JPS54110140A - Plating method - Google Patents

Plating method

Info

Publication number
JPS54110140A
JPS54110140A JP1742578A JP1742578A JPS54110140A JP S54110140 A JPS54110140 A JP S54110140A JP 1742578 A JP1742578 A JP 1742578A JP 1742578 A JP1742578 A JP 1742578A JP S54110140 A JPS54110140 A JP S54110140A
Authority
JP
Japan
Prior art keywords
plating
alloy
layer
plated
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1742578A
Other languages
Japanese (ja)
Other versions
JPS5937756B2 (en
Inventor
Yoshinori Takakura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1742578A priority Critical patent/JPS5937756B2/en
Publication of JPS54110140A publication Critical patent/JPS54110140A/en
Publication of JPS5937756B2 publication Critical patent/JPS5937756B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE:To avoid insufficient adherence of plated films at the time of soldering by carrying out electroless Ni plating on Cu(alloy), Ni (alloy), or Cu or Ni plating to above a specific thickness, followed by bright Sn or solder plating on the Ni layer to a predetermined thickness. CONSTITUTION:Cu or Ni plated film 2 is formed on substrate 1, and electroless Ni plating 3 is carried out to above 5mu. In case substrate 1 is made of Cu (alloy)or Ni (alloy), formation of film 2 is unnecessary. Next, bright Sn or solder plated layer 4 is formed on Ni plated layer 3. By this method formation of intermetallic cpds. of Cu or Ni plated layer 2 and solder, e.g. Cu6Sn5, Cu3Sn and Ni3Sn4 can be prevented with Ni layer 3 in the soldering temp. range of 180-250 deg.C. In addn., a product is manufactured which withstands the impact after soldering.
JP1742578A 1978-02-17 1978-02-17 Plating method Expired JPS5937756B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1742578A JPS5937756B2 (en) 1978-02-17 1978-02-17 Plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1742578A JPS5937756B2 (en) 1978-02-17 1978-02-17 Plating method

Publications (2)

Publication Number Publication Date
JPS54110140A true JPS54110140A (en) 1979-08-29
JPS5937756B2 JPS5937756B2 (en) 1984-09-11

Family

ID=11943650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1742578A Expired JPS5937756B2 (en) 1978-02-17 1978-02-17 Plating method

Country Status (1)

Country Link
JP (1) JPS5937756B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004292944A (en) * 2003-03-26 2004-10-21 Takahide Ono Metallic material for electronic component prevented from generation of whisker
JP2007070731A (en) * 2005-09-07 2007-03-22 Rohm & Haas Electronic Materials Llc Metal duplex and method
US8013428B2 (en) * 2004-09-28 2011-09-06 Lsi Corporation Whisker-free lead frames

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004292944A (en) * 2003-03-26 2004-10-21 Takahide Ono Metallic material for electronic component prevented from generation of whisker
US8013428B2 (en) * 2004-09-28 2011-09-06 Lsi Corporation Whisker-free lead frames
JP2007070731A (en) * 2005-09-07 2007-03-22 Rohm & Haas Electronic Materials Llc Metal duplex and method

Also Published As

Publication number Publication date
JPS5937756B2 (en) 1984-09-11

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