JPS5760071A - Chemical copper plating solution - Google Patents
Chemical copper plating solutionInfo
- Publication number
- JPS5760071A JPS5760071A JP13528980A JP13528980A JPS5760071A JP S5760071 A JPS5760071 A JP S5760071A JP 13528980 A JP13528980 A JP 13528980A JP 13528980 A JP13528980 A JP 13528980A JP S5760071 A JPS5760071 A JP S5760071A
- Authority
- JP
- Japan
- Prior art keywords
- represented
- soln
- plating solution
- copper plating
- malleability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To enhance the malleability and tensile strength of the resulting plated film by adding a surfactant and a thiourea deriv. represented by specified formulae to a plating soln.
CONSTITUTION: The titled plating soln. is prepared by adding a nonionic surfactant represented by formulaI(where each of m and n is an integer of ≥1, and m+n≥ 12) and a thiourea deriv. represented by formula II (where each of R1, R2, R3 and R4 is H, lower alkyl, lower alkenyl or aryl, and R1 and R3 may bond to each other to form an ethylene group) to a soln. contg. a copper salt, a complexing agent, a reducing agent and a pH regulator. a plated film formed with this plating soln. has superior mechanical characteristics, especially superior malleability and tensile strength.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13528980A JPS5760071A (en) | 1980-09-30 | 1980-09-30 | Chemical copper plating solution |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13528980A JPS5760071A (en) | 1980-09-30 | 1980-09-30 | Chemical copper plating solution |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5760071A true JPS5760071A (en) | 1982-04-10 |
JPS5749627B2 JPS5749627B2 (en) | 1982-10-22 |
Family
ID=15148213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13528980A Granted JPS5760071A (en) | 1980-09-30 | 1980-09-30 | Chemical copper plating solution |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5760071A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01503691A (en) * | 1987-07-09 | 1989-12-14 | インターテクノ・アクチエンゲゼルシヤフト | How to repair the inside of an installed conduit |
-
1980
- 1980-09-30 JP JP13528980A patent/JPS5760071A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01503691A (en) * | 1987-07-09 | 1989-12-14 | インターテクノ・アクチエンゲゼルシヤフト | How to repair the inside of an installed conduit |
Also Published As
Publication number | Publication date |
---|---|
JPS5749627B2 (en) | 1982-10-22 |
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