JPS54103748A - Non-electrolytic copper plating - Google Patents

Non-electrolytic copper plating

Info

Publication number
JPS54103748A
JPS54103748A JP1080678A JP1080678A JPS54103748A JP S54103748 A JPS54103748 A JP S54103748A JP 1080678 A JP1080678 A JP 1080678A JP 1080678 A JP1080678 A JP 1080678A JP S54103748 A JPS54103748 A JP S54103748A
Authority
JP
Japan
Prior art keywords
plating
acid solution
electrolytic
formula
solution containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1080678A
Other languages
Japanese (ja)
Inventor
Kenji Sugii
Shinzo Imamura
Masaaki Furuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP1080678A priority Critical patent/JPS54103748A/en
Publication of JPS54103748A publication Critical patent/JPS54103748A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To produce a Cu film excellent in the adhesivity, luster, and color tone with addition of specified imidazole compound to the acid solution in non-electrolytic Cu plating on the iron surface using the acid solution containing Cu ion.
CONSTITUTION: With an iron immersed into an acid solution containing CuSO4 or the like in an amount of 0.05 to 8 g/1, preferably 0.1 to 5 g/l, a non-electrolytic Cu plating is applied to the Fe surface under the following condition: Imidazole compound (i.g. 2-mercapto-4, 5, 6, 7-tetrahydrobenzoimidazole and 2-mercaptobenzoimidazole) as shown by the formula I (R represents alkyl group excluding H and C4) and the formula II is allowed to be present at a rate of 0.03 to 0.1 mol per mol of Cu and a plating is performed at a bath temperature of 40 to 80°C for 0.5 to 30 minutes.
COPYRIGHT: (C)1979,JPO&Japio
JP1080678A 1978-02-02 1978-02-02 Non-electrolytic copper plating Pending JPS54103748A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1080678A JPS54103748A (en) 1978-02-02 1978-02-02 Non-electrolytic copper plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1080678A JPS54103748A (en) 1978-02-02 1978-02-02 Non-electrolytic copper plating

Publications (1)

Publication Number Publication Date
JPS54103748A true JPS54103748A (en) 1979-08-15

Family

ID=11760577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1080678A Pending JPS54103748A (en) 1978-02-02 1978-02-02 Non-electrolytic copper plating

Country Status (1)

Country Link
JP (1) JPS54103748A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63203773A (en) * 1987-02-19 1988-08-23 Nippon Mining Co Ltd Formation of metallic coated film on substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63203773A (en) * 1987-02-19 1988-08-23 Nippon Mining Co Ltd Formation of metallic coated film on substrate

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