JPS53144835A - Electroless copper plating bath - Google Patents
Electroless copper plating bathInfo
- Publication number
- JPS53144835A JPS53144835A JP6070877A JP6070877A JPS53144835A JP S53144835 A JPS53144835 A JP S53144835A JP 6070877 A JP6070877 A JP 6070877A JP 6070877 A JP6070877 A JP 6070877A JP S53144835 A JPS53144835 A JP S53144835A
- Authority
- JP
- Japan
- Prior art keywords
- plating bath
- copper plating
- electroless copper
- cpds
- salts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE: To provide an electroless copper plating bath obtd. by adding Mg and Ni salts and cyan cpds. to a compsn. based on cupric salts, complex cpds., a reducing agent and a pH reulator, by which plated films of superior ductility can be formed.
COPYRIGHT: (C)1978,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6070877A JPS53144835A (en) | 1977-05-25 | 1977-05-25 | Electroless copper plating bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6070877A JPS53144835A (en) | 1977-05-25 | 1977-05-25 | Electroless copper plating bath |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53144835A true JPS53144835A (en) | 1978-12-16 |
JPS5652994B2 JPS5652994B2 (en) | 1981-12-16 |
Family
ID=13150048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6070877A Granted JPS53144835A (en) | 1977-05-25 | 1977-05-25 | Electroless copper plating bath |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53144835A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120177925A1 (en) * | 2011-01-11 | 2012-07-12 | Omg Electronic Chemicals, Llc | Electroless plating bath composition and method of plating particulate matter |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49128A (en) * | 1972-04-21 | 1974-01-05 |
-
1977
- 1977-05-25 JP JP6070877A patent/JPS53144835A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49128A (en) * | 1972-04-21 | 1974-01-05 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120177925A1 (en) * | 2011-01-11 | 2012-07-12 | Omg Electronic Chemicals, Llc | Electroless plating bath composition and method of plating particulate matter |
US8858693B2 (en) * | 2011-01-11 | 2014-10-14 | Omg Electronic Chemicals, Llc | Electroless plating bath composition and method of plating particulate matter |
Also Published As
Publication number | Publication date |
---|---|
JPS5652994B2 (en) | 1981-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS53106348A (en) | Electrolytic bath for chromium plating | |
JPS53144837A (en) | Electroless copper plating bath | |
JPS53144835A (en) | Electroless copper plating bath | |
JPS53144836A (en) | Electroless copper plating bath | |
JPS56152958A (en) | Electroless gold plating solution | |
JPS5672196A (en) | Bright plating bath for copper-tin alloy | |
JPS57140891A (en) | Pretreating solution for silver plating | |
JPS5481777A (en) | Lead frame structure with intermediate layer | |
JPS56271A (en) | Non-electrolytic copper plating solution | |
JPS53124130A (en) | Manufacture of amorphous alloy | |
JPS5741389A (en) | Cathode for electrolyzing aqueous alkali metal halide and its manufacture | |
JPS5770286A (en) | Plating bath composition and plating method | |
JPS57140882A (en) | Bright electroplating method for tin or solder | |
JPS57120664A (en) | Formation of nickel film | |
JPS5397937A (en) | Silver plating method | |
JPS5326223A (en) | Work hardening copper alloy | |
JPS5453629A (en) | Resistance chemical plating method | |
JPS575856A (en) | Plating method | |
JPS54110139A (en) | Electroless nickel plating solution | |
JPS5428236A (en) | Hard gold alloy plating method | |
GB1338497A (en) | Photochemical method for forming a metal image | |
JPS5415433A (en) | Method of producing tin electro-plate | |
JPS5466340A (en) | Non-cyanogen type gold alloy plating bath | |
JPS56136970A (en) | Chemical copper plating bath | |
JPS53126267A (en) | Production of carrier tape |