JPS56108892A - Plating solution with pure gold - Google Patents
Plating solution with pure goldInfo
- Publication number
- JPS56108892A JPS56108892A JP931680A JP931680A JPS56108892A JP S56108892 A JPS56108892 A JP S56108892A JP 931680 A JP931680 A JP 931680A JP 931680 A JP931680 A JP 931680A JP S56108892 A JPS56108892 A JP S56108892A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- phosphorus compound
- org
- pure gold
- producing pure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title abstract 5
- 239000010931 gold Substances 0.000 title abstract 5
- 229910052737 gold Inorganic materials 0.000 title abstract 5
- 238000007747 plating Methods 0.000 title abstract 4
- 229910052698 phosphorus Inorganic materials 0.000 abstract 6
- 239000011574 phosphorus Substances 0.000 abstract 6
- -1 phosphorus compound Chemical class 0.000 abstract 5
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical compound [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 abstract 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 238000004070 electrodeposition Methods 0.000 abstract 2
- MJPWXCPGHYETKV-UHFFFAOYSA-N (3-hydroxy-1-phosphonopropyl)phosphonic acid Chemical compound OCCC(P(O)(O)=O)P(O)(O)=O MJPWXCPGHYETKV-UHFFFAOYSA-N 0.000 abstract 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- 229920002873 Polyethylenimine Polymers 0.000 abstract 1
- 239000002738 chelating agent Substances 0.000 abstract 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
PURPOSE: To provide a gilding soln., having excellent uniform electrodeposition capability and making thick gilding possible, and giving glossy gold, by composing it essentially of org. phosphorus compound and gold sulfite or gold sulfite acetylated with ethylenediaminetetraacetic acid.
CONSTITUTION: This plating soln. producing pure gold coating contains 0.5W 30g/l said gold sulfite and 10W100g/l org. phosphorus compound. For said phosphorus compound is used a stable water-soluble phosphorus compound of 4W5 valent phosphorus e.g. diphosphonoethylhydroxy methane. In addition, said plating soln. producing pure gold coating contains 5W50g/l NaOH or KOH as the pH adjustor of the org. phosphorus compound, 0.1W100g/l EDTA as the chelating agent of gold sulfite. This plating soln. producing pure gold contains further 1W 10mg/l polyethyleneimine etc. and 1W200mg/l or Tl as an inorg. admixture in order to improve uniform electrodeposition capability.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP931680A JPS56108892A (en) | 1980-01-31 | 1980-01-31 | Plating solution with pure gold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP931680A JPS56108892A (en) | 1980-01-31 | 1980-01-31 | Plating solution with pure gold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56108892A true JPS56108892A (en) | 1981-08-28 |
| JPH0138879B2 JPH0138879B2 (en) | 1989-08-16 |
Family
ID=11717058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP931680A Granted JPS56108892A (en) | 1980-01-31 | 1980-01-31 | Plating solution with pure gold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56108892A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59143084A (en) * | 1983-01-28 | 1984-08-16 | オ−エムアイ・インタ−ナシヨナル・コ−ポレ−シヨン | Modified gold sulfide plating bath |
| JPS6029483A (en) * | 1983-07-29 | 1985-02-14 | Electroplating Eng Of Japan Co | Pure gold plating liquid |
| JP2007092156A (en) * | 2005-09-30 | 2007-04-12 | Ne Chemcat Corp | Non-cyanogen based gold electroplating bath for forming bump |
| JP2009111043A (en) * | 2007-10-29 | 2009-05-21 | Sony Chemical & Information Device Corp | Electric connection body, and manufacturing method thereof |
| CN105112953A (en) * | 2015-09-17 | 2015-12-02 | 深圳市瑞世兴科技有限公司 | Cyanide-free gold plating solution |
| CN110699713A (en) * | 2019-11-21 | 2020-01-17 | 长春黄金研究院有限公司 | Cyanide-free gold alloy electroforming solution and using method thereof |
| CN111501073A (en) * | 2020-04-24 | 2020-08-07 | 深圳市黄金谷金业有限公司 | Method for prolonging service life of cyanide-free gold sodium sulfite-ethylenediamine electroplating solution |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4923976A (en) * | 1972-07-03 | 1974-03-02 |
-
1980
- 1980-01-31 JP JP931680A patent/JPS56108892A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4923976A (en) * | 1972-07-03 | 1974-03-02 |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59143084A (en) * | 1983-01-28 | 1984-08-16 | オ−エムアイ・インタ−ナシヨナル・コ−ポレ−シヨン | Modified gold sulfide plating bath |
| JPS6029483A (en) * | 1983-07-29 | 1985-02-14 | Electroplating Eng Of Japan Co | Pure gold plating liquid |
| JPH0350839B2 (en) * | 1983-07-29 | 1991-08-02 | Nippon Erekutoropureiteingu Enjinyaazu Kk | |
| JP2007092156A (en) * | 2005-09-30 | 2007-04-12 | Ne Chemcat Corp | Non-cyanogen based gold electroplating bath for forming bump |
| JP2009111043A (en) * | 2007-10-29 | 2009-05-21 | Sony Chemical & Information Device Corp | Electric connection body, and manufacturing method thereof |
| KR101505214B1 (en) * | 2007-10-29 | 2015-03-23 | 데쿠세리아루즈 가부시키가이샤 | Electrical connection body and method for fabricating the same |
| CN105112953A (en) * | 2015-09-17 | 2015-12-02 | 深圳市瑞世兴科技有限公司 | Cyanide-free gold plating solution |
| CN110699713A (en) * | 2019-11-21 | 2020-01-17 | 长春黄金研究院有限公司 | Cyanide-free gold alloy electroforming solution and using method thereof |
| CN111501073A (en) * | 2020-04-24 | 2020-08-07 | 深圳市黄金谷金业有限公司 | Method for prolonging service life of cyanide-free gold sodium sulfite-ethylenediamine electroplating solution |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0138879B2 (en) | 1989-08-16 |
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