JPS5266374A - Galvanization of non electrolytic nickel for semiconductor substrate - Google Patents

Galvanization of non electrolytic nickel for semiconductor substrate

Info

Publication number
JPS5266374A
JPS5266374A JP14311275A JP14311275A JPS5266374A JP S5266374 A JPS5266374 A JP S5266374A JP 14311275 A JP14311275 A JP 14311275A JP 14311275 A JP14311275 A JP 14311275A JP S5266374 A JPS5266374 A JP S5266374A
Authority
JP
Japan
Prior art keywords
semiconductor substrate
galvanization
electrolytic nickel
non electrolytic
galvanizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14311275A
Other languages
Japanese (ja)
Inventor
Osamu Ishihara
Sho Hyodo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP14311275A priority Critical patent/JPS5266374A/en
Publication of JPS5266374A publication Critical patent/JPS5266374A/en
Pending legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To establish a galvanizing method of Ni on semiconductor substrate by which the galvanized Ni layer can not be exfoliated, by galvanizing non-electrolytic Ni on substrates which have both P and N types domains after they are immersed in an acrivated solution and covered with gold film.
COPYRIGHT: (C)1977,JPO&Japio
JP14311275A 1975-11-28 1975-11-28 Galvanization of non electrolytic nickel for semiconductor substrate Pending JPS5266374A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14311275A JPS5266374A (en) 1975-11-28 1975-11-28 Galvanization of non electrolytic nickel for semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14311275A JPS5266374A (en) 1975-11-28 1975-11-28 Galvanization of non electrolytic nickel for semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS5266374A true JPS5266374A (en) 1977-06-01

Family

ID=15331178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14311275A Pending JPS5266374A (en) 1975-11-28 1975-11-28 Galvanization of non electrolytic nickel for semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5266374A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0457323A (en) * 1990-06-27 1992-02-25 Hitachi Ltd Manufacture of semiconductor device
US5236873A (en) * 1991-05-17 1993-08-17 SGA-Thomson Microelectronics, S.A. Method for contacting a semiconductor component
KR20150125684A (en) * 2013-02-22 2015-11-09 알쉬메 Method for forming a metal silicide using a solution containing gold ions and fluorine ions

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0457323A (en) * 1990-06-27 1992-02-25 Hitachi Ltd Manufacture of semiconductor device
US5236873A (en) * 1991-05-17 1993-08-17 SGA-Thomson Microelectronics, S.A. Method for contacting a semiconductor component
KR20150125684A (en) * 2013-02-22 2015-11-09 알쉬메 Method for forming a metal silicide using a solution containing gold ions and fluorine ions
JP2016510090A (en) * 2013-02-22 2016-04-04 アルスィメール Method for forming metal silicide using solution containing gold ion and fluorine ion

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