JPS56108869A - Nickel coat forming method - Google Patents
Nickel coat forming methodInfo
- Publication number
- JPS56108869A JPS56108869A JP927780A JP927780A JPS56108869A JP S56108869 A JPS56108869 A JP S56108869A JP 927780 A JP927780 A JP 927780A JP 927780 A JP927780 A JP 927780A JP S56108869 A JPS56108869 A JP S56108869A
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- nickel salt
- coat
- salt
- diethylenetriamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To form a homogeneous dense nickel coat of high performance on a substrate by electroless nickel plating by reducing nickel salt in the presence of diethylenetriamine.
CONSTITUTION: When a nickel coat is formed on a substrate of glass, plastics, ceramics or the like by electroless plating, one or more among diethylenetriamine, ethylenediamine and imidazole are added to a nickel salt soln., a reducing agent soln. or a nickel plating bath contg. both the nickel salt and the reducing agent by 1W1,000ppm to the amount of the nickel salt. The compounds may be added when the nickel salt is reduced. Thus, nickel particles deposited by reduction are kept fine to form a dense uniform nickel coat free from pinholes, etc.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP927780A JPS56108869A (en) | 1980-01-31 | 1980-01-31 | Nickel coat forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP927780A JPS56108869A (en) | 1980-01-31 | 1980-01-31 | Nickel coat forming method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56108869A true JPS56108869A (en) | 1981-08-28 |
Family
ID=11715965
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP927780A Pending JPS56108869A (en) | 1980-01-31 | 1980-01-31 | Nickel coat forming method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56108869A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58199887A (en) * | 1982-05-14 | 1983-11-21 | Hitachi Chem Co Ltd | Plating bath |
JPS5943857A (en) * | 1982-07-30 | 1984-03-12 | オフイス・ナシヨナル・デチユ−ド・エ・ド・ルシエルシユ・アエロスパシアル | Nickel and/or cobalt chemical plating bath using bron or phosphorus base reducing agent |
WO1994012686A1 (en) * | 1992-11-25 | 1994-06-09 | Kanto Kagaku Kabushiki Kaisha | Electroless gold plating bath |
-
1980
- 1980-01-31 JP JP927780A patent/JPS56108869A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58199887A (en) * | 1982-05-14 | 1983-11-21 | Hitachi Chem Co Ltd | Plating bath |
JPS5943857A (en) * | 1982-07-30 | 1984-03-12 | オフイス・ナシヨナル・デチユ−ド・エ・ド・ルシエルシユ・アエロスパシアル | Nickel and/or cobalt chemical plating bath using bron or phosphorus base reducing agent |
WO1994012686A1 (en) * | 1992-11-25 | 1994-06-09 | Kanto Kagaku Kabushiki Kaisha | Electroless gold plating bath |
US5470381A (en) * | 1992-11-25 | 1995-11-28 | Kanto Kagaku Kabushiki Kaisha | Electroless gold plating solution |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
PT74959A (en) | Process for the preparation of electroless plating bath for depositing gold on various substrates | |
ES8701853A1 (en) | Formaldehyde-free autocatalytic electroless copper plating | |
DE3275105D1 (en) | Method of activating substrate surfaces for electroless metal plating | |
GB2164063B (en) | Selective electroless deposition on insulating substrates | |
JPS5743995A (en) | Silver plating liquid and silver plating method | |
JPS56108869A (en) | Nickel coat forming method | |
GB2070647B (en) | Selective chemical deposition and/or electrodeposition of metal coatings especially for the production of printed circuits | |
JPS5440236A (en) | Plating process | |
JPS53134759A (en) | Production of copmosite metal powder | |
JPS56152958A (en) | Electroless gold plating solution | |
DE3466783D1 (en) | Process for activating the adhesion properties of polyamide substrates for electroless metallization | |
JPS56108876A (en) | Silver plated exterior decorative parts for watch and their manufacture | |
JPS57140891A (en) | Pretreating solution for silver plating | |
JPS56136970A (en) | Chemical copper plating bath | |
EP0264455A4 (en) | Plated steel excellent in coatability | |
JPS56136966A (en) | Electroless plating method | |
JPS575857A (en) | Electroless indium-plating solution | |
JPS57120663A (en) | Electroless plating method | |
JPS56123363A (en) | Pretreating liquid for chemical plating | |
Kikuchi et al. | Electroless Copper Plating Solution | |
Smith | NiBRON Nickel--Boron Wear Resistant Coatings | |
Napukh et al. | Protective Properties of Silver Coatings From an Alkaline Cyanide Bath | |
JPS57120693A (en) | Plating method of gold alloy | |
JPS56156750A (en) | Chemical copper plating solution | |
JPS6483688A (en) | Solution for retaining surface activity of electroless copper plating layer |