GB1352087A - Electroless copper plating - Google Patents

Electroless copper plating

Info

Publication number
GB1352087A
GB1352087A GB930472A GB930472A GB1352087A GB 1352087 A GB1352087 A GB 1352087A GB 930472 A GB930472 A GB 930472A GB 930472 A GB930472 A GB 930472A GB 1352087 A GB1352087 A GB 1352087A
Authority
GB
United Kingdom
Prior art keywords
copper plating
alkylene
acetylenes
formula
electroless copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB930472A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of GB1352087A publication Critical patent/GB1352087A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

1352087 Polyether acetylenes; copper plating baths SHIPLEY CO Inc 29 Feb 1972 [20 May 1971] 9304/72 Heading C3R [Also in Division C7] Aqueous, alkaline electroless copper plating solutions comprise a source of cupric ions (e.g. copper sulphate), formaldehyde or a formaldehyde precursor as a reducing agent, a complexing agent to maintain said cupric ions in solution (e.g. Rochelle salts), hydroxide radicals to provide the required solution pH (e.g. as provided by sodium hydroxide), and a stabilizer of the formula wherein R, R<SP>1</SP> and R<SP>11</SP> independently denote a C 1 -C 12 divalent alkylene, cycloalkylene, alkylene ether or arylene radical optionally substituted by polar groups such as -NH 2 , -SO 3 OH, -COOH, -NO 3 , -Cl, -Br, -I or -F, A denotes a C 2 -C 5 alkylene radical and n is an integer of from 1 to 100. The above polyether acetylenes are prepared by alkoxylation of alkyne alcohols of the formula HC # C-R-OH or HO-R<SP>1</SP>-C # C-R<SP>11</SP>-OH at 50 to 150‹ C. in presence of BCl 3 or a tertiary amine.
GB930472A 1971-05-20 1972-02-29 Electroless copper plating Expired GB1352087A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14550871A 1971-05-20 1971-05-20

Publications (1)

Publication Number Publication Date
GB1352087A true GB1352087A (en) 1974-05-15

Family

ID=22513423

Family Applications (1)

Application Number Title Priority Date Filing Date
GB930472A Expired GB1352087A (en) 1971-05-20 1972-02-29 Electroless copper plating

Country Status (5)

Country Link
US (1) US3661597A (en)
JP (1) JPS5236089B1 (en)
CA (1) CA979603A (en)
GB (1) GB1352087A (en)
IT (1) IT946822B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0039757A1 (en) * 1980-05-08 1981-11-18 Kabushiki Kaisha Toshiba Chemical copper-plating bath
EP0132594A1 (en) * 1983-07-25 1985-02-13 Hitachi, Ltd. Electroless copper plating solution

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3751289A (en) * 1971-08-20 1973-08-07 M & T Chemicals Inc Method of preparing surfaces for electroplating
EP0179212B1 (en) * 1984-09-27 1991-12-27 Kabushiki Kaisha Toshiba Chemical copper plating solution
US4600609A (en) * 1985-05-03 1986-07-15 Macdermid, Incorporated Method and composition for electroless nickel deposition
US5075039A (en) * 1990-05-31 1991-12-24 Shipley Company Inc. Platable liquid film forming coating composition containing conductive metal sulfide coated inert inorganic particles
US5120578A (en) * 1990-05-31 1992-06-09 Shipley Company Inc. Coating composition
US5288313A (en) * 1990-05-31 1994-02-22 Shipley Company Inc. Electroless plating catalyst
AU5453200A (en) 1999-06-09 2000-12-28 Laird Technologies, Inc. Electrically conductive polymeric foam and method of preparation thereof
US20050121327A1 (en) * 2003-12-04 2005-06-09 Giin-Shan Chen Electroless-plated deposit process for silicon based dielectric insulating material
EP1793013B1 (en) * 2005-12-05 2017-07-19 Rohm and Haas Electronic Materials LLC Metallization of dielectrics
EP2639335B1 (en) * 2012-03-14 2015-09-16 Atotech Deutschland GmbH Alkaline plating bath for electroless deposition of cobalt alloys
TWI707061B (en) * 2015-11-27 2020-10-11 德商德國艾托特克公司 Plating bath composition and method for electroless plating of palladium

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3472664A (en) * 1966-09-15 1969-10-14 Enthone Inhibiting stardusting in electroless copper plating
US3457089A (en) * 1967-04-07 1969-07-22 Shipley Co Electroless copperplating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0039757A1 (en) * 1980-05-08 1981-11-18 Kabushiki Kaisha Toshiba Chemical copper-plating bath
EP0132594A1 (en) * 1983-07-25 1985-02-13 Hitachi, Ltd. Electroless copper plating solution

Also Published As

Publication number Publication date
IT946822B (en) 1973-05-21
DE2205869B2 (en) 1976-02-19
CA979603A (en) 1975-12-16
US3661597A (en) 1972-05-09
JPS5236089B1 (en) 1977-09-13
DE2205869A1 (en) 1972-12-07

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee