US3457089A - Electroless copperplating - Google Patents
Electroless copperplating Download PDFInfo
- Publication number
- US3457089A US3457089A US629122A US3457089DA US3457089A US 3457089 A US3457089 A US 3457089A US 629122 A US629122 A US 629122A US 3457089D A US3457089D A US 3457089DA US 3457089 A US3457089 A US 3457089A
- Authority
- US
- United States
- Prior art keywords
- solution
- alcohol
- copper
- electroless copper
- electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Description
United States Patent Int. Cl. C23c 3/00 U.S. Cl. 106-1 Claims ABSTRACT OF THE DISCLOSURE The disclosure describes an improved electroless copper plating solution which includes a soluble alkaline alcohol for improving stability.
Background of the invention This invention relates to autocatalytic electroless deposition of copper and has for its principal object the improvision of improved copper plating solution and deposition methods employing the same.
Electroless copper deposition refers to the chemical reductive plating of copper over active surfaces in the absence of external electric current. Such processes and compositions useful therein are known and are in substantial commercial use. They are disclosed in a number of prior art patents, for example, U.S. Patent No. 3,011,920, issued Dec. 16, 1961.
Known electroless copper deposition solutions comprise four ingredients dissolved in water. These are (l) a source of cupric ions, usually copper sulphate, (2) formaldehyde as reducing agent therefore, (3) alkali, generally an alkali metal hydroxide and usually sodium hydroxide, sufiicient to provide the required alkaline solution in which said compositions are effective, and (4) a complexing agent for the copper sufficient to prevent its precipitation in alkaline solution. A large number of suitable complexing agents are known and are described for example in the above cited patent, and also in US. Patents Nos. 2,874,072; 3,075,856; 3,119,709 and 3,075,855.
The above compositions containing both an oxidizing and a reducing agent present in the same solution, have limited stability and tend to trigger with reduction of substantially all the copper in the solution. Consequently, it is customary to include stabilizers in the composition which provide resistance against triggering and which increase the range of usable concentration and temperature without destroying the capacity of the solutions for depositing copper by reduction at catalytic surfaces in contact therewith.
Summary of the invention In accordance with the present invention it has been discovered that electroless plating solutions of the above type can be substantially improved in stability and other properties by the inclusion therein of effective amounts of a soluble lower alkine alcohol in which the acetylenic group, and particularly such a group containing an active hydrogen atom, is believed to be the effective portion.
Description The alkine alcohols useful according to this invention have the following formulas:
wherein each of R, R, and R" individually are a lower monovalent hydroxy-alkyl, cyclohydroxy-alkyl, or bydroxy-alkyl ether radical, said alkine alcohol being soluble in the alkaline electroless copper solution. Useful examples include the following:
ice
(1) Ethynl cyclohexanol CHr-OH: CECE Ca.
CH OH; \OH 2) Methyl butynol CH3- CECH (3) Methyl pentynol CH3 CHg-CH -(E-CECH (4) Dimethyl hexynol CH3 CH CHg-H-CHz--CECH (5) 2-butyne-l,4-diol C-CHTOH I(ILICH2-OH (6) Dimethyl hexynediol CH1 CH3 oH 3c-=-o( J-oHz (7) Propargyl alcohol HG CCHr-OH (8) Bis-hydroxyethyl butynediol ether (10) Ethyl octynol (EH-CH; CH -CHg-CH -CH -BF-(ilH-CEOH The above alcohols are used in quantities which are effective to improve stability or otherwise improve the performance of the solution but in quantities that are not so great as to prevent deposition. Generally useful quantities are between 2.5 and 2000 parts per million of total solution weight and the preferred range is from about 25 to parts per million.
The preferred example according to this invention is as follows:
CuSO .5H 0 g 7.5 NaOH g 5.0 HCI-IO g 2.5 Rochelle salts g 12.0 Methyl butynol p.p.m 25 to 150 Water, to make 1 liter.
employed to serve as a reducing agent for the copper in the presence of a catalytic surface and sufiicient complexing agent used to prevent precipitation of copper in the alkali solution during storage and use. Generally, the known concentrations most useful for these are given in the following table.
TABLE.CONCENTRATIONS Cu++ mols/liter 0.02 to 0.12 Alkali mols/liter 0.17 to 1.15 HCHO mols/mol Cu++ 2 to 20 Complexer mols/mol Cu' 1.1 to 5 The use of the alkine alcohols as herein described is believed to be effective through the acetylenic group to hold impurities such as cuprous materials in deactivated form. The hydroxyl group is believed to render the alcohol soluble in basic solution. Other solubilizing substituents can be used but hydroxy radicals are preferred.
It should be understood that the foregoing description is for the purpose of illustration and that the invention includes all modifications within the scope of the appended claims.
We claim:
1. In an autocatalytic electroless copper solution having, in basic aqueous solution, a source of cupric ions, formaldehyde, and a complexing agent sufficient to render said cupric ions soluble in basic solution, the improvement wherein said solution also contains as stabilizer an alkine alcohol having one of the following formulas:
wherein each of R, R and R" are lower monovalent hydroxy-alkyl, cyclo-hydroxy-alkyl, or hydroxy-alkyl ether radicals, said alcohol being soluble in said basic aqueous solution and being present in an effective amount sufficient to prevent copper deposition in contact with a catalytic surface.
Cir
2. An electroless copper solution according to claim 1 wherein said alcohol is present between about 2.5 and 2000 parts per million by weight of said solution.
3. An electroless copper solution according to claim 1 wherein said alcohol has the formula and wherein the OH radical on said R radical is attached to the carbon atom thereof adjacent the acetylenic group.
4. An electroless copper solution according to claim 3 wherein said alcohol is present in an amount between about 2.5 and 2000 parts per million of solution weight.
5. An electroless copper solution according to claim 1 wherein said alcohol is methyl butynol.
6. An electroless copper solution according to claim 1 wherein said alcohol is methyl pentynol.
7. An electroless copper solution according to claim 1 wherein said alcohol is dimethyl hexynol.
8. An electroless copper solution according to claim 1 wherein said alcohol is hexynol.
9. A process for autocatalytic electroless copper deposition which comprises contacting a catalytic surface with a solution according to claim 2.
10. A process for autocatalytic electroless copper deposition which comprises contacting a catalytic surface with a solution according to claim 4.
References Cited UNITED STATES PATENTS 6/1967 Zeblisky. 1/1968 Schneble et al.
US. Cl. X.R. 117-130, 160
2733 UNITED STATES PATENT OFFICE CERTIFICATE OF CORRECTION W63 Paten N 3 4W 08 Dated Jnl v we 106C:
Inventor) Charles R. Shiple'y, Jr arid Michael Gulla It is certified that error appears in the above-identified patent and that said Letters Patent are hereby corrected as shown below:
In claim 1, line 12, the term "sufficient" should be changed to --insufficient--.
Signed and sealed this 19th day of September 1972. i v
(SEAL) Attest:
EDWARD M.FLETCHER,JR. ROBERT GOTISCHALK Attesting Officer Commissioner of Patents
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US62912267A | 1967-04-07 | 1967-04-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3457089A true US3457089A (en) | 1969-07-22 |
Family
ID=24521668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US629122A Expired - Lifetime US3457089A (en) | 1967-04-07 | 1967-04-07 | Electroless copperplating |
Country Status (1)
Country | Link |
---|---|
US (1) | US3457089A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3622367A (en) * | 1970-03-24 | 1971-11-23 | Mobil Oil Corp | Contact deposition of platinum and other metals |
US3635761A (en) * | 1970-05-05 | 1972-01-18 | Mobil Oil Corp | Electroless deposition of metals |
US3649350A (en) * | 1970-06-29 | 1972-03-14 | Gen Electric | Electroless copper plating |
US3661597A (en) * | 1971-05-20 | 1972-05-09 | Shipley Co | Electroless copper plating |
US3663242A (en) * | 1970-09-25 | 1972-05-16 | Shipley Co | Stabilized electroless plating solutions |
US3790392A (en) * | 1972-01-17 | 1974-02-05 | Dynachem Corp | Electroless copper plating |
US4371397A (en) * | 1980-05-08 | 1983-02-01 | Tokyo Shibaura Denki Kabushiki Kaisha | Chemical copper-plating bath |
US4600609A (en) * | 1985-05-03 | 1986-07-15 | Macdermid, Incorporated | Method and composition for electroless nickel deposition |
US20150110965A1 (en) * | 2012-06-04 | 2015-04-23 | Atotech Deutschland Gmbh | Plating bath for electroless deposition of nickel layers |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3326700A (en) * | 1963-06-12 | 1967-06-20 | Rudolph J Zeblisky | Electroless copper plating |
US3361580A (en) * | 1963-06-18 | 1968-01-02 | Day Company | Electroless copper plating |
-
1967
- 1967-04-07 US US629122A patent/US3457089A/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3326700A (en) * | 1963-06-12 | 1967-06-20 | Rudolph J Zeblisky | Electroless copper plating |
US3361580A (en) * | 1963-06-18 | 1968-01-02 | Day Company | Electroless copper plating |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3622367A (en) * | 1970-03-24 | 1971-11-23 | Mobil Oil Corp | Contact deposition of platinum and other metals |
US3635761A (en) * | 1970-05-05 | 1972-01-18 | Mobil Oil Corp | Electroless deposition of metals |
US3649350A (en) * | 1970-06-29 | 1972-03-14 | Gen Electric | Electroless copper plating |
US3663242A (en) * | 1970-09-25 | 1972-05-16 | Shipley Co | Stabilized electroless plating solutions |
US3661597A (en) * | 1971-05-20 | 1972-05-09 | Shipley Co | Electroless copper plating |
US3790392A (en) * | 1972-01-17 | 1974-02-05 | Dynachem Corp | Electroless copper plating |
US4371397A (en) * | 1980-05-08 | 1983-02-01 | Tokyo Shibaura Denki Kabushiki Kaisha | Chemical copper-plating bath |
US4600609A (en) * | 1985-05-03 | 1986-07-15 | Macdermid, Incorporated | Method and composition for electroless nickel deposition |
WO1986006754A1 (en) * | 1985-05-03 | 1986-11-20 | Macdermid, Incorporated | Method and composition for electroless nickel deposition |
US20150110965A1 (en) * | 2012-06-04 | 2015-04-23 | Atotech Deutschland Gmbh | Plating bath for electroless deposition of nickel layers |
US9175399B2 (en) * | 2012-06-04 | 2015-11-03 | Atotech Deutschland Gmbh | Plating bath for electroless deposition of nickel layers |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3403035A (en) | Process for stabilizing autocatalytic metal plating solutions | |
US3310430A (en) | Electroless copper plating | |
US3993491A (en) | Electroless plating | |
US3457089A (en) | Electroless copperplating | |
US3485597A (en) | Electroless deposition of nickel-phosphorus based alloys | |
US3745039A (en) | Electroless cobalt plating bath and process | |
US3717482A (en) | Stabilized electroless plating solutions | |
US3615732A (en) | Electroless copper plating | |
US3650777A (en) | Electroless copper plating | |
US4002786A (en) | Method for electroless copper plating | |
US2874072A (en) | Autocatalytic copper plating process and solution | |
US4150171A (en) | Electroless plating | |
US3853590A (en) | Electroless plating solution and process | |
US3661597A (en) | Electroless copper plating | |
US3607317A (en) | Ductility promoter and stabilizer for electroless copper plating baths | |
US4371397A (en) | Chemical copper-plating bath | |
US3663242A (en) | Stabilized electroless plating solutions | |
US3649308A (en) | Stabilized electroless plating solutions | |
KR101206538B1 (en) | Electroless copper plating solution and method for electroless copper plating | |
US3396042A (en) | Chemical gold plating composition | |
GB1194625A (en) | Boron Containing Composite Metallic Films and Plating Baths for their Electroless Deposition | |
US3728137A (en) | Electroless copper plating | |
US3790392A (en) | Electroless copper plating | |
US3615733A (en) | Electroless copper plating | |
KR850001554B1 (en) | Electroless bath for plating copper |