JPS53144837A - Electroless copper plating bath - Google Patents

Electroless copper plating bath

Info

Publication number
JPS53144837A
JPS53144837A JP6071077A JP6071077A JPS53144837A JP S53144837 A JPS53144837 A JP S53144837A JP 6071077 A JP6071077 A JP 6071077A JP 6071077 A JP6071077 A JP 6071077A JP S53144837 A JPS53144837 A JP S53144837A
Authority
JP
Japan
Prior art keywords
plating bath
copper plating
electroless copper
cpds
salts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6071077A
Other languages
Japanese (ja)
Other versions
JPS6027750B2 (en
Inventor
Osamu Sasaki
Akira Endou
Jiro Kano
Tomomichi Tsukada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6071077A priority Critical patent/JPS6027750B2/en
Publication of JPS53144837A publication Critical patent/JPS53144837A/en
Publication of JPS6027750B2 publication Critical patent/JPS6027750B2/en
Expired legal-status Critical Current

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  • Chemically Coating (AREA)

Abstract

PURPOSE: To provide an electroless copper plating bath obtd. by adding Mg and Ni salts and sulfur cpds. to a compsn. based an cupric salts, complex cpds., a reducing agent and a pH regulator, by which plated films of superior ductility can be formed.
COPYRIGHT: (C)1978,JPO&Japio
JP6071077A 1977-05-25 1977-05-25 Electroless copper plating liquid Expired JPS6027750B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6071077A JPS6027750B2 (en) 1977-05-25 1977-05-25 Electroless copper plating liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6071077A JPS6027750B2 (en) 1977-05-25 1977-05-25 Electroless copper plating liquid

Publications (2)

Publication Number Publication Date
JPS53144837A true JPS53144837A (en) 1978-12-16
JPS6027750B2 JPS6027750B2 (en) 1985-07-01

Family

ID=13150106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6071077A Expired JPS6027750B2 (en) 1977-05-25 1977-05-25 Electroless copper plating liquid

Country Status (1)

Country Link
JP (1) JPS6027750B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5923862A (en) * 1982-07-29 1984-02-07 Nec Corp Electroless copper plating solution and its manufacture
KR100483111B1 (en) * 2001-04-24 2005-04-14 가부시키가이샤 무라타 세이사쿠쇼 Electroless copper plating solution and high-frequency electronic component
US20120177925A1 (en) * 2011-01-11 2012-07-12 Omg Electronic Chemicals, Llc Electroless plating bath composition and method of plating particulate matter

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5923862A (en) * 1982-07-29 1984-02-07 Nec Corp Electroless copper plating solution and its manufacture
KR100483111B1 (en) * 2001-04-24 2005-04-14 가부시키가이샤 무라타 세이사쿠쇼 Electroless copper plating solution and high-frequency electronic component
US20120177925A1 (en) * 2011-01-11 2012-07-12 Omg Electronic Chemicals, Llc Electroless plating bath composition and method of plating particulate matter
US8858693B2 (en) * 2011-01-11 2014-10-14 Omg Electronic Chemicals, Llc Electroless plating bath composition and method of plating particulate matter

Also Published As

Publication number Publication date
JPS6027750B2 (en) 1985-07-01

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