JPS53144836A - Electroless copper plating bath - Google Patents

Electroless copper plating bath

Info

Publication number
JPS53144836A
JPS53144836A JP6070977A JP6070977A JPS53144836A JP S53144836 A JPS53144836 A JP S53144836A JP 6070977 A JP6070977 A JP 6070977A JP 6070977 A JP6070977 A JP 6070977A JP S53144836 A JPS53144836 A JP S53144836A
Authority
JP
Japan
Prior art keywords
plating bath
copper plating
electroless copper
salts
compsn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6070977A
Other languages
Japanese (ja)
Other versions
JPS5652995B2 (en
Inventor
Osamu Sasaki
Akira Endou
Jiro Kano
Tomomichi Tsukada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6070977A priority Critical patent/JPS53144836A/en
Publication of JPS53144836A publication Critical patent/JPS53144836A/en
Publication of JPS5652995B2 publication Critical patent/JPS5652995B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To provide an electroless copper plating bath obtd. by adding Mg and Ni salts and pyridine derivatives to a compsn. based on cupric salts, complex cpds., a reducing agent and a pH regulator, by which plated films of superior ductility can be formed.
COPYRIGHT: (C)1978,JPO&Japio
JP6070977A 1977-05-25 1977-05-25 Electroless copper plating bath Granted JPS53144836A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6070977A JPS53144836A (en) 1977-05-25 1977-05-25 Electroless copper plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6070977A JPS53144836A (en) 1977-05-25 1977-05-25 Electroless copper plating bath

Publications (2)

Publication Number Publication Date
JPS53144836A true JPS53144836A (en) 1978-12-16
JPS5652995B2 JPS5652995B2 (en) 1981-12-16

Family

ID=13150076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6070977A Granted JPS53144836A (en) 1977-05-25 1977-05-25 Electroless copper plating bath

Country Status (1)

Country Link
JP (1) JPS53144836A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011231382A (en) * 2010-04-28 2011-11-17 Nagoya Plating Co Ltd Plating liquid for polymer fiber, method for plating polymer fiber using the same, and method for producing the same
US20120177925A1 (en) * 2011-01-11 2012-07-12 Omg Electronic Chemicals, Llc Electroless plating bath composition and method of plating particulate matter

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49128A (en) * 1972-04-21 1974-01-05
JPS5217335A (en) * 1975-08-01 1977-02-09 Hitachi Ltd Chemical copper plating solution

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49128A (en) * 1972-04-21 1974-01-05
JPS5217335A (en) * 1975-08-01 1977-02-09 Hitachi Ltd Chemical copper plating solution

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011231382A (en) * 2010-04-28 2011-11-17 Nagoya Plating Co Ltd Plating liquid for polymer fiber, method for plating polymer fiber using the same, and method for producing the same
US20120177925A1 (en) * 2011-01-11 2012-07-12 Omg Electronic Chemicals, Llc Electroless plating bath composition and method of plating particulate matter
US8858693B2 (en) * 2011-01-11 2014-10-14 Omg Electronic Chemicals, Llc Electroless plating bath composition and method of plating particulate matter

Also Published As

Publication number Publication date
JPS5652995B2 (en) 1981-12-16

Similar Documents

Publication Publication Date Title
GB1492506A (en) Immersion plating of tin-lead alloys
JPS53106348A (en) Electrolytic bath for chromium plating
JPS53144836A (en) Electroless copper plating bath
JPS53144837A (en) Electroless copper plating bath
JPS53144835A (en) Electroless copper plating bath
JPS56152958A (en) Electroless gold plating solution
JPS57140891A (en) Pretreating solution for silver plating
JPS56271A (en) Non-electrolytic copper plating solution
AU501210B2 (en) Electroless copper plating bath
JPS53124130A (en) Manufacture of amorphous alloy
JPS5481777A (en) Lead frame structure with intermediate layer
JPS5419430A (en) Chemical copper plating solution
GB1432871A (en) Silvering solutions
GB1040410A (en) Improvements in electrolytes for electroplating
JPS5770286A (en) Plating bath composition and plating method
SE7605289L (en) NICKEL IRON COATING
JPS57120664A (en) Formation of nickel film
JPS5326223A (en) Work hardening copper alloy
JPS5453629A (en) Resistance chemical plating method
JPS57140882A (en) Bright electroplating method for tin or solder
JPS575856A (en) Plating method
JPS54110140A (en) Plating method
GB1338497A (en) Photochemical method for forming a metal image
JPS5428236A (en) Hard gold alloy plating method
JPS5466340A (en) Non-cyanogen type gold alloy plating bath