JPS6476747A - Semiconductor mounting board - Google Patents

Semiconductor mounting board

Info

Publication number
JPS6476747A
JPS6476747A JP23464387A JP23464387A JPS6476747A JP S6476747 A JPS6476747 A JP S6476747A JP 23464387 A JP23464387 A JP 23464387A JP 23464387 A JP23464387 A JP 23464387A JP S6476747 A JPS6476747 A JP S6476747A
Authority
JP
Japan
Prior art keywords
lead frame
conductor
circuit
circuit board
conductor circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23464387A
Other languages
Japanese (ja)
Other versions
JPH0445986B2 (en
Inventor
Sadahisa Furuhashi
Motoji Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP23464387A priority Critical patent/JPS6476747A/en
Publication of JPS6476747A publication Critical patent/JPS6476747A/en
Publication of JPH0445986B2 publication Critical patent/JPH0445986B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To enable surely and easily bonding, and simplify the conductor circuit on a circuit board, by providing the circuit board and a lead frame with through holes, in which conductor layers are formed, and directly connecting a part of the conductor circuit and a part of the lead frame. CONSTITUTION:In conductor circuit 12 and a lead frame 13 on a circuit board 11 are connected via a conductor layer 16 in each through hole 15. The lead frame 13 and each semiconductor element 20 are not directly electrically connected with bonding wires 21. Therefore, a semiconductor mounting board 10 is not plated with silver and the like, for bonding connection on the lead frame 13. As a result, disconnection and the like of the bonding wires due to deterioration of silver plating formed on the lead frame 13 side do not occur. When many semiconductor elements 20 are mounted, the high density formation of conductor circuit 12 is sufficiently enabled.
JP23464387A 1987-09-17 1987-09-17 Semiconductor mounting board Granted JPS6476747A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23464387A JPS6476747A (en) 1987-09-17 1987-09-17 Semiconductor mounting board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23464387A JPS6476747A (en) 1987-09-17 1987-09-17 Semiconductor mounting board

Publications (2)

Publication Number Publication Date
JPS6476747A true JPS6476747A (en) 1989-03-22
JPH0445986B2 JPH0445986B2 (en) 1992-07-28

Family

ID=16974239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23464387A Granted JPS6476747A (en) 1987-09-17 1987-09-17 Semiconductor mounting board

Country Status (1)

Country Link
JP (1) JPS6476747A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5022960A (en) * 1989-05-01 1991-06-11 Ibiden Co., Ltd. Method of manufacturing circuit board for mounting electronic components
US5371029A (en) * 1991-01-22 1994-12-06 National Semiconductor Corporation Process for making a leadless chip resistor capacitor carrier using thick and thin film printing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5022960A (en) * 1989-05-01 1991-06-11 Ibiden Co., Ltd. Method of manufacturing circuit board for mounting electronic components
US5088008A (en) * 1989-05-01 1992-02-11 Ibiden Co., Ltd. Circuit board for mounting electronic components
US5371029A (en) * 1991-01-22 1994-12-06 National Semiconductor Corporation Process for making a leadless chip resistor capacitor carrier using thick and thin film printing

Also Published As

Publication number Publication date
JPH0445986B2 (en) 1992-07-28

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