JPS5620192A - Plating method for thick film paste - Google Patents

Plating method for thick film paste

Info

Publication number
JPS5620192A
JPS5620192A JP9470879A JP9470879A JPS5620192A JP S5620192 A JPS5620192 A JP S5620192A JP 9470879 A JP9470879 A JP 9470879A JP 9470879 A JP9470879 A JP 9470879A JP S5620192 A JPS5620192 A JP S5620192A
Authority
JP
Japan
Prior art keywords
film
gold
pasted
substrate
adhesive force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9470879A
Other languages
Japanese (ja)
Other versions
JPS5938314B2 (en
Inventor
Tamio Saito
Kiyomi Tagaya
Yoshikatsu Fukumoto
Masami Uehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP9470879A priority Critical patent/JPS5938314B2/en
Publication of JPS5620192A publication Critical patent/JPS5620192A/en
Publication of JPS5938314B2 publication Critical patent/JPS5938314B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To obtain plated film having a good workability and not diffusing in solder, by applying a fixed plating on a fixed gold pasted pattern which is provided on the insulation substrate through the gold pasted film losing the adhesive force by plating solution.
CONSTITUTION: The thick film gold pasted patterns 2... which do not lose the adhesive force even imprognated in plating solution, are formed on the alumina the alumina ceramic substrate 1. Next, the gold pasted film 3 which loses the adhesive force by the plating solution, is formed on the pattern 2 and substrate 1 and are connected in common. Then, the substrate 1 is immersed in copper sulfate plating solution and is electroplated and then, the copper film 4 difficult to diffuse for solder, is deposited on the film 3. Next, the gold pasted film part lost the adhesive force which is directly connected with the substrate 1, is removed and plural individual patterns 5... covered by copper, are obtained. Further, nickel can be used for difficult diffusible metal for the solder.
COPYRIGHT: (C)1981,JPO&Japio
JP9470879A 1979-07-25 1979-07-25 Method of plating thick film paste Expired JPS5938314B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9470879A JPS5938314B2 (en) 1979-07-25 1979-07-25 Method of plating thick film paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9470879A JPS5938314B2 (en) 1979-07-25 1979-07-25 Method of plating thick film paste

Publications (2)

Publication Number Publication Date
JPS5620192A true JPS5620192A (en) 1981-02-25
JPS5938314B2 JPS5938314B2 (en) 1984-09-14

Family

ID=14117652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9470879A Expired JPS5938314B2 (en) 1979-07-25 1979-07-25 Method of plating thick film paste

Country Status (1)

Country Link
JP (1) JPS5938314B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000038685A (en) * 1998-06-27 2000-02-08 Micronas Intermetall Gmbh Method for coating substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61201413U (en) * 1985-06-04 1986-12-17

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000038685A (en) * 1998-06-27 2000-02-08 Micronas Intermetall Gmbh Method for coating substrate

Also Published As

Publication number Publication date
JPS5938314B2 (en) 1984-09-14

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