JPS579865A - Electroless copper plating solution - Google Patents

Electroless copper plating solution

Info

Publication number
JPS579865A
JPS579865A JP8291380A JP8291380A JPS579865A JP S579865 A JPS579865 A JP S579865A JP 8291380 A JP8291380 A JP 8291380A JP 8291380 A JP8291380 A JP 8291380A JP S579865 A JPS579865 A JP S579865A
Authority
JP
Japan
Prior art keywords
soln
electroless copper
complexing agents
copper plating
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8291380A
Other languages
Japanese (ja)
Other versions
JPS6259180B2 (en
Inventor
Osamu Miyazawa
Hitoshi Oka
Ataru Yokono
Tokio Isogai
Isamu Tanaka
Akira Matsuo
Yoshio Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8291380A priority Critical patent/JPS579865A/en
Publication of JPS579865A publication Critical patent/JPS579865A/en
Publication of JPS6259180B2 publication Critical patent/JPS6259180B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)

Abstract

PURPOSE: To improve the stability of an electroless copper plating soln. while enhancing the deposition speed and the characteristics of a film by specifying the stabilizing agent and the complexing agent in the composition of the plating soln.
CONSTITUTION: This electroless copper plating soln. is prepared by blending water with water-soluble copper salt, a reducing agent, a pH regulator, 1 kinds of nonionic polyoxyalkyleneamine surfactants represented by formula I or II as a stabilizer and ≥1 kinds of cupric ion complexing agents having amine, carboxylic acid and OH groups and represented by formula III or IV. By the complexing agents in the composition of the soln. the copper ion releasability of the chelate is improved, the plating speed is increased, and the mechanical properties of a film are enhanced. In addition, by the specified surfactants used in combination with the complexing agents the stability of the plating soln. is increased remarkably.
COPYRIGHT: (C)1982,JPO&Japio
JP8291380A 1980-06-20 1980-06-20 Electroless copper plating solution Granted JPS579865A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8291380A JPS579865A (en) 1980-06-20 1980-06-20 Electroless copper plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8291380A JPS579865A (en) 1980-06-20 1980-06-20 Electroless copper plating solution

Publications (2)

Publication Number Publication Date
JPS579865A true JPS579865A (en) 1982-01-19
JPS6259180B2 JPS6259180B2 (en) 1987-12-09

Family

ID=13787485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8291380A Granted JPS579865A (en) 1980-06-20 1980-06-20 Electroless copper plating solution

Country Status (1)

Country Link
JP (1) JPS579865A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59116366A (en) * 1982-12-24 1984-07-05 Hitachi Ltd Chemical copper plating solution
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
US5059243A (en) * 1989-04-28 1991-10-22 International Business Machines Corporation Tetra aza ligand systems as complexing agents for electroless deposition of copper

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59116366A (en) * 1982-12-24 1984-07-05 Hitachi Ltd Chemical copper plating solution
JPS6337187B2 (en) * 1982-12-24 1988-07-25 Hitachi Ltd
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
US5059243A (en) * 1989-04-28 1991-10-22 International Business Machines Corporation Tetra aza ligand systems as complexing agents for electroless deposition of copper

Also Published As

Publication number Publication date
JPS6259180B2 (en) 1987-12-09

Similar Documents

Publication Publication Date Title
EP0039757B1 (en) Chemical copper-plating bath
ES8501823A1 (en) Method for washing of textiles in hard water and phosphate-free detergent compositions for use therein.
JPS54121127A (en) Photographic processing composition
JPS579865A (en) Electroless copper plating solution
GB1286941A (en) Chemical reduction copper plating
GB1414896A (en) Electroless copper plating
JPS5672196A (en) Bright plating bath for copper-tin alloy
FI884659A0 (en) VAETSKEDISPERSIONSBLANDNING OCH FOERFARANDE FOER POLERING AV JAERNKOMPONENTER.
JPS579867A (en) Electroless copper plating solution
JPS56271A (en) Non-electrolytic copper plating solution
JPS56108892A (en) Plating solution with pure gold
US2794818A (en) Germicidally active phenolic copper chelate compounds
IE800313L (en) Detergent composition containing soluble citric acid salts.
JPS579866A (en) Electroless copper plating solution
BR8206611A (en) FUNGICIDE COMPOSITION
JPS5419430A (en) Chemical copper plating solution
JPS60218480A (en) Chemical copper plating solution
JPS56136970A (en) Chemical copper plating bath
JPS57174445A (en) Chemical copper plating solution
JPS56142873A (en) Anticorrosive agent for metal
JPS56272A (en) Non-electrolytic copper plating solution
JPS57116768A (en) Chemical copper plating solution
JPS5658960A (en) Chemical copper-plating solution
JPS57114657A (en) Chemical copper plating method
JPS5658961A (en) Chemical copper-plating solution