JPS57174445A - Chemical copper plating solution - Google Patents

Chemical copper plating solution

Info

Publication number
JPS57174445A
JPS57174445A JP5921281A JP5921281A JPS57174445A JP S57174445 A JPS57174445 A JP S57174445A JP 5921281 A JP5921281 A JP 5921281A JP 5921281 A JP5921281 A JP 5921281A JP S57174445 A JPS57174445 A JP S57174445A
Authority
JP
Japan
Prior art keywords
plating soln
represented
copper plating
chemical copper
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5921281A
Other languages
Japanese (ja)
Inventor
Osamu Sasaki
Kazuhiro Takeda
Kunihiro Isori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5921281A priority Critical patent/JPS57174445A/en
Publication of JPS57174445A publication Critical patent/JPS57174445A/en
Pending legal-status Critical Current

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  • Chemically Coating (AREA)

Abstract

PURPOSE: To obtain a copper plated film with superior mechanical properties, especially superior ductility and tensile strength by adding a nonionic surfactant represented by a specified formula and a thiourea deriv. represented by a specified formula to a chemical copper plating soln. contg. copper salt, a complexing agent, a reducing agent and a pH regulator.
CONSTITUTION: A chemical copper plating soln. is prepared by blending copper salt with a complexing agent, a reducing agent and a pH regulator. To the plating soln. is added 3mgW30g/l nonionic surfactant represented by formulaI (where R1 and R2 may be identical with or different from each other, each of them is methyl, ethyl or propyl, each of m and n is an integer of ≥1, and m+n ≥8). To the plating soln. is further added 0.01W5mg/l thiourea deriv. represented by formula II (where R1, R2, R3 and R4 may be identical with or different from each other, each of them is H, lower alkyl or aryl, and R1 and R3 may bond together to form an ethylene group).
COPYRIGHT: (C)1982,JPO&Japio
JP5921281A 1981-04-21 1981-04-21 Chemical copper plating solution Pending JPS57174445A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5921281A JPS57174445A (en) 1981-04-21 1981-04-21 Chemical copper plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5921281A JPS57174445A (en) 1981-04-21 1981-04-21 Chemical copper plating solution

Publications (1)

Publication Number Publication Date
JPS57174445A true JPS57174445A (en) 1982-10-27

Family

ID=13106858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5921281A Pending JPS57174445A (en) 1981-04-21 1981-04-21 Chemical copper plating solution

Country Status (1)

Country Link
JP (1) JPS57174445A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009138258A (en) * 2007-09-04 2009-06-25 Mitsubishi Paper Mills Ltd Additive for electroless copper plating liquid, and electroless copper plating liquid using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009138258A (en) * 2007-09-04 2009-06-25 Mitsubishi Paper Mills Ltd Additive for electroless copper plating liquid, and electroless copper plating liquid using the same

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