JPS5236089B1 - - Google Patents
Info
- Publication number
- JPS5236089B1 JPS5236089B1 JP47043801A JP4380172A JPS5236089B1 JP S5236089 B1 JPS5236089 B1 JP S5236089B1 JP 47043801 A JP47043801 A JP 47043801A JP 4380172 A JP4380172 A JP 4380172A JP S5236089 B1 JPS5236089 B1 JP S5236089B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14550871A | 1971-05-20 | 1971-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5236089B1 true JPS5236089B1 (en) | 1977-09-13 |
Family
ID=22513423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47043801A Pending JPS5236089B1 (en) | 1971-05-20 | 1972-05-04 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3661597A (en) |
| JP (1) | JPS5236089B1 (en) |
| CA (1) | CA979603A (en) |
| GB (1) | GB1352087A (en) |
| IT (1) | IT946822B (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3751289A (en) * | 1971-08-20 | 1973-08-07 | M & T Chemicals Inc | Method of preparing surfaces for electroplating |
| JPS56156749A (en) * | 1980-05-08 | 1981-12-03 | Toshiba Corp | Chemical copper plating solution |
| US4563217A (en) * | 1983-07-25 | 1986-01-07 | Hitachi, Ltd. | Electroless copper plating solution |
| EP0179212B1 (en) * | 1984-09-27 | 1991-12-27 | Kabushiki Kaisha Toshiba | Chemical copper plating solution |
| US4600609A (en) * | 1985-05-03 | 1986-07-15 | Macdermid, Incorporated | Method and composition for electroless nickel deposition |
| US5075039A (en) * | 1990-05-31 | 1991-12-24 | Shipley Company Inc. | Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles |
| US5120578A (en) * | 1990-05-31 | 1992-06-09 | Shipley Company Inc. | Coating composition |
| US5288313A (en) * | 1990-05-31 | 1994-02-22 | Shipley Company Inc. | Electroless plating catalyst |
| WO2000075395A1 (en) | 1999-06-09 | 2000-12-14 | Laird Technologies, Inc. | Electrically conductive polymeric foam and method of preparation thereof |
| US20050121327A1 (en) * | 2003-12-04 | 2005-06-09 | Giin-Shan Chen | Electroless-plated deposit process for silicon based dielectric insulating material |
| EP1793013B1 (en) * | 2005-12-05 | 2017-07-19 | Rohm and Haas Electronic Materials LLC | Metallization of dielectrics |
| EP2639335B1 (en) * | 2012-03-14 | 2015-09-16 | Atotech Deutschland GmbH | Alkaline plating bath for electroless deposition of cobalt alloys |
| TWI707061B (en) * | 2015-11-27 | 2020-10-11 | 德商德國艾托特克公司 | Plating bath composition and method for electroless plating of palladium |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3472664A (en) * | 1966-09-15 | 1969-10-14 | Enthone | Inhibiting stardusting in electroless copper plating |
| US3457089A (en) * | 1967-04-07 | 1969-07-22 | Shipley Co | Electroless copperplating |
-
1971
- 1971-05-20 US US145508A patent/US3661597A/en not_active Expired - Lifetime
-
1972
- 1972-01-21 IT IT19688/72A patent/IT946822B/en active
- 1972-02-09 CA CA134,344A patent/CA979603A/en not_active Expired
- 1972-02-29 GB GB930472A patent/GB1352087A/en not_active Expired
- 1972-05-04 JP JP47043801A patent/JPS5236089B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2205869B2 (en) | 1976-02-19 |
| DE2205869A1 (en) | 1972-12-07 |
| US3661597A (en) | 1972-05-09 |
| GB1352087A (en) | 1974-05-15 |
| CA979603A (en) | 1975-12-16 |
| IT946822B (en) | 1973-05-21 |