JPS5724102A - Microwave intergrated circuit - Google Patents

Microwave intergrated circuit

Info

Publication number
JPS5724102A
JPS5724102A JP9914480A JP9914480A JPS5724102A JP S5724102 A JPS5724102 A JP S5724102A JP 9914480 A JP9914480 A JP 9914480A JP 9914480 A JP9914480 A JP 9914480A JP S5724102 A JPS5724102 A JP S5724102A
Authority
JP
Japan
Prior art keywords
dielectric substance
substance body
substrate
metallic plate
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9914480A
Other languages
Japanese (ja)
Other versions
JPS6014521B2 (en
Inventor
Jun Miyata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP55099144A priority Critical patent/JPS6014521B2/en
Publication of JPS5724102A publication Critical patent/JPS5724102A/en
Publication of JPS6014521B2 publication Critical patent/JPS6014521B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Waveguides (AREA)

Abstract

PURPOSE:To make stiff the circuit mechanically and to simplify the manufacture, by making the substrate with a metallic plate and providing lines made of conductor and a dielectric substance layer on the surface. CONSTITUTION:After processing holes such as through-holes to a metallic plate 1 being the substrate, a dielectric substance body 2 is coated on the entire surface. As the dielectric substance body, electric characteristics such as dielectric constant can be selected with the 1st priority since no mechanical strength should be taken into account. After the dielectric substance body 2 is fixed, a conductive layer is formed with electroless plating. Unnecessary plating can be removed by etching. On the formed lines can be mounted for chip components with conductive adhesives.
JP55099144A 1980-07-18 1980-07-18 microwave integrated circuit Expired JPS6014521B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55099144A JPS6014521B2 (en) 1980-07-18 1980-07-18 microwave integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55099144A JPS6014521B2 (en) 1980-07-18 1980-07-18 microwave integrated circuit

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP3786486A Division JPS61228701A (en) 1986-02-21 1986-02-21 Manufacture of microwave integrated circuit

Publications (2)

Publication Number Publication Date
JPS5724102A true JPS5724102A (en) 1982-02-08
JPS6014521B2 JPS6014521B2 (en) 1985-04-13

Family

ID=14239499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55099144A Expired JPS6014521B2 (en) 1980-07-18 1980-07-18 microwave integrated circuit

Country Status (1)

Country Link
JP (1) JPS6014521B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6162428U (en) * 1984-09-27 1986-04-26

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
MICROWAVES=1979 *

Also Published As

Publication number Publication date
JPS6014521B2 (en) 1985-04-13

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