JPS6420696A - Manufacture of film carrier board - Google Patents

Manufacture of film carrier board

Info

Publication number
JPS6420696A
JPS6420696A JP17621787A JP17621787A JPS6420696A JP S6420696 A JPS6420696 A JP S6420696A JP 17621787 A JP17621787 A JP 17621787A JP 17621787 A JP17621787 A JP 17621787A JP S6420696 A JPS6420696 A JP S6420696A
Authority
JP
Japan
Prior art keywords
wiring
plating
terminal
board
insulating board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17621787A
Other languages
Japanese (ja)
Inventor
Takaaki Tsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP17621787A priority Critical patent/JPS6420696A/en
Publication of JPS6420696A publication Critical patent/JPS6420696A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To effectively use an insulating board surface, by electrically connecting a lead terminal patterned on the insulating board via a wiring for plating, and separating the wiring for plating from the insulating board after the plating process. CONSTITUTION:A copper film mounted on a flexible insulating film board 11 is patterned in the form of a lead wire 12 and a wiring for plating 14. Then, a plated layer is formed onto the surface of the terminal 12 via the wiring 14. After the plating, a slit 15 is made at a link between the terminal 12 and the wiring 14, and only copper film of the wiring 14 is separated from the board 11, thereby making the terminal 12 independent. According to the constitution, not only a lead terminal can be formed by effectively using the insulating board surface without forming punching holes but also an accurate electroplated layer can be formed on the surface of the lead terminal.
JP17621787A 1987-07-15 1987-07-15 Manufacture of film carrier board Pending JPS6420696A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17621787A JPS6420696A (en) 1987-07-15 1987-07-15 Manufacture of film carrier board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17621787A JPS6420696A (en) 1987-07-15 1987-07-15 Manufacture of film carrier board

Publications (1)

Publication Number Publication Date
JPS6420696A true JPS6420696A (en) 1989-01-24

Family

ID=16009670

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17621787A Pending JPS6420696A (en) 1987-07-15 1987-07-15 Manufacture of film carrier board

Country Status (1)

Country Link
JP (1) JPS6420696A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997026780A1 (en) * 1996-01-16 1997-07-24 Siemens Aktiengesellschaft Circuit-board substrate
JP2018098446A (en) * 2016-12-16 2018-06-21 コニカミノルタ株式会社 Touch panel sensor intermediate, and manufacturing method of touch panel sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997026780A1 (en) * 1996-01-16 1997-07-24 Siemens Aktiengesellschaft Circuit-board substrate
JP2018098446A (en) * 2016-12-16 2018-06-21 コニカミノルタ株式会社 Touch panel sensor intermediate, and manufacturing method of touch panel sensor

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