JPS56105468A - Chemical copper plating solution - Google Patents

Chemical copper plating solution

Info

Publication number
JPS56105468A
JPS56105468A JP574680A JP574680A JPS56105468A JP S56105468 A JPS56105468 A JP S56105468A JP 574680 A JP574680 A JP 574680A JP 574680 A JP574680 A JP 574680A JP S56105468 A JPS56105468 A JP S56105468A
Authority
JP
Japan
Prior art keywords
copper plating
chemical copper
plating solution
dipyridyl
polyethylene glycol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP574680A
Other languages
Japanese (ja)
Inventor
Hitoshi Oka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP574680A priority Critical patent/JPS56105468A/en
Publication of JPS56105468A publication Critical patent/JPS56105468A/en
Pending legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)

Abstract

PURPOSE: To provide a chemical copper plating solution capable of improving bath stability, plating speed, and mechanical properties of plated film by having the composition to include a specific amount of polyethylene glycol stearyl amine, 2,2'- dipyridyl, and Ag2S.
CONSTITUTION: A chemical copper plating solution consists of: CuSO4.5H2O: 5W 18g/l, EDTA.2Na: 15W54g/l, formalin: 1W10ml/l polyethylene glycol stearyl amine: 5W500ml/l, 2,2'-dipyridyl: 1W30mg/l, and Ag2S: 2.5×10-15W5g/l, with pH adjusted to 11.9W12.8 by using NaOH, etc. In this composition, the added Ag2S enters, as colloidal particles, the intergrains of crystal of the plated film and decreases the internal stress of the film and increases the toughness of the film. Polyethylene glycol stearyl amine and 2,2'-dipyridyl contribute to enhance plating speed and stabilize the solution.
COPYRIGHT: (C)1981,JPO&Japio
JP574680A 1980-01-23 1980-01-23 Chemical copper plating solution Pending JPS56105468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP574680A JPS56105468A (en) 1980-01-23 1980-01-23 Chemical copper plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP574680A JPS56105468A (en) 1980-01-23 1980-01-23 Chemical copper plating solution

Publications (1)

Publication Number Publication Date
JPS56105468A true JPS56105468A (en) 1981-08-21

Family

ID=11619662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP574680A Pending JPS56105468A (en) 1980-01-23 1980-01-23 Chemical copper plating solution

Country Status (1)

Country Link
JP (1) JPS56105468A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6831009B2 (en) 2000-10-03 2004-12-14 Hitachi, Ltd. Wiring substrate and an electroless copper plating solution for providing interlayer connections

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6831009B2 (en) 2000-10-03 2004-12-14 Hitachi, Ltd. Wiring substrate and an electroless copper plating solution for providing interlayer connections
US6989329B2 (en) 2000-10-03 2006-01-24 Hitachi, Ltd. Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections

Similar Documents

Publication Publication Date Title
JPS5754296A (en) Plating liquid for palladium nickel alloy
JPS5743995A (en) Silver plating liquid and silver plating method
JPS569386A (en) Production of electro-zinc plated steel plate
JPS56152958A (en) Electroless gold plating solution
JPS56105468A (en) Chemical copper plating solution
LV10317A (en) Liquid dispersive composition and method for preparing iron-containing metal products for surface treatment
JPS57140891A (en) Pretreating solution for silver plating
KR840004185A (en) Chelation of metals
JPS5770286A (en) Plating bath composition and plating method
JPS5419430A (en) Chemical copper plating solution
JPS575856A (en) Plating method
JPS5794599A (en) Silver plated film and electroplating method
JPS56136970A (en) Chemical copper plating bath
JPS56108869A (en) Nickel coat forming method
JPS5554589A (en) Plating method of electronic parts which prevent production of zinc whisker
JPS56136966A (en) Electroless plating method
JPS57120664A (en) Formation of nickel film
JPS572890A (en) Gold alloy plating bath
JPS579865A (en) Electroless copper plating solution
JPS5415433A (en) Method of producing tin electro-plate
JPS565997A (en) Manufacture of hard gold alloy coating
JPS579867A (en) Electroless copper plating solution
JPS53144837A (en) Electroless copper plating bath
JPS57198292A (en) Production of iron-zinc alloy plated steel plate
JPS5760091A (en) Copper-tin alloy plating bath