-29
NL7114979A (en) 1972-05-03
AT307844B (en) 1973-06-12
JPS5126893B1 (en) 1976-08-09
FR2111926B1 (en) 1974-10-11
FR2111926A1 (en) 1972-06-09
CH563466A5 (en) 1975-06-30
AU3473471A (en) 1973-05-03
ES395741A1 (en) 1974-09-16
YU250971A (en) 1979-04-30
YU34721B (en) 1979-12-31
NL169353C (en) 1982-07-01
DE2053860B2 (en) 1980-03-13

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee