JPS54103748A - Non-electrolytic copper plating - Google Patents
Non-electrolytic copper platingInfo
- Publication number
- JPS54103748A JPS54103748A JP1080678A JP1080678A JPS54103748A JP S54103748 A JPS54103748 A JP S54103748A JP 1080678 A JP1080678 A JP 1080678A JP 1080678 A JP1080678 A JP 1080678A JP S54103748 A JPS54103748 A JP S54103748A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- acid solution
- electrolytic
- formula
- solution containing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To produce a Cu film excellent in the adhesivity, luster, and color tone with addition of specified imidazole compound to the acid solution in non-electrolytic Cu plating on the iron surface using the acid solution containing Cu ion.
CONSTITUTION: With an iron immersed into an acid solution containing CuSO4 or the like in an amount of 0.05 to 8 g/1, preferably 0.1 to 5 g/l, a non-electrolytic Cu plating is applied to the Fe surface under the following condition: Imidazole compound (i.g. 2-mercapto-4, 5, 6, 7-tetrahydrobenzoimidazole and 2-mercaptobenzoimidazole) as shown by the formula I (R represents alkyl group excluding H and C4) and the formula II is allowed to be present at a rate of 0.03 to 0.1 mol per mol of Cu and a plating is performed at a bath temperature of 40 to 80°C for 0.5 to 30 minutes.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1080678A JPS54103748A (en) | 1978-02-02 | 1978-02-02 | Non-electrolytic copper plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1080678A JPS54103748A (en) | 1978-02-02 | 1978-02-02 | Non-electrolytic copper plating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54103748A true JPS54103748A (en) | 1979-08-15 |
Family
ID=11760577
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1080678A Pending JPS54103748A (en) | 1978-02-02 | 1978-02-02 | Non-electrolytic copper plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54103748A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63203773A (en) * | 1987-02-19 | 1988-08-23 | Nippon Mining Co Ltd | Formation of metallic coated film on substrate |
-
1978
- 1978-02-02 JP JP1080678A patent/JPS54103748A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63203773A (en) * | 1987-02-19 | 1988-08-23 | Nippon Mining Co Ltd | Formation of metallic coated film on substrate |
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