JPS5760071A - Chemical copper plating solution - Google Patents

Chemical copper plating solution

Info

Publication number
JPS5760071A
JPS5760071A JP13528980A JP13528980A JPS5760071A JP S5760071 A JPS5760071 A JP S5760071A JP 13528980 A JP13528980 A JP 13528980A JP 13528980 A JP13528980 A JP 13528980A JP S5760071 A JPS5760071 A JP S5760071A
Authority
JP
Japan
Prior art keywords
represented
soln
plating solution
copper plating
malleability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13528980A
Other languages
Japanese (ja)
Other versions
JPS5749627B2 (en
Inventor
Osamu Sasaki
Kunihiro Isori
Kazuhiro Takeda
Toshiki Sasabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13528980A priority Critical patent/JPS5760071A/en
Publication of JPS5760071A publication Critical patent/JPS5760071A/en
Publication of JPS5749627B2 publication Critical patent/JPS5749627B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)

Abstract

PURPOSE: To enhance the malleability and tensile strength of the resulting plated film by adding a surfactant and a thiourea deriv. represented by specified formulae to a plating soln.
CONSTITUTION: The titled plating soln. is prepared by adding a nonionic surfactant represented by formulaI(where each of m and n is an integer of ≥1, and m+n≥ 12) and a thiourea deriv. represented by formula II (where each of R1, R2, R3 and R4 is H, lower alkyl, lower alkenyl or aryl, and R1 and R3 may bond to each other to form an ethylene group) to a soln. contg. a copper salt, a complexing agent, a reducing agent and a pH regulator. a plated film formed with this plating soln. has superior mechanical characteristics, especially superior malleability and tensile strength.
COPYRIGHT: (C)1982,JPO&Japio
JP13528980A 1980-09-30 1980-09-30 Chemical copper plating solution Granted JPS5760071A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13528980A JPS5760071A (en) 1980-09-30 1980-09-30 Chemical copper plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13528980A JPS5760071A (en) 1980-09-30 1980-09-30 Chemical copper plating solution

Publications (2)

Publication Number Publication Date
JPS5760071A true JPS5760071A (en) 1982-04-10
JPS5749627B2 JPS5749627B2 (en) 1982-10-22

Family

ID=15148213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13528980A Granted JPS5760071A (en) 1980-09-30 1980-09-30 Chemical copper plating solution

Country Status (1)

Country Link
JP (1) JPS5760071A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01503691A (en) * 1987-07-09 1989-12-14 インターテクノ・アクチエンゲゼルシヤフト How to repair the inside of an installed conduit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01503691A (en) * 1987-07-09 1989-12-14 インターテクノ・アクチエンゲゼルシヤフト How to repair the inside of an installed conduit

Also Published As

Publication number Publication date
JPS5749627B2 (en) 1982-10-22

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